SPS烧结制备WC-6Co-1.5Al硬质合金的研究

针对WC-6Co-1.5Al球磨粉末,研究SPS烧结工艺对烧结合金密度、组织、力学性能及断口形貌的影响规律.研究结果表明：在脉冲电流基值为360A、峰值为3 000A、频率为50Hz、占空比为50%,恒流电流为1 500A,总烧结时长为6min,烧结压力为30MPa的工艺参数下,利用脉冲电流烧结1min后,继之以恒流电流烧结5min,可获得密度、硬度和弯曲强度分别达14.2g/cm3、94HRA和1 660MPa的超细晶WC-6Co-1.5Al硬质合金块体材料;进一步延长或缩短脉冲电流烧结时间,烧结体的密度、硬度和弯曲强度反而下降.     

温压用铁粉松装密度的优化粒级匹配试验研究

为提高温压用铁粉的流动性和松装密度，对典型粉末的粒度分布、流动性和松装密度进行了试验研究。结果表明，随温度的升高单一粒径粉体的流动性和松装密度均变差，而多粒级匹配粉末在120℃内基本保持不变，且粉体粒度分布对粉末的流动性和松装密度影响较大。通过正交试验优化了粉末的粒级匹配，获得了高松装密度的H1粉末，其流动性与国外粉W1相当，而松装密度比国外粉W1和国内粉N1分别提高了5．03％和8．99％。     

铁基粉末温模压制技术的研究

温压工艺是一种能以较低成本制备高密度铁基粉末冶金零部件的新技术，但该技术在工业化应用中，需要昂贵的设备投入及改造费用，限制了其大规模应用。论文作者利用具有优异室温润滑性能的润滑剂，以经过退火和未退火处理的雾化铁粉配制的、材质为Fe-2Ni-1.5Cu-0．5C的2种混合粉末为原料，研究制备高密度粉末冶金材料的常规压制和温模压制工艺。结果显示，粉末中较理想的润滑剂含量范围为0．1％～0．3％（质量分数），此时，润滑剂含量对压制效果影响不明显。在压制压力为763MPa、模具温度为100℃的条件下，含0．1％润滑剂的2种粉末压坯密度分别达到7．50g／cm^3和7．43g／cm^3，对应的脱模压力为34MPa和42MPa，与传统温压效果相接近，而采用传统的室温压制也可以获得7．36g／cm^3的压坯密度。     

WTO法在中国国内的法律适用问题

从条约法的角度,通过对条约法在国内适用的理论与实践分析,结合WTO法的一些特性,并参考其他WTO成员方的作法,对WTO法在中国国内的适用问题提出了几点建议.     

激光诱导瞬态吸收光谱研究TMB光致电子转移

TMB(N，N．N’，N’-四甲基联苯胺)的气相电离能很低(6．1—6．8eV)，在有机溶剂中很容易被光电离而生成阳离子自由基。此外，激发态TMB还能被氧化性强的物质氧化而失去电子。本工作利用时间分辨激光诱导瞬态吸收光谱装置，以一台Nd：YAG激光器三倍频后的355nm激光作为激发光源，详细研究了TMB和五种缺电子烯反丁烯二腈(Fumaronitrile，FN)、反丁烯二酸二甲酯(Dimethyl fumarate，DMF)、     

粘结剂处理的铁基混合粉的温压特性

研究的目标是结合粉末粘结技术和温压技术以制备高质量、高性能的粉末冶金材料。预粘结粉末的一大优点是能有效地降低成分偏析，因此在混粉过程中应尽量避免偏聚。本文采用两种混粉工艺制备预粘结铁基混合粉，通过不同的压制压力、不同的粘结剂含量以常温压制和温压压制制备出铁基粉末冶金材料，测量其压坯密度并进行比较分析。研究结果表明，不同预粘结工艺、压制温度和粘结剂含量对压坯密度影响很大。在一定的粘结剂含量范围内，生坯密度随粘结剂含量增加而呈线性减少。不同的预粘结工艺对生坯密度的影响随着粘结剂含量的增加而增大。     

Void formation and cracking of Zr<Superscript>41</Superscript>Ti<Superscript>14</Superscript>Cu<Superscript>12.5</Superscript>- Ni<Superscript>10</Superscript>Be<Superscript>22.5</Superscript> bulk metallic glass under planar shock compression

Planar shock compression effects on void formation and cracking in Zr⁴¹Ti¹⁴Cu^12.5Ni¹⁰Be^22.5 bulk metallic glass (BMG) are studied in this paper. Cracking was found to be a result of void linkage in some direction deviation from the maximum shear stress plane. Changing the state of the stress inside the BMG sample led to formation of different void distribution. Nucleation of the microvoids was possibly initiated by release of excess free volume under shock wave compression.     

Inside Front Cover: Self‐Assembly of SiO2 Nanowires and Si Microwires into Hierarchical Heterostructures on a Large Scale (Adv. Mater. 8/2005)

The inside cover shows a scanning electron micrograph of a novel hierarchical heterostructures, as reported by Hu and co‐workers on p. 971. The heterostructures are formed from Si core microwires covered by dense, aligned SiO₂ nanowires, thus forming multiple junctions to the cores. The inset shows a schematic of the Sn‐catalyzed vapor–liquid–solid growth mechanism. These materials are envisaged to become important for optical fibers, low‐dimensional waveguides, scanning near‐field optical microscopes and high‐bandwidth optical signal processing devices.     

Inside Front Cover: Self‐Assembled Highly Faceted Wurtzite‐Type ZnS Single‐Crystalline Nanotubes with Hexagonal Cross‐Sections (Adv. Mater. 16/2005)

Highly faceted wurtzite‐type ZnS nanotubes with hexagonal cross‐section morphologies have been self‐assembled via a controllable high‐temperature thermal‐chemical reaction route in work reported by Yin and co‐workers on p. 1972. The self‐assembly growth along c‐axis to highly hexagonal‐faceted ZnS single‐crystalline nanotubes is associated with the crystallographic characteristics, such as the non‐central and polar surfaces of the wurtzite‐type ZnS structure. The faceted ZnS nanotubes grow along the <0001> direction, and are closed by low‐index faces of non‐polar {1000} faces. The inside cover and insets show electron microscopy and scanning electron microscopy images of the faceted ZnS nanotubes.