TNT-RDX混合废水处理的实验研究——生物-吸附法

介绍了在２５￣３５℃的温度下，用厌氧－兼氧－水生生物－吸附组合工艺处理ＴＮＴ和ＲＤＸ混合废水的方法，进行了日处理量为６０￣９００Ｌ的实验室放大实验。当ＴＮＴ和ＲＤＸ混合废水总浓度为４￣１２ｍｇ／Ｌ时，经过该工艺处理后可达到国家排放标准。其中厌氧－兼氧能去除废水中８０％以上的ＴＮＴ和ＲＤＸ，水生生物（水葫芦）对ＴＮＴ及ＲＤＸ也有一定的降解效果，最后用活性炭吸附可以实现深度处理。     

反常声电光频谱分析器

介绍了一种新型的反常声电光频谱分析器，它可以采用外加电压的办法改变器件的中心频率，扩大器件的频带宽度，并改善器件在频带宽度范围内的频率响应特性。用ＬｉＮｂＯ３制作了一个６０ＭＨｚ的反常声电光频谱分析器件，测试结果表明，器件中心频率可以由５０ＭＨｚ变到７０ＭＨｚ，频带宽度由原来的２６ＭＨｚ扩大到３７ＭＨｚ。     

Si_（1－x）Ge_x／Si定向耦合器的研制

在运用ＳｉＧｅ脊形波导单模条件和有效折射率法分析ＳｉＧｅ／Ｓｉ定向耦合器结构参数的基础上，采用分子束外延和各向异性腐蚀技术制备出Ｓｉ１－ｘＧｅｘ／Ｓｉ（ｘ＝０．０５）单模定向耦合器．在波长为１．３μｍ时，平均串音小于－１８．１ｄＢ，输出功率耦合效率达到９８．１％     

G.652光纤上的2.5Gbit／s色散受限系统

本文根据色散受限中继段长度的计算，对实际工程中１５５０ｎｍ波长２．５Ｇｂｉｔ／ｓ系统进行计算比较得出啁啾声引起的色散不容忽视，它使２．５Ｇｂｉｔ／ｓ成为色散受限系统。对１３１０ｎｍ波长６２２Ｍｂｉｔ／ｓ系统，当使用多纵模激光器时，往往也会成为色散受限系统。     

A Novel Athermal 40-Channel DWDM Multi/Demultiplexer Based on the Combination of AWGs and Interleaver

An athermal 40-channel dense wavelength-division-multiplexing multi/demultiplexer using a novel combination technology is proposed. It consists of one 1times4 100- to 400-GHz spacing interleaver filter and four sub-arrayed-waveguide gratings (AWGs). The temperature-dependent wavelength shift of the combined device is successfully suppressed to 0.058 nm in the -20degC to 70degC temperature range. Moreover, the combined device's adjacent crosstalk (typically -35 dB) is much better than conventional AWGs (typically -25 dB).     

Reliability Analysis on the δ-Shock Model of Complex Systems

We investigate the delta-shock model of complex systems consisting of n i.i.d. components. We first obtain a general lifetime distribution for the delta-shock model of a general complex system by reducing the system to a linear combination of parallel systems. We then consider coherent system structures including series, parallel, and k-out-of-n, then derive some useful results including reliability bounds, bounds on the mean lifetime, limiting distributions, and Laplace-Stieltes transforms     

中压变频器在宣钢炼钢厂除尘风机中的应用

本文介绍了SIMOVERT MV中压变频器在宣钢炼钢厂一次除尘风机中的应用情况。变频器现场运行表明，采用中压变频器对转炉除尘风机进行调速节能获得了成功，节能效果明显。     

Impact of temperature cycle profile on fatigue life of solder joints

In this paper the influence of the temperature cycle time history profile on the fatigue life of ball grid array (BGA) solder joints is studied. Temperature time history in a Pentium processor laptop computer was measured for a three-month period by means of thermocouples placed inside the computer. In addition, Pentium BGA packages were subjected to industry standard temperature cycles and also to in-situ measured temperature cycle profiles. Inelastic strain accumulation in each solder joint during thermal cycling was measured by high sensitivity Moire interferometry technique. Results indicate that fatigue life of the solder joint is not independent of the temperature cycle profile used. Industry standard temperature cycle profile leads to conservative fatigue life observations by underestimating the actual number of cycles to failure.