噻吩在镍基非晶态合金上的吸附和脱附

应用静态吸附、动态吸附、程序升温脱附和程序升温还原等实验方法，考察了噻吩在Ni基非晶态合金上的吸附和脱附行为。常温下，噻吩分子首先吸附在清洁的Ni表面，并立刻被活化，发生氢解反应，C-S键断裂，释放出烃类部分，S留在Ni原子上。噻吩可以在Ni基非晶态合金表面发生强度不同的化学吸附。弱化学吸附的噻吩可以脱附；强化学吸附的噻吩不会脱附，而在高温下发生氢解反应。     

Exposed Die-Top Encapsulation Molding for an Improved High- Performance Flip Chip BGA Package

The recent advancement in high- performance semiconductor packages has been driven by the need for higher pin count and superior heat dissipation. A one-piece cavity lid flip chip ball grid array (BGA) package with high pin count and targeted reliability has emerged as a popular choice. The flip chip technology can accommodate an I/O count of more than five hundreds500, and the die junction temperature can be reduced to a minimum level by a metal heat spreader attachment. None the less, greater expectations on these high-performance packages arose such as better substrate real estate utilization for multiple chips, ease in handling for thinner core substrates, and improved board- level solder joint reliability. A new design of the flip chip BGA package has been looked into for meeting such requirements. By encapsulating the flip chip with molding compound leaving the die top exposed, a planar top surface can be formed. A, and a flat lid can then be mounted on the planar mold/die top surface. In this manner the direct interaction of the metal lid with the substrate can be removed. The new package is thus less rigid under thermal loading and solder joint reliability enhancement is expected. This paper discusses the process development of the new package and its advantages for improved solder joint fatigue life, and being a multichip package and thin core substrate options. Finite-element simulations have been employed for the study of its structural integrity, thermal, and electrical performances. Detailed package and board-level reliability test results will also be reported     

Numerical Study of Finite Element Method Based Solutions for Propagation of Wetting Fronts in Unsaturated Soil

The accurate prediction of the propagation of a wetting front in an unsaturated soil subjected to surficial infiltration is of practical importance to many geotechnical and geoenvironmental problems. The finite element method is the most common solution technique as the hydraulic soil properties are highly nonlinear. Two important issues are often found to create difficulties in such analyses. First, numerical oscillations are usually observed in the calculated pore pressures at the wetting front. Second, when a reasonable mesh size and time step are used, the elevation of the wetting front may be seriously overpredicted. This paper is focused on the second issue. The under-relaxation (UR) technique used in the iterative process within each time step is found to have a serious impact on rate of convergence with refinement in mesh size and time step. Two different techniques are typically used; the first evaluates the hydraulic conductivity using an average of heads calculated from the preceding time node and the most recent iteration of the current time node (UR1), and the second evaluates the hydraulic conductivity using the average of heads calculated from the two most recent iterations of the current time nodes (UR2). The study shows that UR1, which is adopted in programs such as SEEP/W, ensures that the solution converges rapidly to a stable solution within a time step, but may converge to the wrong wetting front at a given elapsed time unless a sufficiently refined mesh is used. UR2 converges much more slowly within a time step, but the error in the wetting front is smaller than that generated by UR1.     

环境保护地理信息系统的设计

本文主要介绍基于计算机网络的通用型环境保护地理信息系统的功能和实现方法。     

Delay-dependent state estimation for delayed neural networks

In this letter, the delay-dependent state estimation problem for neural networks with time-varying delay is investigated. A delay-dependent criterion is established to estimate the neuron states through available output measurements such that the dynamics of the estimation error is globally exponentially stable. The proposed method is based on the free-weighting matrix approach and is applicable to the case that the derivative of a time-varying delay takes any value. An algorithm is presented to compute the state estimator. Finally, a numerical example is given to demonstrate the effectiveness of this approach and the improvement over existing ones.     

JOINING MECHANISMS OF β''''-Al2O3 CERAMIC AND PYREX GLASS TO Al MATRIX COMPOSITE

The bonding of β'-Al2O3 and pyrex glass to Al matrix composites by anodic bonding process is achieved. The microstructure of the bonded interface and the joining mechanisms are analyzed with scanning electron microscope (SEM), energy dispersive X-ray fluorescence spectrometer (EDX). It is observed that the bonding region across the interface consists of the metal layer, oxide transitional layer and the ceramic layer, with the transitional layer composed of surface region and sub-surface region. The bonding process can mainly be categorized into anodic bonding process and solid state diffusing process. The pile-up of the ions and its drift in the interface area are the main reasons for anode oxidation and joining of the interface. The temperature, voltage and the drift ions in the ceramic or glass during the bonding process are the essential conditions to solid state diffusing and oxide bonding at the interface. The voltages, temperature, pressure as well as the surface state are the main factors that influence the anodic bonding.     

兰州重离子加速器大型真空室

已建成的兰州重离子加速器的真空室是一个大型整体结构的超高真空容器,直径约10m,高4.5m,重65000kg,内表面积211m~2,容积100m~3,工作真空度为5×10~(-5)Pa。采用有限单元法在计算机上用SAP-5C程序对真空室受力分析进行了计算。真空室结构材料选用瑞典Uddeholm钢厂生产的316 L 超低碳不锈钢。承制此大型容器的是航天工业部风华机器厂。由于结构庞大,首先将真空室分成八大块和几小块在工厂制造,然后运至现场焊制成一整体容器并进行机械加工。所有密封焊缝均用着色渗透液,X-射线探伤和氦质谱探漏仪进行检查和探漏。     

试论QC小组活动与企业文化建设相结合

本文分析了QC小组活动与企业文化的特点与共同点,提出开展QC小组活动与企业文化建设是互相促进,互相补充的,两者可以互相结合。     

Dielectric and piezoelectric properties of Pb(Ni1/3Nb2/3)O3–PbTiO3–PbZrO3 ceramics modified with bismuth and zinc substitutions

The dielectric and piezoelectric properties of the (Pb_0.985Bi_0.01)(Ni_1/4Zn_1/12Nb_2/3)_x- (Zr_σTi_1-σ)_1-xO₃ piezoelectric ceramic system (0.2 ≤ x ≤ 0.7, 0.1 ≤ σ ≤ 0.9) were systematically investigated. The results showed that, after poling, the dielectric constant, ε ₃₃ ^T , increased for the tetragonal compositions but decreased for the rhombohedral compositions. Furthermore, high values of ε ₃₃ ^T and piezoelectric modulus, d ₃₁ were found for the compositions along the extension of the morphotropic phase boundary. The highest values of the planar electromechanical coupling factor, K _p, and the piezoelectric modulus, d ₃₁, were found to be 0.70 and − 274 × 10^-12 C N^-1, respectively. The Curie temperature, remanent polarization, coercive field and the lattice constants of the a and c axes in relation to the Pb(Ni_1/3Nb_2/3)O₃ content and the Zr/Zr + Ti ratio were also determined. This revised version was published online in November 2006 with corrections to the Cover Date.