一种基于CMOS工艺的差分低噪声放大器设计

研究低噪声放大器(LNA)的结构以及性能参数,采用电路仿真软件ADS(Advanced Design System)设计一个基于台积电(TSMC)0.25μmCMOS工艺的2.5GHz差分低噪声放大器。通过在输出端增加共源极的优化方法,对其进行电路结构的改进,得到一个高性能的实用低噪声放大器,并利用版图软件CadenceVirtuoso对其实现版图设计。     

3C—SiC单晶薄膜的干法刻蚀研究

以四氟化碳（CF4）和CF4 O2作为刻蚀气体,对外延3C-SiC单晶薄膜进行了系统的等离子体刻蚀研究。结果表明薄膜刻蚀速率在气体流量一定的情况下与O2/CF4流量比有关：当O2/CF4流量比为40%左右时,刻蚀速率达到量大值;O2/CF4流量比低于40%,不仅刻蚀速度降低而且还在被刻蚀样品表面形成暗表面层,俄歇能谱（AES）分析表明暗层为富C表面的的残余SiC,AES分析还证实改变工艺条件可以消除富C表面的文中还给出了经图形刻蚀后的样品的表面形貌（SEM）照片。     

雪崩PIN二极管中的电流丝运动

The motion of current filaments in avalanching PIN diodes has been investigated in this paper by 2D transient numerical simulations.The simulation results show that the filament can move along the length of the PIN diode back and forth when the self-heating effect is considered.The voltage waveform varies periodically due to the motion of the filament.The filament motion is driven by the temperature gradient in the filament due to the negative temperature dependence of the impact ionization rates.Contrary to the traditional understanding that current filamentation is a potential cause of thermal destruction,it is shown in this paper that the thermally-driven motion of current filaments leads to the homogenization of temperature in the diode and is expected to have a positive influence on the failure threshold of the PIN diode.     

基于Verilog-A的容栅传感器建模与仿真

介绍了容栅传感器结构及其工作原理,并针对容栅传感器应用系统设计验证中所遇到的困难,采用模拟硬件描述语言Verilog-A对其行为进行高层次建模,通过理论推导传感器信号与物理位移的关系和CadenceSpectre仿真器的验证,该模型正确又易于系统验证。