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61.
The effect of δ-doping and modulation-doping on Si-doped high Al content n-AlxGa1-xN grown by MOCVD 总被引:1,自引:1,他引:0
The effect of periodic delta-doping and modulation-doping on high Al content n-AlxGa1-xN(x = 0.55) epilayers grown by MOCVD has been investigated.Measured by XRD,AFM,contactless sheet resistance, and Hall-effect tests,δ-doped and modulation-doped n-AlxGa1-xN have better crystal quality,surface morphology and electrical properties as compared with uniformly-doped n-AlxGa1-xN.These improvements are attributed to the SiNx growth mask induced by 5-doping layers and the dislocation-blocking effect induced by both growth techniques.In addition,due to the broadened doping profile ascribed to enhanced dopant diffusion at high growth temperatures(1150℃) of n-Al0.55Ga0.45N,modulation-doped n-Al0.55Ga0.45N has similar properties asδ-doped n-Al0.55Ga0.45N. 相似文献
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InAlN epilayers were grown on high quality GaN and A1N templates with the same growth parameters. Measurement results showed that two samples had the same In content of~16%,while the crystal quality and surface topography of the InAlN epilayer grown on the AlN template,with 282.3"(002) full width at half maximum (FWHM) of rocking curve,313.5"(102) FWHM,surface roughness of 0.39 nm and V-pit density of 2.8×108 cm-2,were better than that of the InAlN epilayer grown on the GaN template,309.3",339.1",0.593 nm and 4.2×108 cm-2.A primary conclusion was proposed that both the crystal quality and the surface topography of the InAlN epilayer grown on the AlN template were better than that of the InAlN epilayer grown on the GaN template. Therefore,the AlN template was a better choice than the GaN template for getting high quality InAlN epilayers. 相似文献
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用MOCVD技术在50mm蓝宝石衬底(0001)面上生长了GaN∶Mg外延膜,对样品进行热退火处理并作了Hall、双晶X射线衍射(DCXRD)和室温光致发光谱(PL)测试.Hall测试结果表明,950℃退火后空穴浓度达到5×1017cm-3以上,电阻率降到2.5Ω·cm;(0002)面DCXRD测试发现样品退火前、后的半峰宽均约为4′;室温PL谱中发光峰位于2.85eV处,退火后峰的强度比退火前增强了8倍以上,表明样品中大量被H钝化的受主Mg原子在退火后被激活. 相似文献
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可用于Ⅲ族氮化物生长的50mm 3C-SiC/Si(111)衬底的制备 总被引:1,自引:0,他引:1
利用新研制出的垂直式低压CVD(L PCVD) Si C生长系统,获得了高质量的5 0 mm 3C- Si C/ Si(111)衬底材料.系统研究了3C- Si C的n型和p型原位掺杂技术,获得了生长速率和表面形貌对反应气体中Si H4 流量和C/ Si原子比率的依赖关系.利用Hall测试技术、非接触式方块电阻测试方法和SIMS,分别研究了3C- Si C的电学特性、均匀性和故意调制掺杂的N浓度纵向分布.利用MBE方法,在原生长的5 0 mm 3C- Si C/ Si(111)衬底上进行了Ga N的外延生长,并研究了Ga N材料的表面、结构和光学特性.结果表明3C- Si C是一种适合于高质量无裂纹Ga N外延生长的衬底或缓冲材料. 相似文献
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简要回顾了 Al Ga N/Ga N HEMT器件电流崩塌效应研究的进展 ,着重阐述了虚栅模型、应力模型等几种解释电流崩塌效应形成机理的模型和器件钝化、生长盖帽层等减小电流崩塌效应的措施。 相似文献
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使用气相沉积SiO2和普通光刻以及湿法腐蚀方法,在C面蓝宝石上开出不同尺寸的正方形窗口,在窗口区域中露出衬底,然后使用氢化物气相外延(HVPE)方法选区外延GaN薄膜.采用光学显微镜、原子力显微镜(AFM)、扫描电子显微镜(SEM)、高分辨率双晶X射线衍射(DCXRD)和喇曼谱测试(Raman shift)对薄膜进行分析.结果表明,在C面蓝宝石衬底上独立的正方形窗口区域中外延生长的,厚度约20μm的GaN薄膜,当窗口面积为100μm×100μm时,GaN表面无裂纹;而当窗口面积为300μm×300μm和500μm×500μm时,GaN表面有裂纹.随着窗口面积的减小,GaN双晶衍射摇摆曲线的(0002)峰的半高宽(FWHM)减小,表明晶体的质量更好,最小的半高宽为530".从正方形窗口区的角上到边缘再到中心,GaN的面内压应力逐渐减小,分析认为这与OaN横向外延区(ELO区)与SiO2掩膜之间的相互作用,以及窗口区到ELO区的线位错的90"扭转有关. 相似文献
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We report a selective area growth (SAG) method to define the p-GaN gate of AlGaN/GaN high electron mobility transistors (HEMTs) by metal-organic chemical vapor deposition. Compared with Schottky gate HEMTs, the SAG p-GaN gate HEMTs show more positive threshold voltage (Vth) and better gate control ability. The influence of Cp2Mg flux of SAG p-GaN gate on the AlGaN/GaN HEMTs has also been studied. With the increasing Cp2Mg from 0.16 μmol/min to 0.20 μmol/min, the Vth raises from -67 V to -37 V. The maximum transconductance of the SAG HEMT at a drain voltage of 10 V is 113.9 mS/mm while that value of the Schottky HEMT is 51.6 mS/mm. The SAG method paves a promising way for achieving p-GaN gate normally-off AlGaN/GaN HEMTs without dry etching damage. 相似文献