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Ge2Sb2Te5材料与非挥发相转变存储器单元器件特性 总被引:1,自引:0,他引:1
对Ge2Sb2Te5材料的结构、形貌和电学特性进行了表征,将材料应用于不挥发存储单元器件中并研究了器件性能。研究了退火温度对薄膜电阻率的影响,发现在从高阻向低阻状态转变的过程中,电阻率下降的趋势发生变化,形成拐点,分析表明这是由于在拐点处结构由面心立方向密排六方结构转变所致;对不同厚度Ge2Sb2Te5薄膜的电阻率进行了分析,结果表明当厚度薄于70nm时,电阻率随厚度显著上升而迁移率下降,材料晶态电学性能的测量显示,材料有正电阻温度系数并以空穴导电;测量了Ge2Sb2Fe5非挥发相转变存储器单元的I-V曲线,发现有阈值特性,在晶态时电学特性呈欧姆特性,非晶态时I-V低场为线性关系,电场较高时呈指数关系。 相似文献
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Both sputtering conditions and crystallizing temperatures have great influence on the microstructures and phase transformation characteristics for TislNi44Cus. By means of the resistance-temperature measurement, X-ray diffraction and atomic fore microscopic study, the results indicate that the transformation temperatures of the thin films increase and the “rock candy“ martensitic relief is more easily obtained with promoting the sputtering Ar pressure, sputtering power, orcrystallizing temperature. However, when sputtering Ar pressure, sputtering power, or crystallizing temperature are lower, a kind of “chrysanthemum“ relief, which is related with Ti-rich GP zones, is much easier to be observed. The reason is that during crystallization process, both of the inherent compressive stresses introduced under the condition of higher sputteringpressure or higher crystallizing temperature are helpful to the transition from GP zones to Ti2(NiCu) precipitates and the increase of the transformation temperatures. The addition of copper to substitute for 5 96 nickel in mole fraction can reduce the transformation hvsteresis width to about 10 - 15 ℃. 相似文献
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概述了软磁层偏置磁阻磁头的工作原理和特点 ,采用传输线模型对其工作点的选取和结构参数进行了初步设计 ,与实验结果符合较好 相似文献
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研究了原位加热溅射的NiTi形状记忆合金薄膜的结构,讨论了制备工艺及织构对薄膜相变特征的影响,采用电阻法及X射线衍射分析了薄膜的结构及相变过程,确定了最适合于微器件的溅射工艺。结果发现:溅射时采用原位加热可直接获得具有织构的晶化薄膜,提高溅射功率将使薄膜的相变温度升高。 相似文献
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