Capacity-achieving codes for finite-state channels with maximum-likelihood decoding

Codes on sparse graphs have been shown to achieve remarkable performance in point-to-point channels with low decoding complexity. Most of the results in this area are based on experimental evidence and/or approximate analysis. The question of whether codes on sparse graphs can achieve the capacity of noisy channels with iterative decoding is still open, and has only been conclusively and positively answered for the binary erasure channel. On the other hand, codes on sparse graphs have been proven to achieve the capacity of memoryless, binary-input, output-symmetric channels with finite graphical complexity per information bit when maximum likelihood (ML) decoding is performed. In this paper, we consider transmission over finite-state channels (FSCs). We derive upper bounds on the average error probability of code ensembles with ML decoding. Based on these bounds we show that codes on sparse graphs can achieve the symmetric information rate (SIR) of FSCs, which is the maximum achievable rate with independently and uniformly distributed input sequences. In order to achieve rates beyond the SIR, we consider a simple quantization scheme that when applied to ensembles of codes on sparse graphs induces a Markov distribution on the transmitted sequence. By deriving average error probability bounds for these quantized code ensembles, we prove that they can achieve the information rates corresponding to the induced Markov distribution, and thus approach the FSC capacity.     

Predicting the Lifespan and Retweet Times of Tweets Based on Multiple Feature Analysis

In social network services, such as Facebook, Google+, Twitter, and certain postings attract more people than others. In this paper, we propose a novel method for predicting the lifespan and retweet times of tweets, the latter being a proxy for measuring the popularity of a tweet. We extract information from retweet graphs, such as posting times; and social, local, and content features, so as to construct prediction knowledge bases. Tweets with a similar topic, retweet pattern, and properties are sequentially extracted from the knowledge base and then used to make a prediction. To evaluate the performance of our model, we collected tweets on Twitter from June 2012 to October 2012. We compared our model with conventional models according to the prediction goal. For the lifespan prediction of a tweet, our model can reduce the time tolerance of a tweet lifespan by about four hours, compared with conventional models. In terms of prediction of the retweet times, our model achieved a significantly outstanding precision of about 50%, which is much higher than two of the conventional models showing a precision of around 30% and 20%, respectively.     

Grating lobe reduction in ultrasonic synthetic focusing

Two novel schemes of data acquisition in synthetic aperture ultrasonic imaging systems using a linear array transducer are presented to solve the troublesome grating lobe problem. Simulation and experimental results show that in both schemes the grating lobes are significantly reduced without appreciable degradation of the main lobe characteristics.<>     

Analysis of a Parasitic‐Diode‐Triggered Electrostatic Discharge Protection Circuit for 12 V Applications

In this paper, an electrostatic discharge (ESD) protection circuit is designed for use as a 12 V power clamp by using a parasitic‐diode‐triggered silicon controlled rectifier. The breakdown voltage and trigger voltage (V_t) of the proposed ESD protection circuit are improved by varying the length between the n‐well and the p‐well, and by adding n+/p+ floating regions. Moreover, the holding voltage (V_h) is improved by using segmented technology. The proposed circuit was fabricated using a 0.18‐μm bipolar‐CMOS‐DMOS process with a width of 100 μm. The electrical characteristics and robustness of the proposed ESD circuit were analyzed using transmission line pulse measurements and an ESD pulse generator. The electrical characteristics of the proposed circuit were also analyzed at high temperature (300 K to 500 K) to verify thermal performance. After optimization, the V_t of the proposed circuit increased from 14 V to 27.8 V, and V_h increased from 5.3 V to 13.6 V. The proposed circuit exhibited good robustness characteristics, enduring human‐body‐model surges at 7.4 kV and machine‐model surges at 450 V.     

Mechanical bending of flexible complementary inverters based on organic and oxide thin film transistors

Flexible complementary inverters composed of p-channel pentacene thin-film transistors (TFTs) and n-channel amorphous indium gallium zinc oxide TFTs were fabricated on polymer substrates. The characteristics of the TFTs and inverters were evaluated at different bending radii. Throughout the bending experiments, the relationship between the performances of the inverters and the characteristics of the TFTs under mechanical deformation was analyzed. The mechanically applied strain led to a change in the voltage transfer characteristics of the complementary inverters, as well as the source–drain saturation current, field-effect mobility and threshold voltage of the TFTs. The switching threshold voltage of the fabricated inverters decreased with decreasing bending radius, which was related to changes in the field-effect mobility and the threshold voltage of the TFTs.     

A new approach to cell size scaling with a multi-dual cell and a buffer/background programming of unified RAM

New investigations are presented here on a high-density and DRAM-like high-speed non-volatile memory (NVM) application of unified RAM (URAM). For a high-density application of URAM, multiple data storage is demonstrated with a multi-dual cell (MDC). Because each NVM state can be split by programming with a one-transistor (1T) DRAM without a capacitor, the total number of memory states can be doubled. Furthermore, a high-speed DRAM-level NVM scheme is proposed for the joint operation of 1T DRAM buffer programming and NVM post-background programming. The MDC and the proposed scheme are unique URAM properties that can extend the application range of memory devices.     

Pixel‐Structured Scintillator with Polymeric Microstructures for X‐Ray Image Sensors

We introduce a pixel‐structured scintillator realized on a flexible polymeric substrate and demonstrate its feasibility as an X‐ray converter when it is coupled to photosensitive elements. The sample was prepared by filling Gd₂O₂S:Tb scintillation material into a square‐pore‐shape cavity array fabricated with polyethylene. For comparison, a sample with the conventional continuous geometry was also prepared. Although the pixelated geometry showed X‐ray sensitivity of about 58% compared with the conventional geometry, the resolving power was improved by about 70% above a spatial frequency of 3 mm^?1. The spatial frequency at 10% of the modulation‐transfer function was about 6 mm^?1.     

A Three-Dimensional Stacked-Chip Star-Wiring Interconnection for a Digital Noise-Free and Low-Jitter I/O Clock Distribution Network

Cascaded repeaters are indispensable circuit elements in conventional on-chip clock distribution networks due to heavy loss characteristics of on-chip global interconnections. However, cascaded repeaters cause significant jitter and skew problems in clock distribution networks when they are affected by power supply switching noise generated by digital logic blocks located on the same die. In this letter, we present a new three-dimensional (3-D) stacked-chip star-wiring interconnection scheme to make a clock distribution network free from both on-chip and package-level power supply noise coupling. The proposed clock distribution scheme provides an extremely low-jitter and low-skew clock signal by replacing the cascaded repeaters with lossless star-wiring interconnections on a 3-D stacked-chip package. We have demonstrated a 500-MHz input/output (I/O) clock delivery with 34-ps peak-to-peak jitter and a skew of 11ps, while a conventional I/O clock scheme exhibited a 146-ps peak-to-peak jitter and a 177-ps skew in the same power supply noise environment     

Characterization of Fluxing and Hybrid Underfills with Micro‐encapsulated Catalyst for Long Pot Life

For the fine‐pitch application of flip‐chip bonding with semiconductor packaging, fluxing and hybrid underfills were developed. A micro‐encapsulated catalyst was adopted to control the chemical reaction at room and processing temperatures. From the experiments with a differential scanning calorimetry and viscometer, the chemical reaction and viscosity changes were quantitatively characterized, and the optimum type and amount of micro‐encapsulated catalyst were determined to obtain the best pot life from a commercial viewpoint. It is expected that fluxing and hybrid underfills will be applied to fine‐pitch flip‐chip bonding processes and be highly reliable.