Effect of platelet-activating factor on the electrophysiology of the human Fallopian tube: early mediation of embryo-maternal dialogue?

Platelet-activating factor (PAF) is produced by preimplantation embryos and may be involved in the earliest stages of embryo-maternal dialogue. This study explored the potential effects of PAF acting as a signalling agent on human Fallopian tubal epithelial cells grown as a polarized layer in primary culture. The response of the tubal epithelium was assessed in terms of the transepithelial potential difference and short-circuit current (I(scc)), which were recorded using a modified Ussing chamber. Resistance was calculated from the measurements of potential difference and I(scc). PAF (1.9 nmol to 1.9 micromol l(-1)) administered to the apical surface of the cells produced a marked, transient increase in both potential difference and I(scc) in a dose-dependent manner. The mode of action of PAF on the electrophysiological responses of human tubal epithelial cells was investigated. Blockers of Na(+), K(+) and voltage-operated Ca(2+) channels had little effect on PAF action. However, incubation of the epithelial cells in Cl(-)free medium or with a blocker of the Na(+)-K(+)-2Cl(-) cotransporter (Furosemide) reduced the effect of PAF. Blockade of chloride-bicarbonate channels with 4-acetamido-4'-iso-thiocyanostilbene-2.2'-disulphonic acid (SITS) reduced the effect of low doses of PAF only. These results indicate that PAF influences the movement of chloride ions across the tubal epithelial cell and is a candidate molecule for initial embryo-maternal dialogue.     

A dielectrophoretic chip packaged at wafer level

The paper presents a dielectrophoretic chip, fully enclosed, with bulk silicon electrodes fabricated using wafer-to-wafer bonding techniques and packaged at the wafer level. The silicon electrodes, which are bonded to two glass dies, define in the same time the walls of the microfluidic channel. The device is fabricated from a silicon wafer that is bonded (at wafer level) anodically and using SU8 photoresist between two glass wafers. The first glass die includes drilled holes for inlet/outlet connections while the second glass die assure the electrical connections, through via holes and a metallization layer, between the silicon electrodes and a printing circuit board.     

Defect-free wet etching through pyrex glass using Cr/Au mask

This paper reports the highest etch depth of annealed Pyrex glass achieved by wet etching in highly concentrated HF solution, using a low stress chromium–gold with assistance of photoresist as masking layer. The strategies to achieve that are: increasing the etch rate of glass and simultaneously increasing the resistance of Cr/Au mask in the etchant. By annealing the Pyrex glass and using a highly concentrated HF acid, a high etch rate can be obtained. Furthermore, a method to achieve a good resistance of the Cr/Au masking layer in the etching solution is to control the residual stress and to increase the thickness of Au deposition up to 1 μm. In addition, the presence of a hard baked photoresist can improve the etching performance. As a result, a 500-μm thick Pyrex glass wafer was etched through.

     

A modified Chi2 algorithm for discretization

Since the ChiMerge algorithm was first proposed by Kerber (1992), it has become a widely used and discussed discretization method. The Chi2 algorithm is a modification to the ChiMerge method. It automates the discretization process by introducing an inconsistency rate as the stopping criterion and it automatically selects the significance value. In addition, it adds a finer phase aimed at feature selection to broaden the applications of the ChiMerge algorithm. However, the Chi2 algorithm does not consider the inaccuracy inherent in ChiMerge's merging criterion. The user-defined inconsistency rate also brings about inaccuracy to the discretization process. These two drawbacks are first discussed in this paper and modifications to overcome them are then proposed. By comparison, results with the original Chi2 algorithm using C4.5, the modified Chi2 algorithm, performs better than the original Chi2 algorithm. It becomes a completely automatic discretization method     

ε-Descending Support Vector Machines for Financial Time Series Forecasting

This paper proposes a modified version of support vector machines (SVMs), called ε-descending support vector machines (ε-DSVMs), to model non-stationary financial time series. The ε-DSVMs are obtained by incorporating the problem domain knowledge – non-stationarity of financial time series into SVMs. Unlike the standard SVMs which use a constant tube in all the training data points, the ε-DSVMs use an adaptive tube to deal with the structure changes in the data. The experiment shows that the ε-DSVMs generalize better than the standard SVMs in forecasting non-stationary financial time series. Another advantage of this modification is that the ε-DSVMs converge to fewer support vectors, resulting in a sparser representation of the solution. This revised version was published online in June 2006 with corrections to the Cover Date.     

The resistance of an infinite slab with a disc electrode as a mixed boundary value problem

We consider the resistance of an infinite slab of material with a disc contact source on one side and with current collected over the entire back plane. By imposing the boundary condition of a constant potential over the source region, the problem becomes one of mixed boundary conditions, requiring the solution of a pair of dual integral equations. These equations are solved in terms of a Fredholm integral equation of the second kind.Calculations of the resistance are performed for values of slab thicknesses ranging from 0·05 to 4 times the disc contact radius, and the solutions obtained agree closely with Foxhall and Lewis' electrolytic tank measurements. The results are used to establish the range of validity of two approximate methods previously proposed for correction factor calculations in spreading resistance measurements on semiconductor device structures.     

Experimental Determination of Micromachined Discrete and Continuous Device Spring Constants Using Nanoindentation Method

A rapid and accurate static and quasi-static method for determining the out-of-plane spring constants of cantilevers and a micromachined vibratory sensor is presented. In the past much of the effort in nanoindentation application was to investigate the thin-film mechanical properties. In this paper, we have utilized the nanoindentation method to measure directly some micromachined device (e.g. microgyroscope) spring constants. The cantilevers and devices tested were fabricated using the MUMPS process and an SOI process (patent pending). Spring constants are determined using a commercial nanoindentation apparatus UMIS-2000 configured with both Berkovich and spherical indenter tip that can be placed onto the device with high accuracy. Typical load resolution is: 20 N to 0.5 N and a displacement resolution of 0.05 nm. Information was deduced from the penetration depth versus load curves during both loading and unloading.     

Height measurement of microchip connecting pins by use of stereovision

A stereovision method for estimating the height of connecting pins on a microchip is described. The technique uses a centroidal method to simplify the calculation. A few seconds are required for a Pentium 586 PC to calculate the heights of 300 connecting pins on a 50 mm x 50 mm microchip. The method is described, and experimental results are presented. The optical system, which consists of two CCD cameras with long-focal-length lenses and a two-channel digital image grabber, is capable of in situ measurement.     

Using Laser Scattering for Detection of Cracks on a Microsolderball Surface

In this paper, a scanning laser probe has been developed to detect and measure cracks on a microsolderball surface. The technique, based on a light-scattering method that employs a low-power He-Ne laser and conventional optical components, enables the laser beam to be focused on the test surface. In the relative scanning between the test surface and laser probe, the specularly reflected light intensity acquired by a photodiode would exhibit the change of the scattered-light intensity, which can be used to determine the size of cracks on the solderball. Proof-of-concept experiments have been performed with measurement of cracks of different sizes (from 4 m to 60 m) on the microsolderball.     

Asymptotic Performance of a Censoring Sensor Network

We consider the problem of decentralized binary detection in a sensor network where the sensors have access to side information that affects the statistics of their measurements, or reflects the quality of the available channel to a fusion center. Sensors can decide whether or not to make a measurement and transmit a message to the fusion center ("censoring"), and also have a choice of the mapping from measurements to messages. We consider the case of a large number of sensors, and an asymptotic criterion involving error exponents. We study both a Neyman-Pearson and a , Bayesian formulation, characterize the optimal error exponent, and derive asymptotically optimal strategies for the case where sensor decisions are only allowed to depend on locally available information. Furthermore, we show that for the Neyman-Pearson case, global sharing of side information ("sensor cooperation") does not improve asymptotic performance, when the Type I error is constrained to be small.