碲锌镉晶体Zn组分的光致发光实用化研究

利用激光显微光致发光光谱仪测试了碲锌镉晶片的室温显微光致发光谱,对测得的光致发光谱进行拟合得到碲锌镉材料带隙的Eg值,根据实验总结出的Eg与Zn组分的室温计算公式,结合自主开发的Zn组分计算程序得到碲锌镉晶片上的Zn组分。所得的Zn组分结果用X射线双晶衍射进行验证,结果显示,室温下显微光致发光测得的Zn组分是相对准确可信的,可作为大量常规工艺测定Zn组分的有效工具,并且获得的Zn组分可成为外延碲镉汞薄膜时筛选匹配衬底的重要依据,同时还为研究和优化碲锌镉晶体生长工艺提供重要帮助。     

RS码类的构建及在数据链模拟系统中的应用

Reed-Solomon码(RS码)具有强大的纠错能力,在数据通信中得到了广泛的应用,如RS(31,15)码已经成为美军数据链系统的标准码。为了实现应用于数据链模拟系统中的RS编译码类,从分析RS纠错编译码原理入手,在研究了RS编译码模型的基础上,重点对RS编译码的编程实现方法进行了详细分析。以VC++为编程实现平台,采用面向对象的程序设计方法,构建且封装了RS编译码类,最后对RS编译码类的纠错性能进行了验证,结果表明,设计的RS编译码类能够有效纠错且正确恢复发端发送的信息,满足模拟系统的设计要求。     

线性调频的脉冲压缩雷达视频信号仿真

利用数字方法实现线性调频的脉冲压缩雷达视频目标模拟信号具有诸多优点：信号模拟的精度高，灵活性好，幅度、相位补偿方便，可以模拟复杂情况，系统结构简单，可靠性高，可扩展性强。详细介绍了基于FPGA设计线性调频的脉冲压缩雷达视频目标模拟信号的原理、结构、具体实现以及简要的性能分析。结果表明该方案性能良好，具有现实可实现性。     

一个新的四维混沌吸引子及其信息加密研究

为了获得更为复杂新颖的混沌信号源,提出了一个新的四维混沌系统,其吸引子形状类似于图像"四凤朝阳",并且利用该混沌信号源来实现信号加密和图像加密的方法,并利用迭代次数和混沌信号的加减手段来设置密码,为信息加密提供了一种新方法。     

基于Vega的红外视景仿真技术

介绍了基于Visual C++和Multigen Vega环境开发虚拟现实仿真系统的方法.该方法首先使用Creator软件建立带纹理的三维模型,然后使用TMM和MOSART工具分别对红外纹理和大气环境进行建模,最后使用Vega传感器模块进行红外图像仿真.基于Visual C++集成开发环境,应用Vega API编程技术...     

光纤干涉仪消光比调谐方法

简要介绍了目前超长距离光纤干涉传感系统的发展现状,并在理论上分析了光纤传感系统中的偏振态对消光比的影响以及能够影响光波偏振态的各种因素.将基于光弹效应的挤压型偏振控制器应用于该系统的消光比调谐,给予光纤干涉臂径向应力,动态调谐系统光波偏振态,实现了长距离光纤传感系统的消光比在一点上的调谐.提出了长距离光纤传感系统灵敏度...     

基于数据选择Householder多级维纳滤波导航接收机空时抗干扰方法

针对抑制GPS信号中期望信号方向的冲激毛刺干扰影响问题,对Householder多级维纳滤波方法进行改进,提出一种数据选择Householder多级维纳滤波器.改进方法用于GPS信号空时抗干扰处理中,可以避免期望信号方向的冲激毛刺干扰对最优权值计算的影响,同时保持期望信号不受影响.仿真结果验证了算法良好的抗干扰性能.     

High Mechanical Strength Double‐Network Hydrogel with Bacterial Cellulose

Double‐network (DN) hydrogels with high mechanical strength have been synthesized using the natural polymers bacterial cellulose (BC) and gelatin. As‐prepared BC contains 90 % water that can easily be squeezed out, with no more recovery in its swelling property. Gelatin gel is brittle and is easily broken into fragments under a modest compression. In contrast, the fracture strength and elastic modulus of a BC–gelatin DN gel under compressive stress are on the order of megapascals, which are several orders of magnitude higher than those of gelatin gel, and almost equivalent to those of articular cartilage. A similar enhancement in the mechanical strength was also observed for the combination of BC with polysaccharides, such as sodium alginate, gellan gum, and ι‐carrageenan.     

Al surface morphology effect on flip-chip solder bump shear strength

This paper reports the result of a study on the effect of aluminum pad surface morphology on the flip-chip solder bump reliability. The influence of the Al surface morphology on the electroless zinc/nickel/gold UBM is presented. The reliability of the solder bump as measured by ball shear force is reported. Al pad were produced using two RF sputtering systems: CVC-601 and Varian-3180. The Al targets used in CVC and Varian system were 99%Al–1%Si and 98.95%Al–1%Si–0.05%Ti respectively. The surface of the CVC sputtered Al samples were smooth while the surface of the Varian sputtered Al samples were rough. All the samples were subjected to the electroless zinc/nickel/gold plating. The results suggest that after plating, the smooth Al surface resulted in a fine nickel UBM surface while the rough Al surface formed a coarse nickel UBM surface. Ball shear test was conducted after the solder balls were bumped on the UBM. Result shows that the fine UBM surface samples have twice the shear strength compared to the samples with coarse UBM surface samples. The analysis of the results indicates that shear surface occurred at the UBM and the solder interface for samples with rough UBM surface leading to the lower shear strength. Nickel bump shear test result shows that pretreatment of Al pad surface by sodium hydroxide and nitric acid created more zinc seeds this led to better electroless nickel plating. Nickel bump shear tests also shows that double zincated bumps had higher shear strength than single zincated bumps. To obtain reliable flip-chip solder bumps, it is essential to maintain good Al pad surface morphology, pretreatment of the Al pad and undergo second zincation.     

A simulation-based multi-objective design optimization of electronic packages under thermal cycling and bending

In this study, a simulation-based multi-objective design optimization methodology was developed for improving electronic packaging reliability. It was demonstrated using a generic model of an electronic package on a printed wiring board. The objective for the optimization was to improve the reliability of solder joints under both thermal cycling and bending by optimizing a group of design parameters. A parametric finite element model was developed using ANSYS for both load conditions. To improve the numerical efficiency of the optimization, a multi-quadric response surface method was implemented to approximate the response of finite element simulations for each loading condition. Subsequently, the multi-objective optimization of solder joint reliability was implemented using a Minmax principle on all response surfaces and a differential evolution algorithm as optimal search engine, which is capable of finding global minimum when local minima exist. Our study demonstrated that the reliability of the solder joints is significantly improved for this given generic model of electronic package. The proposed methodology can be effectively used in improving the reliability of electronic packages.