Is construction procurement a key to sustainable development?

Has specialization of professional roles obstructed the holistic approach and sustainable development? A preliminary survey in Botswana involving construction professionals found that existing procurement systems have not integrated the efforts of the different project participants and also fail to fulfil the expectations of the users. A holistic approach involving the re-integration of construction disciplines by applying new procurement methods is proposed. An integrated, holistic way of working could provide a number of synergies through the consideration of the building project as an entire system. The implications include better decision making upstream, more efficient use of resources and the mitigation of negative environmental effects downstream.

La specialisation professionnelle est-elle un obstacle a l'approche globale et au developpement durable? Une etude preliminaire menee au Botswana et portant sur les metiers de la construction a revele que les systemes d'approvisionnement actuels n'integrent pas les efforts des differents participants a un projet et ne repondent pas aux attentes des utilisateurs. Cet article propose une approche globale dont le succes repose sur la reintegration de ces metiers et sur de nouvelles methodes d'approvisionnement. Une methode de travail integree et holistique, ou un projet de construction serait considere comme un systeme complet, pourrait faire naitre un certain nombre de synergies. Cette hypothese exige un meilleur processus decisionnel en amont une utilisation plus efficace des ressources et l'attenuation des effets negatifs sur l'environnement en aval.     

Supporting real-time and multimedia applications on the Mercuritestbed

This paper describes the distributed system, network and software architecture, the application development environment, the performance, and the early lessons learned on the ATM LAN testbed Mercuri established at the Honeywell Technology Center, to develop distributed multimedia technologies for real-time control applications. We have developed a client-server-based software architecture on Sun Sparcstation-2s connected by a Fore Systems' ASX-100 ATM switch, with video processing handled by Parallax's X Video cards. The architecture enables network-transparent applications and provides simple primitives for multimedia capture, display, transmission, storage, and retrieval. A real-time multimedia-in-the-loop control application was developed as the vehicle for testing the capabilities and performance of the network. Our test measurements focus on the end-user-level performance metrics such as message throughput and round-trip delay as well as video-frame jitter under no-load and load conditions. Our results show that the maximum burst throughput that can be supported at the user level is 48 Mb/s using AAL 5, while round-trip delays for 4-kbyte messages are about 3 ms. Our experience reveals a number of performance bottlenecks and open issues in using commercial ATM switches for practical applications. Our conclusions are outlined     

Influence of series resistance in oxide parameter extraction data from accelerated tests

Accelerated reliability tests on thin oxide capacitors can be affected by series resistance effects at high stress conditions. The purpose of this work is to point out such problems both with measurements and simulations. It is shown that breakdown electric field is overestimated. Due to the resulting nonuniform stress, charge to breakdown density is underestimated if the test structure layout is not accurately designed. In any case the series resistance effects can have an undesirable impact on the reliability evaluation of thin dielectrics.     

Stress-voiding in tungsten-plug interconnect systems induced byhigh-temperature processing

We describe the sensitivity of sub-micron via integrity to high-temperature processing following via etch. It has been observed that thermal expansion of Al into the via hole, before tungsten deposition, may result in the fabrication of a deformed tungsten plug. Our results indicate that relaxation of the Al can give rise to stress-void formation under the tungsten plug. This may manifest itself either during electromigration stress or high-temperature storage. This mechanism represents a new reliability hazard for a tungsten-plug interconnect system