An end-to-end denoising autoencoder-based deep neural network approach for fault diagnosis of analog circuit

Analog Integrated Circuits and Signal Processing - Fault diagnosis of analog circuit is critical to improve safety and reliability in electrical systems and reduce losses. Traditional fault...     

Data sharing mechanism of various mineral resources based on blockchain

Basins with various mineral resources coexisting and enriching often occupy an important strategic position. The exploration of various mineral resources is repetitive at present due to unshared data and imperfect management mechanism. This situation greatly increases the cost of energy exploitation in the country. Traditional data-sharing mode has several disadvantages, such as high cost, difficulty in confirming the right of data, and lack of incentive mechanism, which make achieving real data sharing difficult. In this paper, we propose a data-sharing mechanism based on blockchain and provide implementation suggestions and technical key points. Compared with traditional data-sharing methods, the proposed data-sharing mechanism can realize data sharing, ensure data quality, and protect intellectual property. Moreover, key points in the construction are stated in the case study section to verify the feasibility of the data-sharing system based on blockchain proposed in this paper.     

信永中和"登云股份IPO审计失败"探究

本文以证监会发布的针对信永中和及两名签字注册会计师的行政处罚决定书为切入点,结合深圳证券交易所、天眼查、巨潮资讯等网站公布的相关信息,从信永中和的具体审计过程,分析登云股份IPO审计失败的原因,原因主要在于基于业务需要未充分了解公司及其经营环境,贸然接受委托,缺乏应有的执业审慎,缺少了必要的审计程序,复核制度流于形式丧失了发现错误的最后机会。     

Understanding trust in ms-commerce: The roles of reported experience,linguistic style,profile photo,emotional, and cognitive trust

This paper examines what influences trust in mobile social commerce environment. Drawing on trust-based acceptance model (i.e. cognitive and emotional trust) and online review features (i.e. profile photo, linguistic style, and reported experience), we examine how these factors affect trust in mobile social commerce. Hypotheses were tested using survey data. The results of our model showed that there are significant influences of profile photo, reported experience, cognitive, and emotional trust towards trust in ms-commerce. This work contributes to existing literature by examining the roles of previous trust in mobile payments and online reviews on trust in mobile social commerce.     

0Cr20Mn21Ni2N奥氏体不锈钢锻件组织性能研究

研究了无磁钻铤用0Cr20Mn21Ni2N奥氏体不锈钢圆棒锻件横截面的室温强度、硬度和韧性等力学性能,并从微观角度进行了分析。在圆棒表层区域观察到了锻造变形态晶粒组织,而直径四分之一区域为再结晶组织,平均晶粒尺寸为80μm,芯部再结晶晶粒尺寸粗化为150μm,这些差异是由不同的变形温度和降温速度造成的。这种组织差异导致的室温拉伸性能和冲击韧性也有相应的变化趋势。研究结果表明,在900、1000℃以0.5 s-1的应变速率压缩的0Cr20Mn21Ni2N试验钢样品,其应力应变曲线具有一定的加工硬化特征,其芯部硬度比应变速率为0.1 s-1的样品分别提升了28、15 HB。在700、800℃以20%以上的变形量进行压缩时,峰值抗力显著提高,而在900、1000℃以10%~50%的变形量进行压缩时,峰值抗力均无明显提高,可保证顺利的变形过程。     

构皮滩水电站泄洪洞优化设计

构皮滩水电站为满足2008年12月工程提前发电的需要,结合现有泄洪洞地质情况和施工情况对泄洪洞布置进行了专题研究,结果表明利用降低进口高程为550 m的泄洪洞和坝身放空底孔联合参与后期导流,可缓解2007年导流隧洞下闸封堵后大坝在2008年汛期施工的压力,为大坝施工增加了2个月左右的工期。     

醇解技术在制备皮革加脂剂方面的研究进展

本文介绍了醇解反应的动力学、影响醇解反应收率的因素以及醇解反应在合成加脂剂方面的应用。     

Exposed Die-Top Encapsulation Molding for an Improved High- Performance Flip Chip BGA Package

The recent advancement in high- performance semiconductor packages has been driven by the need for higher pin count and superior heat dissipation. A one-piece cavity lid flip chip ball grid array (BGA) package with high pin count and targeted reliability has emerged as a popular choice. The flip chip technology can accommodate an I/O count of more than five hundreds500, and the die junction temperature can be reduced to a minimum level by a metal heat spreader attachment. None the less, greater expectations on these high-performance packages arose such as better substrate real estate utilization for multiple chips, ease in handling for thinner core substrates, and improved board- level solder joint reliability. A new design of the flip chip BGA package has been looked into for meeting such requirements. By encapsulating the flip chip with molding compound leaving the die top exposed, a planar top surface can be formed. A, and a flat lid can then be mounted on the planar mold/die top surface. In this manner the direct interaction of the metal lid with the substrate can be removed. The new package is thus less rigid under thermal loading and solder joint reliability enhancement is expected. This paper discusses the process development of the new package and its advantages for improved solder joint fatigue life, and being a multichip package and thin core substrate options. Finite-element simulations have been employed for the study of its structural integrity, thermal, and electrical performances. Detailed package and board-level reliability test results will also be reported     

复合流场上吸罩流场理论分析

提出在计算复合流场内存在两种不同流态的流动:势流和紊流。针对两种流动,分别建立了其数学模型,对于紊流流场,针对标准k-ε紊流模型的缺陷,采用了RNGk-ε紊流模型使紊流控制方程封闭。以及提出了边界条件的确定原则。为复合流场的数值计算提供了理论指导。