一种克服sEMG人机交互中肌肉疲劳的SVM算法

在基于表面肌电信号的人机交互系统中,产生的肌肉疲劳降低了系统的稳定性。针对该问题,分析肌肉正常状态和疲劳状态下的肌电信号变化规律,提出一种改进的在线支持向量机增量训练算法。该算法在每次训练SVM(Support Vector Machine)模型时,计算各样本到分类超平面的距离,并以之为条件对不断更新的训练数据进行有条件的选择和遗忘,只留下最大距离1/2以内的数据。通过在线训练不断更新训练样本来获得新的SVM模型,用于适应肌肉疲劳过程中肌电信号的变化,同时防止多次在线训练过程中更新的样本改变训练集间初始边界。最后在智能轮椅上进行验证,实验结果表明:该算法有效减少了肌肉疲劳在人机交互系统中的影响,使得系统能够保持长时间稳定操作。     

渣油加氢催化剂孔结构对反应活性的影响

在3L中型加氢试验装置上考察了渣油加氢脱硫催化剂孔结构对反应活性的影响，试验结果表明，当孔结构发生变化时，催化剂的脱硫、脱氮、脱残炭及脱金属反应活性呈现不同的变化规律。     

Mechanism of ZrTiO4 Synthesis by Mechanochemical Processing of TiO2 and ZrO2

High-energy ball milling initiates a solid-state reaction in an equimolar mixture of TiO₂ and ZrO₂. The first stage of ball milling induced the transformation of anatase TiO₂ to high-pressure phase TiO₂ (II), isostructural with ZrTiO₄. The formation of solid solutions monoclinic ZrO₂/TiO₂ and TiO₂ (II)/ZrO₂ was observed in the intermediate stage. Afterward, a nanosized ZrTiO₄ phase was formed in the milled product from the TiO₂ (II)/ZrO₂ solid solution. The sintering of the milled product at a temperature <1100°C was examined in situ by Raman spectroscopy. The full solid-state reaction toward ZrTiO₄ ceramic is completed at a temperature considerably lower than reported in the literature.     

Polyimide foams with ultralow dielectric constants

To explore ultralow dielectric constant polyimide, the crosslinked polyimide foams (PIFs) were prepared from 3,3′,4,4′‐benzophenonetetracarboxylic dianhydride (BTDA), 4,4′‐oxydianiline (ODA), and 2,4,6‐triaminopyrimidine (TAP) via a poly(ester–amine salt) (PEAS) process. FTIR measurements indicated that TAP did not yield a negative effect on imidization of PEAS precursors. SEM measurement revealed the homogeneous cell structure. Through using TAP as a crosslinking monomer, the mechanical properties of PIFs could be improved in comparison with uncrosslinked BTDA/ODA based PIF. The crosslinked PIFs still exhibited excellent thermal stability with 5% weight loss temperatures higher than 520°C. In the field with frequency higher than 100 Hz, the dielectric constants of the obtained PIFs ranged from 1.77 to 2.4, and the dielectric losses were smaller than 3 × 10^?2 at 25–150°C. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 102: 1734–1740, 2006     

粉粒体表面改性技术及其应用

在介绍粉粒体表面改性的方法、特点的基础上，着重介绍用高速气流冲击法进行表面改性的３种基本处理形式、材料组合的影响因素、原料配比的计算方法及应用实例。     

基于广义数学期望算法模型的中国企业工资水平宏观调控评价研究

随着我国经济进入加速转型期,市场机制在劳动力资源配置中作用不断加大,我国企业工资水平宏观调控体系机制已成为繁复的工程系统。本文运用广义数学期望算法构建企业工资水平宏观调控评价体系,从经济发展,社会和谐,生活协调三个方面对中国企业工资水平宏观调控体系展开综合评价,分析存在的问题,为优化和完善中国企业工资水平宏观调控机制提供决策依据和政策建议。     

Effects of cobalt and potassium doping on thermal stability and electrical properties of radiation grafted acrylic acid onto poly(tetrafluoroethylene ethylene) copolymer films

Grafted copolymer of poly(tetrafluoroethylene ethylene) (ET) with acrylic acid (AAc) was prepared by direct radiation method. The obtained films were modified by treating with small amounts of Co²⁺ and K⁺ ions (1.0 wt %). The effects of such treatment on the thermal stability and electrical conductivity of these films were studied. Cobalt treatment did not much affect the thermal degradation of the films. The results obtained revealed that k⁺ treatment enhanced the thermal degradation of ET‐g‐PAAc, which started 273 K lower than that observed in the case of the untreated and Co²⁺‐treated films. Potassium and cobalt treatment of the investigated films increased their electrical conductivity (σ) and decreased the activation energy ΔE_σ. The increase in σ values was, however, more pronounced in the case of K⁺‐treated film. These results were discussed in terms of the effective increase in the hydrophilicity of the films, especially those treated with potassium. © 2005 Wiley Periodicals, Inc. J Appl Polym Sci 97: 867–871, 2005     

Advanced underfill for high thermal reliability

The key to the success of flip‐chip technology lies in the availability of sucessful underfill materials. However, the reliability of flip‐chip technology using current underfill materials is generally found to be lower than that of conventional wire‐bond connection packaging materials such as epoxy molding compound (EMC) because of the high coefficients of thermal expansion (CTE) and moisture absorption of cured underfill material. In this study desbimide (DBMI), which has a low melting point (about 80°C), was used in the underfill materials as a cohardener. As a result, DBMI‐added underfill can show excellent thermal reliability, which is due to the superior properties of the CTE, the elastic modulus, and water resistance. When the properties of a 2 wt % DBMI‐added underfill were compared with those of a typical underfill (epoxy/anhydride), the CTE value was reduced to less than one‐half at the solder reflow temperature (about 200°C), the elastic modulus was reduced to less than one‐half in the temperature region below the glass‐transition temperature, and the water resistance was improved twofold. © 2002 Wiley Periodicals, Inc. J Appl Polym Sci 83: 2617–2624, 2002     

Curing kinetics and mechanical properties of epoxy nanocomposites based on different organoclays

The effect of different organoclays and mixing methods on the cure kinetics and properties of epoxy nanocomposites based on Epon828 and Epicure3046 was studied. The two kinds of organoclay used in this study, both based on natural montmorillonite but differing in intercalant chemistry, were I.30E (Nanomer I.30E—treated with a long‐chain primary amine intercalant) and C.30B (Cloisite 30B—treated with a quaternary ammonium intercalant, less reactive with epoxy than the primary amine). The two mixing processes used to prepare the nanocomposites were (i) a room‐temperature process, in which the clay and epoxy are mixed at room temperature, and (ii) a high‐temperature process, in which the clay and epoxy are mixed at 120°C for 1 h by means of mechanical mixing. The nanocomposites were cured at room temperature and at high temperature. The quality of dispersion and intercalation/exfoliation were analyzed by scanning electron microscopy, transmission electron microscopy, and X‐ray diffraction. The heat evolution of the epoxy resin formulation and its nanocomposite systems was measured using differential scanning calorimetry at different heating rates of 2.5, 5, 10, 15, and 20°C min^?1. The cure kinetics of these systems was modeled by means of different approaches. Kissinger and isoconversional models were used to calculate the kinetics parameters while the Avrami model was utilized to compare the cure behavior of the epoxy systems. The cure kinetics and mechanical properties were found to be influenced by the presence of nanoclay, by the type of intercalant, and by the mixing method. POLYM. ENG. SCI., 47:649–661, 2007. © 2007 Society of Plastics Engineers.     

Synthesis and properties of polyimide (containing naphthalene) nanocomposites with organo‐modified montmorillonites

2,7‐Bis(4‐aminophenoxy) naphthalene (BAPN), a naphthalene‐containing diamine, was synthesized and polymerized with a 3,3′,4,4′‐benzophenone tetracarboxylic dianhydride (BTDA) to obtain a polyimide (PI) via thermal imidization. To enhance the thermal and mechanical properties of the polymer, PI–Montmorillonite (MMT) nanocomposites were prepared from a DMAc solution of poly(amic acid) and a DMAc dispersion of MMT, which were organo‐modified with various amounts of n‐dodecylamine (DOA) or cetylpyridium chloride (CPC). FTIR, XRD, and TEM (transmission electron microscopy) were used to verify the incorporation of the modifying agents into the clay structure and the intercalation of the organoclay into the PI matrix. Results demonstrated that the introduction of a small amount of MMT (up to 5%) led to the improvement in thermal stability and mechanical properties of PI. The decomposition temperature of 5% weight loss (T_d,5%) in N₂ was increased by 46 and 36°C in comparison with pristine PI for the organoclay content of 5% with DOA and CPC, respectively. The nanocomposites were simultaneously strengthened and toughened. The dielectric constant, CTE, and water absorption were decreased. However, at higher organoclay contents (5–10%), these properties were reduced because the organoclay was poorly dispersed and resulted in aggregate formation. The effects of different organo‐modifiers on the properties of PI–MMT nanocomposite were also studied; the results showed that DOA was comparable with CPC. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci, 2006