Effects of hydrolysis of precursor on the structures and properties of polymer-derived SiBN ceramic fibers

In this paper, polyborosilazane precursor was synthesied from HMDZ, HSiCl₃, BCl₃ and CH₃NH₂ using a multistep method. By controlling the storage conditions, parts of the polyborosilazane fibers were hydrolyzed. FT-IR, NMR, XRD, TEM and monofilament tensile strength test were employed to study the effects of hydrolysis of precursor on the structures and properties of polymer-derived SiBN ceramic fibers. FT-IR and NMR results indicate that Si-N group in PBSZ reacts with H₂O to form Si-O-Si group. After pyrolysis reaction at 1400℃, Si-O-Si group will finally transformed into highly ordered cristobalite and β-quartz, resulting in formation of the wrinkled surface of the obtained SiBN ceramic fiber. The strip-like defects on fiber surface, according to monofilament tensile strength test, had a significant effect on mechanical property of the obtained SiBN ceramic fiber and caused no increase in fiber tensile strength of hydrolytic polyborosilazane fiber before and after pyrolytic process.     

平煤六矿大埋深高瓦斯切顶留巷技术应用与实践#br#

为保证矿井安全高效生产，针对平煤股份公司六矿戊8 32010工作面机巷平均埋深700 m、瓦斯原始含量5.12 m3/t，原始瓦斯压力0.52 MPa的情况，开展卸压切顶留巷工作。通过对留巷全过程矿压监测，分析成巷矿压分布规律，将留巷分为动压剧烈影响区、动压缓慢影响区和成巷稳定区三部分，矿压分别来源于超前支承压力和留巷内顶板短悬臂梁失稳。留巷进入稳定区后，随着巷道超前支护液压支架等支护设施的撤除，巷道会出现二次稳定过程，主要源于顶板对于巷道超前支护液压支架工作阻力的再平衡。切顶留巷技术提高了工作效率，很好地解决了矿井采掘接替紧张的问题。     

Process monitoring method based on correlation variable classification and vine copula

Chemical processes are becoming increasingly complicated, leading to an increase in process variables and more complex relationships among them. The vine copula has a significant advantage in portraying the dependence of high-dimensional variables. However, as the dimensions increase, the vine copula model incurs a high computational load; such pressure greatly reduces model efficiency. Relationships among variables in the industrial process are complex. Different variables may be strongly or weakly associated or even independent. This paper proposes a process monitoring method based on correlation variable classification and vine copula. The weighted correlation measure is first used to divide variables into a correlated subspace and weakly correlated subspace. Then, two vine structures, C-vine and D-vine, are applied to the correlated and weakly correlated subspaces, respectively. This method takes advantage of C-vine for correlated variables and the flexibility of D-vine for weakly correlated variables. Finally, comprehensive statistics are established based on different subspaces. Monitoring results of the numerical system and the Tennessee Eastman process demonstrate the effectiveness and validity of the proposed method.     

8e6科技走校园路线--校园网行为管理解决方案最受青睐

8e6科技公司近日发布的一项校园网安全状况和网络行为管理调查报告显示:目前校园网关注的主要问题是安全威胁和网络带宽浪费。校园网络遇到的安全问题主要集中在防病毒和网络行为管理上,为此,网络行为管理解决方案成为改善校园网安全和应用状况的优选解决方案。大部分受访人表示,他们很愿意采用网络行为管理解决方案,用以解决目前遇到的网络行为管理问题。而选择网络行为管理解决方案时,他们比较关心的是设备的稳定性、安全性和性价比,通过网络行为管理解决方案来分析、记录网络行为以及阻断不当的上网行为,提高网络的安全性和网络带宽利用…     

以IBAC为核心处理洗浴废水的试验研究

根据洗浴废水的水质特征,采用原水→混凝沉淀-过滤→固定化生物活性炭(Immobilized Biological Activated Carbon,IBAC)→微滤膜(MF)→UV消毒→出水的工艺流程.混凝沉淀-过滤物化预处理单元可以有效地减少洗浴废水中的各类污染物.IBAC生化处理单元,实现有机污染物、LAS、浴臭等有效去除,是保证出水合格的根本措施.微滤膜发挥物理截留作用、UV消毒杀死细菌和总大肠菌群.出水水质达到＜城市供水水质标准＞(CJ/T 206-2005).     

SafeNet如何超越SSL VPN

对许多企业而言,不仅需要能够简单部署的安全远程访问解决方案,而且还需要能够紧密地与企业已投资的身份管理系统进行集成的解决方案。为了满足安全远程访问的实时需求,SafeNet最近推出了无边界安全企业级访问服务器(Borderless SecurityEnterprise Access Server)。该产品不仅具备SSL VPN功能,而且利用特殊配置及设定来满足大型企业的严苛要求(快速建立安全存取控制解决方案,并提供迅速的ROI)。该产品安装在稳固且高效能的1U装置中,将IPSec及SSL VPN、稳固的用户认证、多方授权、端点安全兼容检查以及广泛的认证功能整合在一起,…     

McAfee推进在华战略

全球入侵防护和安全风险管理解决方案领先供应商McAfee公司7月5日在华宣布,将正式启用中文名称“迈克菲”。同期还宣布在深圳成立的移动技术研究实验室已投入使用,为包括摩托罗拉在内的移动设备开发安全解决方案。此外迈克菲还与中国联通、百度、软通科技和华擎科技四家中国企业结盟,共同为中国的消费者提供安全产品。纵观McAfee的中国区战略,可以说是品牌加固、科研深化与结盟广泛全线推进。迈克菲寓意双重也许启用一个中文名称本身并不是一件值得大惊小怪的事,但从McAfee董事会主席兼CEO GeorgeSamenuk先生亲临北京别具匠心的新闻发…     

人的安全如何保证?

最近发生的某信息安全专业技术人员泄密事件引起了业界的广泛关注,人们惊诧于原本脆弱的信息系统,由于安全技术人员的泄密而将变得更加脆弱。其实人们关注的范围还不止这些,比如受到牵连的安全公司业务上将受到什么样的打击?被泄密单位的损失如何弥补?有关方面对此类事件如何处     

Exposed Die-Top Encapsulation Molding for an Improved High- Performance Flip Chip BGA Package

The recent advancement in high- performance semiconductor packages has been driven by the need for higher pin count and superior heat dissipation. A one-piece cavity lid flip chip ball grid array (BGA) package with high pin count and targeted reliability has emerged as a popular choice. The flip chip technology can accommodate an I/O count of more than five hundreds500, and the die junction temperature can be reduced to a minimum level by a metal heat spreader attachment. None the less, greater expectations on these high-performance packages arose such as better substrate real estate utilization for multiple chips, ease in handling for thinner core substrates, and improved board- level solder joint reliability. A new design of the flip chip BGA package has been looked into for meeting such requirements. By encapsulating the flip chip with molding compound leaving the die top exposed, a planar top surface can be formed. A, and a flat lid can then be mounted on the planar mold/die top surface. In this manner the direct interaction of the metal lid with the substrate can be removed. The new package is thus less rigid under thermal loading and solder joint reliability enhancement is expected. This paper discusses the process development of the new package and its advantages for improved solder joint fatigue life, and being a multichip package and thin core substrate options. Finite-element simulations have been employed for the study of its structural integrity, thermal, and electrical performances. Detailed package and board-level reliability test results will also be reported