Reliability and performance analysis of time – space – time switching networks with multiple separated space switches

Since electronic switching systems usually require very strict reliability requirements as well as good performance objectives, we need to jointly analyse the performance and reliability of switching systems. In this paper, we compare conventional time–space–time switches with single space switches with those with multiple separated space switches, from the viewpoints of reliability and performance. We consider time–space–time switching networks which consist of N incoming time switches, i.e. one NxN space switch, two (N/2)x(N/2) space switches, and four (N/4)x(N/4) space switches. We introduce a Markov reliability model to study the effect of failures and analyse the reliability and performance of three different types of switching networks in terms of average blocking probability and the mean time to unreliable operation, as we vary the offered traffic. As a result, T–S–T switching networks with multiple separated space switches exhibit better performance and reliability than those with single space switches.     

用小尺寸R－CT试样研究核压力容器钢断裂韧性及与Charpy试样的比较

提出了一种用双边带深侧槽的小尺寸圆形紧凑拉伸试样评定核压力容器（ＲＰＶ）钢断裂韧性的单试作试验方法，给出了用该方法测定的两个厂家生产的核压力容器用Ａ５０８ＣＬ３钢的断裂韧性参数，还与Ｃｈａｒｐｙ试样的试验结果及大尺寸标准试样的试验结果进行了比较。研究结果表明：用双边带深侧槽的小尺寸Ｒ－ＣＴ试样测得的断裂韧性值比相同恻槽深度预制疲劳裂纹Ｃｈａｒｐｙ试样的测试值更接近有效断裂韧性值，所以，用于核压力容器断裂韧性的监测是可行的。     

各国核电厂场外应急计划的比较

本文分析和比较了各国核电厂的应急计划,特别是场外应急的干予水平和应急计划区,讨论了我国干予水平、核电厂应急计划区和香港核应急计划几个实际问题。     

Programmable group-delay module using binary polarization switching

We demonstrate the first programmable group-delay module based on polarization switching. With a unique binary tuning mechanism, the device can generate any differential group delay value from -45 to +45 ps with a resolution of 1.40 ps, or any true-time-delay value from 0 to 45 ps with a resolution of 0.7 ps. The delay varying speeds for both applications are under 1 ms and can be as fast as 0.1 ms. We evaluate both the dynamic and static performances of the device while paying special attention to its dynamic figures of merit for polarization-mode dispersion emulation and compensation applications. Our experiment shows that the device exhibits a negligible transient-effect induced power penalty (<0.2 dB) in a 10-Gb/s nonreturn-to-zero system.     

A fast algorithm for the generalized parametric minimum cut problem and applications

Many combinatorial optimization problems are solved by a sequence of network flow computations on a network whose edge capacities are given as a function of a parameter λ. Recently Galloet al. [7] made a major advance in solving such parametric flow problems. They showed that for an important class of networks, calledmonotone parametric flow networks, a sequence ofO(n) flow computations could be solved in the same worst-case time bound as a single flow. However, these results require one of two special assumptions: either that the λ values are presented in increasing or decreasing order; or that the edge capacity functions are affine functions of λ. In this paper we show how to remove both of these assumptions while obtaining the same running times as in [7]. This observation generalizes and unifies the two major results of [7], and allows its ideas to be applied to many new combinatorial problems. Of greatest importance, it allows the efficient application of binary search and successive binary search to a sequence of network flow problems.     

A three-dimensional non-epitaxial atomistic growth model for thin-film deposition: effect of surface mobility

The effect of the atomic mobility on a film surface has been studied by using a three-dimensional atomistic thin-film deposition model which simulates three-dimensional thin-film images, surface profiles and cross-sectional area pictures. In addition, quantitative results of surface RMS roughness, average film thickness, atomic coordination number and its distribution, and solid fraction of the deposited thin films, were obtained from the simulations. When the film surface mobility increased from 0.3 to 3.0, RMS roughness decreased from 6.5 to 1.1, solid fraction increased from 0.27 to 0.56 and average film thickness decreased from 40 to 28, due to the reduction of the voids within the film. The full-width half magnitude of the atomic coordination distribution became narrower indicating the increased degree of crystallization. With increase in surface mobility crossing the boundary to 1.5, the film evolved from a porous or loose columnar structure with voids, to a densely packed fibrous grain structure which can be categorized by the zone structure models.     

转移法色交换

将图Ｇ的着色由一种变为中一种，通常用Ｋｅｍｐｅ法以交换。但是，对于某些情况，用此法无效。针对这个问题，本文提出了一种转移法色交换，它适用于平面图着色，方法直观，清晰且有效。     

厌氧胶快速渗补技术在汽车发动机上的应用

将金属铜易与过氧化物发生氧化还原反应生成游离基的原理应用于厌氧胶，开发了针时金属零件表面微孔进行局部渗补的实用技术。在相关技术可靠性和工艺可行性得以论证的前提下。将局部渗补技术成功地应用于渗补发动机泄漏缸盖，减少了废品损失，取得了良好的经济效益。     

Process and design analysis for ultrafine-pitched wiresweep elimination in advanced copper heat spreader BGA package

The semiconductor device trend for increasing functionalities and performances yet with smaller overall feature sizes presents escalating obstacles to the decreasing form factor along with demanding thermal carrying capability required at the package level. To confront this compounding issue, ultrafine-pitch wirebond interconnect coupled with thermally enhanced copper heat spreader attached to the package are introduced. However, the additional copper heat spreader thickness introduced within the package challenges the design of the package's wire, its loop height, and the molding process control to prevent wire sweeping occurrences. This study investigates the impact of different ultrafine pitched wire types, wire loop designs, copper heat spreader structures, and mold material types on eliminating device short from occurring due to the wire sweeping phenomena. A full factorial experiment is performed using an active silicon device packaged in a thermally enhanced ball grid array (BGA) test vehicle. In addition, test characterization is carried out using x-ray and multiinsertions hot/cold continuity tests. Then, a detailed failure analysis is performed by package decapsulation and scanning electron microscopy/energy-dispersive x-ray (SEM/EDX) to confirm the experimental findings. In conclusion, the study finds that for an ultrafine-pitched thermally enhanced BGA package, wire type is insignificant to reduce wire shorting occurrences. However, mold material and copper heat spreader structure using an optimized wire loop design are significant factors in eliminating wiresweep shorting phenomena. This study concludes with a wirebond interconnect and heat slug design recommended along with an improved process parameters and assembly material sets found from the experiment.