Capacitance of dielectric coated cylinder of finite axial lengthand truncated cone isolated in free space

The capacitance of dielectric coated metallic cylinder and truncated cone are evaluated using the method of moments based on the pulse function and point matching. The analysis is based on the boundary condition for the potential on the conductor surface and the normal component of the displacement density at the dielectric-free space interface. The total free charge on the conductor surface is found from the inversion of a matrix partitioned into submatrices. Numerical data on the capacitance and charge distribution are presented     

A Comprehensive Review on the Application of Internet of Thing (IoT) in Smart Agriculture

Wireless Personal Communications - IoT-based smart farming techniques have come up as one of the solutions to tackle the effect of climate change, water scarcity, etc. which are the prime reason...     

Heteroepitaxial Patterned Growth of Vertically Aligned and Periodically Distributed ZnO Nanowires on GaN Using Laser Interference Ablation

A simple two‐step method of fabricating vertically aligned and periodically distributed ZnO nanowires on gallium nitride (GaN) substrates is described. The method combines laser interference ablation (LIA) and low temperature hydrothermal decomposition. The ZnO nanowires grow heteroepitaxially on unablated regions of GaN over areas spanning 1 cm², with a high degree of control over size, orientation, uniformity, and periodicity. High resolution transmission electron microscopy and scanning electron microscopy are utilized to study the structural characteristics of the LIA‐patterned GaN substrate in detail. These studies reveal the possible mechanism for the preferential, site‐selective growth of the ZnO nanowires. The method demonstrates high application potential for wafer‐scale integration into sensor arrays, piezoelectric devices, and optoelectronic devices.     

Optical micro-structures fabricated on top of optical fibers by means of two-photon photopolymerization

In this work we report, for the first time to our knowledge, the possibility to fabricate various structures, with good optical proprieties, on the top of optical fibers, using the two-photon lithography (TPL) technique. We show the convenience of this approach to quickly create generic 3D shapes using a single set-up by contrast to past shape-dependent methods. A set of different structures are fabricated and characterized to demonstrate the versatility of this approach and their high optical quality.     

Connected sensor cover: self-organization of sensor networks for efficient query execution

Spatial query execution is an essential functionality of a sensor network, where a query gathers sensor data within a specific geographic region. Redundancy within a sensor network can be exploited to reduce the communication cost incurred in execution of such queries. Any reduction in communication cost would result in an efficient use of the battery energy, which is very limited in sensors. One approach to reduce the communication cost of a query is to self-organize the network, in response to a query, into a topology that involves only a small subset of the sensors sufficient to process the query. The query is then executed using only the sensors in the constructed topology. The self-organization technique is beneficial for queries that run sufficiently long to amortize the communication cost incurred in self-organization. In this paper, we design and analyze algorithms for suchself-organization of a sensor network to reduce energy consumption. In particular, we develop the notion of a connected sensor cover and design a centralized approximation algorithm that constructs a topology involving a near-optimal connected sensor cover. We prove that the size of the constructed topology is within an O(logn) factor of the optimal size, where n is the network size. We develop a distributed self-organization version of the approximation algorithm, and propose several optimizations to reduce the communication overhead of the algorithm. We also design another distributed algorithm based on node priorities that has a further lower communication overhead, but does not provide any guarantee on the size of the connected sensor cover constructed. Finally, we evaluate the distributed algorithms using simulations and show that our approaches results in significant communication cost reductions.     

Multiuser Detection in SDMA–OFDM Wireless Communication System Using Complex Multilayer Perceptron Neural Network

The space division multiple access–orthogonal frequency division multiplexing (SDMA–OFDM) wireless system has become very popular owing high spectral efficiency and high load capability. The optimal maximum likelihood multiuser detection (MUD) technique suffers from high computational complexity. On the other hand the linear minimum mean square error (MMSE) MUD techniques yields poor performance and also fails to detect users in overload scenario, where the number of users are more than that of number of receiving antennas. By contrast, the differential evolution algorithm (DEA) aided minimum symbol error rate (MSER) MUD can sustain in overload scenario as it can directly minimizes probability of error rather than mean square error. However, all these classical techniques are still complex as these do channel estimation and multiuser detection sequentially. In this paper, complex multi layer perceptron (CMLP) neural network model is suggested for MUD in SDMA–OFDM system as it do both channel approximation and MUD simultaneously. Simulation results prove that the CMLP aided MUD performs better than the MMSE and MSER techniques in terms of enhanced bit error rate performance with low computational complexity.     

Bulk micromachining of silicon in TMAH-based etchants for aluminum passivation and smooth surface

The fabrication of silicon based micromechanical sensors often requires bulk silicon etching after aluminum metallization. All wet silicon etchants including ordinary undoped tetramethyl ammonium hydroxide (TMAH)-water solution attack the overlaying aluminum metal interconnect during the anisotropic etching of (100) silicon. This paper presents a TMAH-water based etching recipe to achieve high silicon etch rate, a smooth etched surface and almost total protection of the exposed aluminum metallization. The etch rate measurements of (100) silicon, silicon dioxide and aluminum along with the morphology studies of etched surfaces are performed on both n-type and p-type silicon wafers at different concentrations (2, 5, 10 and 15%) for undoped TMAH treated at various temperatures as well as for TMAH solution doped separately and simultaneously with silicic acid and ammonium peroxodisulphate (AP). It is established through a detailed study that 5% TMAH-water solution dual doped with 38 gm/l silicic acid and 7 gm/l AP yields a reasonably high (100) silicon etch rate of 70 μm/h at 80 °C, very small etch rates of SiO₂ and pure aluminum (around 80 Å/h and 50 Å/h, respectively), and a smooth surface (±7 nm) at a bath temperature of 80 °C. The etchant has been successfully used for fabricating several MEMS structures like piezoresistive accelerometer, vaporizing liquid micro-thruster and flow sensor. In all cases, the bulk micromachining is carried out after the formation of aluminum interconnects which is found to remain unaffected during the prolonged etching process at 80 °C. The TMAH based etchant may be attractive in industry due to its compatibility with standard CMOS process.     

Irradiation of Transition Metal Dichalcogenides Using a Focused Ion Beam: Controlled Single‐Atom Defect Creation

Manipulation and structural modifications of 2D materials for nanoelectronic and nanofluidic applications remain obstacles to their industrial‐scale implementation. Here, it is demonstrated that a 30 kV focused ion beam can be utilized to engineer defects and tailor the atomic, optoelectronic, and structural properties of monolayer transition metal dichalcogenides (TMDs). Aberration‐corrected scanning transmission electron microscopy is used to reveal the presence of defects with sizes from the single atom to 50 nm in molybdenum (MoS₂) and tungsten disulfide (WS₂) caused by irradiation doses from 10¹³ to 10¹⁶ ions cm^?2. Irradiated regions across millimeter‐length scales of multiple devices are sampled and analyzed at the atomic scale in order to obtain a quantitative picture of defect sizes and densities. Precise dose value calculations are also presented, which accurately capture the spatial distribution of defects in irradiated 2D materials. Changes in phononic and optoelectronic material properties are probed via Raman and photoluminescence spectroscopy. The dependence of defect properties on sample parameters such as underlying substrate and TMD material is also investigated. The results shown here lend the way to the fabrication and processing of TMD nanodevices.     

Effect of Lead-Free Soldering on Key Material Properties of FR-4 Printed Circuit Board Laminates

The transition to lead-free soldering of printed circuit boards (PCBs) using solder alloys such as SnAgCu has resulted in higher temperature exposures during assembly compared with eutectic SnPb solders. The knowledge of PCB laminate material properties and their dependence on the material constituents, combined with their possible variations due to lead-free soldering temperature exposures, is an essential input in the laminate selection process. This paper provides laminate selection guidelines that were arrived at by assessing key material properties (glass transition temperature, coefficient of thermal expansion, decomposition temperature, and water absorption), and their responses to lead-free soldering assembly conditions. A range of commercially available FR-4 PCB laminate materials, classified on the basis of glass transition temperature (high, mid, and low), curing agents (dicyandiamide and phenolic), flame retardants (halogenated and halogen-free), and fillers (presence or absence) were studied. The laminate material properties under investigation were measured as per the IPC-TM-650 test methods before and after exposure to multiple lead-free soldering cycles. Combinatorial property analysis was conducted to investigate the causes behind variations in material properties.     

Secure Remote User Mutual Authentication Scheme with Key Agreement for Cloud Environment

Authentication schemes are widely used mechanisms to thwart unauthorized access of resources over insecure networks. Several smart card based password authentication schemes have been proposed in the literature. In this paper, we demonstrate the security limitations of a recently proposed password based authentication scheme, and show that their scheme is still vulnerable to forgery and offline password guessing attacks and it is also unable to provide user anonymity, forward secrecy and mutual authentication. With the intention of fixing the weaknesses of that scheme, we present a secure authentication scheme. We show that the proposed scheme is invulnerable to various attacks together with attacks observed in the analyzed scheme through both rigorous formal and informal security analysis. Furthermore, the security analysis using the widely-accepted Real-Or-Random (ROR) model ensures that the proposed scheme provides the session key (SK) security. Finally, we carry out the performance evaluation of the proposed scheme and other related schemes, and the result favors that the proposed scheme provides better trade-off among security and performance as compared to other existing related schemes.