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排序方式: 共有660条查询结果,搜索用时 15 毫秒
71.
Jimin Cheon Youngcheol Chae Dongsoo Kim Seunghyun Lim Inhee Lee Hyoung-Ki Lee Dong Jo Kim Gunhee Han 《Electron Devices, IEEE Transactions on》2009,56(11):2546-2555
Light-section (LS)-based range finders are commonly used for obstacle recognition in home service robots and autonomous vehicles. This paper proposes a smart CMOS image sensor for LS-based range finding. The proposed sensor can detect the laser light, even under very strong ambient-illumination levels by using a multiple-capture frame-correlated double sampling (F-CDS), which is realized with an inverter-based switched-capacitor F-CDS accumulator. The proposed sensor also includes on-chip winner-take-all circuits that significantly reduce the software and hardware complexity of interpolation for the subpixel resolution. The prototype chip was fabricated using a 0.35-mum CMOS process. The measurement results show that the proposed sensor can detect a laser line with an intensity that is 56.5 dB lower than that of the ambient illumination, providing a spatial resolution of plusmn0.16 pixels. 相似文献
72.
Kyung-Woon Jang Kyung-Wook Paik 《Electronics Packaging Manufacturing, IEEE Transactions on》2009,32(2):74-80
In this paper, the effects of anisotropic conductive film (ACF) viscosity on ACF fillet formation and, ultimately, on the pressure cooker test (PCT) reliability of ACF flip chip assemblies were investigated. The ACF viscosity was controlled by varying the molecular weight of the epoxy materials. It was found that the ACF viscosity increased as the increase of molecular weight of the epoxy materials. However, there was little variation of the thermomechanical properties among the evaluated ACFs with different viscosites. Also, the results showed that the ACFs have no differences in moisture absorption rate, die adhesion strength, and degree-of-cure. In scanning electron microscopy images, the lower ACF viscosity resulted in the smoother ACF fillet shape and the higher fillet height. From the results of PCT, the ACF flip chip assembly with the smoother fillet shape showed better reliability in terms of contact resistance changes. After 130 h of PCT, the flip chip assembly with lower ACF viscosity also showed a lesser degree of delamination at the ACF/chip interface. 相似文献
73.
Sung-Dong Cho Jang K.-W. Jin-Gul Hyun Sangyong Lee Kyung-Wook Paik Hyungsoo Kim Joung-Ho Kim 《Electronics Packaging Manufacturing, IEEE Transactions on》2005,28(4):297-303
Epoxy/BaTiO/sub 3/ composite embedded capacitor films (ECFs) were newly designed for high dielectric constant and low-tolerance (less than /spl plusmn/5%) embedded capacitor fabrication for organic substrates. In terms of material formulation, ECFs are composed of a specially formulated epoxy resin and latent curing agent, and in terms of a coating process, a comma roll coating method is used for uniform film thickness in large area. The dielectric constant of ECF in high frequency range (0.5/spl sim/3 GHz) is measured using the cavity resonance method. In order to estimate dielectric constant, the reflection coefficient is measured with a network analyzer. The dielectric constant is calculated by observing the frequencies of the resonant cavity modes. Calculated dielectric constants in this frequency range are about 3/4 of the dielectric constants at 1 MHz. This difference is due to the decrease of the dielectric constant of the epoxy matrix. The dielectric relaxation of barium titanate (BaTiO/sub 3/: BT) powder is not observed within measured frequency. An alternative material for embedded capacitor fabrication is epoxy/BaTiO/sub 3/ composite embedded capacitor paste (ECP). It uses similar materials formulation like ECF and a screen printing method for film coating. The screen printing method has the advantage of forming a capacitor partially in the desired part. However, the screen printing makes surface irregularities during mask peel-off. Surface flatness is significantly improved by adding some additives and by applying pressure during curing. As a result, a dielectric layer with improved thickness uniformity is successfully demonstrated. Using epoxy/BaTiO/sub 3/ composite ECP, a dielectric constant of 63 and specific capacitance of 5.1 nF/cm/sup 2/ were achieved. 相似文献
74.
Dongsoo Park Sangin Kim Ikmo Park Hanjo Lim 《Lightwave Technology, Journal of》2005,23(5):1923-1928
In this paper, a general methodology for the design of higher order coupled resonator filters in photonic crystals (PCs) is presented. In the proposed approach, the coupling between resonators is treated as though it occurs through a waveguide with an arbitrary phase shift. The coupling through the waveguide is analyzed theoretically, based on the coupled-mode theory in time. The derived theoretical model suggests a way to extend an equivalent circuit approach, previously demonstrated with a certain value of a phase shift, to the higher order filter design with an arbitrary phase shift. The validity of the proposed approach is confirmed by the design of a third-order Chebyshev filter having a center frequency of 193.55 THz, a flat bandwidth of 50 GHz, and ripples of 0.3 dB in the passband. The characteristics of the designed filter are suitable for wavelength-division-multiplexed (WDM) optical communication systems with a 100-GHz channel spacing. The performance of the designed filter is numerically calculated using the two-dimensional (2-D) finite-difference time-domain (FDTD) method. 相似文献
75.
S R Chae S H Lee J O Kim B C Paik Y C Song H S Park H S Shin 《Water science and technology》2004,49(5-6):257-264
As the sewerage system is incomplete, sewage in Korea lacks easily biodegradable organics for nutrient removal. In this country, about 11,400 tons of food waste of high organic materials is produced daily. Therefore, the potential of food waste as an external carbon source was examined in a pilot-scale BNR (biological nutrient removal) process for a half year. It was found that as the supply of the external carbon increased, the average removal efficiencies of T-N (total nitrogen) and T-P (total phosphorus) increased from 53% and 55% to 97% and 93%, respectively. VFAs (volatile fatty acids) concentration of the external carbon source strongly affected denitrification efficiency and EBPR (enhanced biological phosphorus removal) activity. Biological phosphorus removal was increased to 93% when T-N removal efficiency increased from 78% to 97%. In this study, several kinds of PHAs (poly-hydroxyalkanoates) in cells were observed. The observed PHAs was composed of 37% 3HB (poly-3-hydroxybutyrate), 47% 3HV (poly-3-hydroxyvalerate), 9% 3HH (poly-3-hydroxyhexanoate), 5% 3HO (poly-3-hydroxyoctanoate), and 2% 3HD (poly-3-hydroxydecanoate). 相似文献
76.
Byungcho Choi Dongsoo Kim Donggyu Lee Seungwon Choi Jian Sun 《Power Electronics, IEEE Transactions on》2007,22(2):452-460
This paper presents the theoretical and practical details involved with the small-signal analysis of switching power converters under a strong influence of input filter interaction. A boost dc-to-dc converter controlled by voltage-mode control and the same boost converter controlled by current-mode control are used as illustrative examples. The theoretical predictions of this paper are supported by experimental results and computer simulations 相似文献
77.
Ho-Young Son Jae-Woong Nah Kyung-Wook Paik 《Electronics Packaging Manufacturing, IEEE Transactions on》2005,28(3):274-281
Formation processes of Pb/63Sn solder droplets using a solder droplet jetting have not been sufficiently reported. Solving problems such as satellite droplets and position errors are very important for a uniform bump size and reliable flip-chip solder bump formation process. First, this paper presents the optimization of jet conditions of Pb/63Sn solder droplets and the formation process of Pb/63Sn solder bumps using a solder droplet jetting method. Second, interfacial reactions and mechanical strength of jetted Pb/63Sn solder bumps and electroless Ni-P/Au UBM joints have been investigated. Interfacial reactions have been investigated after the second solder reflow and aging, and results were compared with those of solder bumps formed by a solder screen-printing method. Third, jetted solder bumps with variable bump sizes have been demonstrated by a multiple jetting method and the control of waveform induced to a jet nozzle. Multiple droplets jetting method can control various height and size of solder bumps. Finally, real applications of jetted Pb/63Sn solder bumps have been successfully demonstrated on conventional DRAM chips and integrated passive devices (IPDs). 相似文献
78.
79.
DigiCipher, an all-digital HDTV (high-definition television) system, with transmission over a single 6 MHz VHF or UHF channel, is described. It provides full HDTV performance with virtually no visible transmission impairments due to noise, multipath, and interference. It offers high picture quality, while the complexity of the decoder is low. Furthermore, low transmitting power can be used, making it ideal for simulcast HDTV transmission using unused or prohibited channels. DigiCipher can also be used for cable and satellite transmission of HDTV. There is no satellite receive dish size penalty (compared to FM-NTSC) in the satellite delivery of DigiCipher HDTV. To achieve the full HDTV performance in a single 6 MHz bandwidth, a highly efficient unique compression algorithm based on DCT (discrete cosine transform) transform coding is used. Through the extensive use of computer simulation, the compression algorithm has been refined and optimized. Computer simulation results show excellent video quality for a variety of HDTV material. For error-free transmission of the digital data, power error correction coding combined with adaptive equalization is used. At a carrier-to-noise ratio of above 19 dB, essentially error-free reception can be achieved 相似文献
80.
On the basis of observed customer interaction patterns, the WebCatalog/sup Pers/ system creates integrated product catalogs that continuously adapt and can be restructured in a dynamic environment. 相似文献