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排序方式: 共有2711条查询结果,搜索用时 15 毫秒
41.
42.
B. J. Mayr ÖVE IEEE H. Weinrichter ÖVE IEEE 《e & i Elektrotechnik und Informationstechnik》1997,114(3):123-130
Modern communication systems offer high speed and reliable data transmission services. The quality of these services is achieved by combining coded multi-level modulation techniques and modern digital signal processing (Viterbi-decoding) in the receiver. In this paper we first present an introduction to Trellis Coded Modulation (TCM) and then some new results on unversal techniques adapted for the AWGN-channel as well as for the fading channel. It is shown that TCM is well suited for communication channels with time variant characteristics (e.g. mobile communication channels), especially when our new codes are applied. 相似文献
43.
44.
45.
A. Séthy ÖVE/GIT VDE/NTG Sen IEEE 《e & i Elektrotechnik und Informationstechnik》1997,114(12):766-766
Ohne Zusammenfassung 相似文献
46.
S. P. Ashburn M. C. Öztürk J. J. Wortman G. Harris J. Honeycutt D. M. Maher 《Journal of Electronic Materials》1992,21(1):81-86
Titanium and cobalt germanides have been formed on Si (100) substrates using rapid thermal processing. Germanium was deposited
by rapid thermal chemical vapor deposition prior to metal evaporation. Solid phase reactions were then performed using rapid
thermal annealing in either Ar or N2 ambients. Germanide formation has been found to occur in a manner similar to the formation of corresponding silicides. The
sheet resistance was found to be dependent on annealing ambient (Ar or N2) for titanium germanide formation, but not for cobalt germanide formation. The resistivities of titanium and cobalt germanides
were found to be 20 μΩ-cm and 35.3μΩ-cm, corresponding to TiGe2 and Co2Ge, respectively. During solid phase reactions of Ti with Ge, we have found that the Ti6Ge5 phase forms prior to TiGe2. The TiGe2 phase was found to form approximately at 800° C. Cobalt germanide formation was found to occur at relatively low temperatures
(425° C); however, the stability of the material is poor at elevated temperatures. 相似文献
47.
48.
Nils Lundberg Mikael Östling Carl-Mikael Zetterling Per Tägtström Ulf Jansson 《Journal of Electronic Materials》2000,29(3):372-375
In this study, tungsten carbide, with its hardness, chemical inertness, thermal stability and low resistivity (25 μΩ cm)1 is shown as a reliable contact material to n- and p-type 6H-SiC for very high temperature applications. WC films with thicknesses
of 100–150 nm were deposited by chemical vapor deposition (CVD) from a WF6/C3H8/H2 mixture at 1173 K. A method to pattern CVD-tungsten carbide is suggested. TEM analysis of as deposited samples displayed
a clear and unreacted interface. The electrical investigations of the p-type 6H-SiC Schottky contacts revealed a high rectification
ratio and a low reverse current density (6.1 × 10−5 A cm−2, −10 V) up to 773 K. On n-type, a low barrier (ΦBn=0.79 eV) at room temperature was observed. The low ΦBn value suggests WC to be promising as an ohmic contact material on highly doped n-type epi-layers. We will show a temperature
dependence for the barrier height of tungsten carbide contacts that can be related to the simultaneous change in the energy
bandgap, which should be considered when designing SiC devices intended for high temperature operation. 相似文献
49.
An Effective Approach for High‐Efficiency Photoelectrochemical Solar Cells by Using Bifunctional DNA Molecules Modified Photoanode 下载免费PDF全文
Özlem Ateş Sönmezoğlu Seçkin Akın Begüm Terzi Serdal Mutlu Savaş Sönmezoğlu 《Advanced functional materials》2016,26(47):8776-8783
This paper firstly reports the effect of deoxyribonucleic acid (DNA) molecules extracted from chickpea and wheat plants on the injection/recombination of photogenerated electrons and sensitizing ability of dye‐sensitized solar cells (DSSCs). These high‐yield DNA molecules are applied as both linker bridging unit as well as thin tunneling barrier (TTB) at titanium dioxide (TiO2 )/dye interface, to build up high‐efficient DSSCs. With its favorable energy levels, effective linker bridging role, and double helix structure, bifunctional DNA modifier shows an efficient electron injection, suppressed charge recombination, longer electron lifetime, and higher light harvesting efficiency, which leads to higher photovoltaic performance. In particular, a photoconversion efficiency (PCE) of 9.23% is achieved by the binary chickpea and wheat DNA‐modified TiO2 (CW@TiO2) photoanode. Furthermore, time‐resolved fluorescence spectroscopy measurements confirm a better electron transfer kinetics for DNA‐modified TiO2 photoanodes, implying a higher electron transfer rate (kET). This work highlights a great contribution for the photoanodes that are linked with DNA molecule, which act as both bridging unit and TTB to control the charge recombination and injection dynamics, and hence, boost the photovoltaic performance in the DSSCs. 相似文献
50.
Xiaoli Xu Richard T. Kuehn Mehmet C. Öztürk Jimmie J. Wortman Robert J. Nemanich Gari S. Harris Dennis M. Maher 《Journal of Electronic Materials》1993,22(3):335-339
Various silicon surface cleaning processes for rapid thermal in-situ polysilicon/ oxide/silicon stacked gate structures have
been evaluated. Metal-oxide-semiconductor capacitors were fabricated to assess the effects of cleaning on the quality of gate
oxide structures produced by both rapid thermal oxidation (RTO) and rapid thermal chemical vapor deposition (RTCVD). Excellent
electrical properties have been achieved for both RTO and RTCVD gate oxides formed on silicon wafers using either an ultraviole/zone
(UV/O3) treatment or a modified RCA clean. On the contrary, poor electrical properties have been observed for RTO and RTCVD gate
oxides formed on silicon wafers using a high temperature bake in Ar, H2, or high vacuum ambient. It has also been found that the electrical properties of the RTCVD gate oxides exhibit less dependence
upon cleaning conditions than those of RTO gate oxides. This work demonstrates that initial surface condition prior to gate
oxide formation plays an important role in determining the quality of RTO and RTCVD gate oxides. 相似文献