Microstructure and Electrical Properties of Low Temperature Processed Ohmic Contacts to p‐Type GaN

With Ni/Au and Pd/Au metal schemes and low temperature processing, we formed low resistance stable Ohmic contacts to p‐type GaN. Our investigation was preceded by conventional cleaning, followed by treatment in boiling HNO₃:HCl (1:3). Metallization was by thermally evaporating 30 nm Ni/15 nm Au or 25 nm Pd/15 nm Au. After heat treatment in O₂ + N₂ at various temperatures, the contacts were subsequently cooled in liquid nitrogen. Cryogenic cooling following heat treatment at 600 ·C decreased the specific contact resistance from 9.84·10^?4 Ωcm² to 2.65·10^?4 Ωcm² for the Ni/Au contacts, while this increased it from 1.80·10^?4 Ωcm² to 3.34·10^?4 Ωcm² for the Pd/Au contacts. The Ni/Au contacts showed slightly higher specific contact resistance than the Pd/Au contacts, although they were more stable than the Pd contacts. X‐ray photoelectron spectroscopy depth profiling showed the Ni contacts to be NiO followed by Au at the interface for the Ni/Au contacts, whereas the Pd/Au contacts exhibited a Pd:Au solid solution. The contacts quenched in liquid nitrogen following sintering were much more uniform under atomic force microscopy examination and gave a 3 times lower contact resistance with the Ni/Au design. Current‐voltage‐temperature analysis revealed that conduction was predominantly by thermionic field emission.     

Signaling and Control Procedures Using Generalized MPLS Protocol for IP over an Optical Network

This paper reviews the existing research activities on signaling and control procedures for IP over optical networks. We focus on the IP‐centric signaling and control architecture based on the generalized multi‐protocol label switching (GMPLS) protocol and analyze various scenarios and technical issues for deploying the IP over an optical network. We analyze the signaling and operations and administration and maintenance requirements for integrating an IP network and an optical network in order to cope with the high bandwidth and poor resource granularity of the optical network, including the optical cross‐connect system. On the basis of network architecture and a reference configuration model, we investigate the GMPLS‐based control architecture and interconnection model appropriate for controlling IP bandwidth and optical lambda resources. The signaling and control procedure based on GMPLS on optical user‐network interface and network‐network interface are comparatively investigated to provide the optical lightpath. We also study protection and restoration procedures to protect link failure when it applies to GMPLS signaling.     

A Study on the Thermal Fatigue Behavior of Solder Joints Under Power Cycling Conditions

Failure mechanisms exposed by environmental accelerating testing methods such as thermal cycling or thermal shock test, may differ from those at service operating conditions. While the device is heated up or cooled down evenly on its external surface during environmental testing, real operating powered devices experience temperature gradients caused by internal local heating, components' different heat dissipation capability, and ambient temperature variation, etc. In this study, a power cycling technique is introduced to better approximate the field operating conditions so as to activate the field failure modes. Power cycling thermal fatigue test is performed with different ball grid array solder joints, that is, lead contained [Sn/37 Pb (SP)] and lead free [Sn/4.0Ag/0.5 Cu (SAC)], and the result is compared. In order to account for the thermal fatigue life behavior discrepancy for different solder joint composition, real time Moire interferometry is applied to measure the global/local thermo-mechanical behavior during power cycling excursion. Effective damage parameter, the total average shear strain, is extracted from the experiment and applied to account for the difference in fatigue life result of two different solders. In addition, amount of experimentally measured total average shear strain is mutually verified with finite element method analysis. It is clear that total average shear strain of a solder joint can be an effective damage parameter to predict thermo-mechanical fatigue life. A physical mechanism in terms of thermal material property of solder joints' is proposed to offer some thoughts to abnormal shear strain behavior that leads to discrepancies in fatigue life of two solders. An importance of power cycling testing method is emphasized for certain package designs.     

Operation of integrated InGaAsP-InP optical amplifier-monitoringdetector with feedback control circuit

Monolithic integration of a monitoring detector with an optical amplifier simplifies the use of an amplifier in lightwave systems. The structure and performance are described of a monolithically integrated semiconductor optical amplifier with low-loss Y-branching waveguides and a monitoring p-i-n detector. The photocurrent of the integrated detector can be used as a single control parameter for amplifier output leveling, gain optimization, and in situ monitoring of facet antireflective coatings     

Multi-stratum resources resilience in software defined data center interconnection based on IP over elastic optical networks

IP over elastic optical network is a very promising networking architecture to interconnect data centers. It can enable efficient resource utilization and support heterogeneous bandwidth demands in cost-effective, highly available, and energy-effective manner. In case of aggregation elastic optical network node failure, to ensure a high-level quality of service for user request after the failure becomes a research focus. In this paper, we present a novel multi-stratum resources resilience (MSRR) architecture for the data center services in software defined data center interconnection based on IP over elastic optical networks. The MSRR can enable joint optimization of IP network, elastic optical network, and application stratum resources, and enhance the service resilience and the data center responsiveness to the dynamic end-to-end service demands. Additionally, a service-aware resource collaborative resilience strategy for MSRR is introduced based on the proposed architecture, which can provide the restoration using the multiple stratums resources in case of failure. The overall feasibility and efficiency of the proposed architecture are experimentally verified on our testbed. Moreover, the network performances are quantitatively evaluated through the simulation under heavy traffic load scenario in terms of path blocking probability, resource occupation rate, and path resilience latency.     

Thermal buffer materials for enhancement of device performance of organic light emitting diodes fabricated by laser imaging process

Laser Induced Thermal Imaging (LITI) is a laser addressed thermal patterning technology with unique advantages such as an excellent uniformity of transfer film thickness, a capability of multilayer stack transfer and a possibility to fabricate high resolution as well as large-area display. Nevertheless, it has been an obstacle to use such a laser imaging process as a commercial technology so far because of serious deterioration of the device performances plausibly due to a re-orientation of the molecular stacking especially in the emitting layer during thermal transfer process. To improve device performances, we devised a new concept to suppress the thermal degradation during such kind of thermal imaging process by using a high molecular weight small molecular species with large steric hindrance as well as high thermostability as a thermal buffer layer to realize highly efficient LITI devices. As a result, we obtained very high relative efficiency (by EQE) up to 91.5% at 1000 cd/m² from the LITI devices when we utilize 10-(naphthalene-2-yl)-3-(phenanthren-9-yl)spiro[benzo[ij]tetraphene-7,9′-fluorene] as a thermal buffer material.     

Study on Characteristics of Various RF Transmission Line Structures on PES Substrate for Application to Flexible MMIC

In this work, the coplanar waveguide is fabricated on a PES (poly[ether sulfone]) substrate for application to a flexible monolithic microwave integrated circuit, and its RF characteristics were thoroughly investigated. The quality factor of the coplanar waveguide on PES is 40.3 at a resonance frequency of 46.7 GHz. A fishbone‐type transmission line (FTTL) structure is also fabricated on the PES substrate, and its RF characteristics are investigated. The wavelength of the FTTL on PES is 5.11 mm at 20 GHz, which is 55% of the conventional coplanar waveguide on PES. Using the FTTL, an impedance transformer is fabricated on PES. The size of the impedance transformer is 0.318 mm × 0.318 mm, which is 69.2% of the size of the transformer fabricated by the conventional coplanar waveguide on PES. The impedance transformer showed return loss values better than –12.9 dB from 5 GHz to 50 GHz and an insertion loss better than –1.13 dB in the same frequency range.     

Performance analysis of HomePlug 1.0 MAC with CSMA/CA

As demands for data communications among home/personal devices in home environments increase, various types of home-networking technologies have appeared. Among them, power line communication is one of the most promising wired home-networking technologies, because the existing power line facilities can be utilized for data transmission without deploying any new physical links. HomePlug 1.0 is the most popular power line communication technology, which has been standardized by the HomePlug power line alliance, and attempts to mitigate the effect of time- and frequency-varying channels by enhanced modulation and channel coding. Although HomePlug 1.0 has undergone field trials and simulations, its analytic model and performance was only conducted for throughput under saturation conditions. We propose a new analytic model to evaluate MAC throughput and delay of HomePlug 1.0 both under saturation and under normal traffic conditions. We verify our proposed model via simulations and evaluate the performance of HomePlug 1.0.     

A learning approach of wafer temperature control in a rapid thermalprocessing system

This paper presents a learning approach for wafer temperature control in a rapid thermal processing system (RTP). RTP is very important for semiconductor processing system and requires an accurate trajectory following. Numerous studies have addressed this problem and most research on this problem requires exact knowledge of the system dynamics. The various approaches do not guarantee the desired performance in practical applications when there exist some modeling errors between the model and the actual system. In this paper, iterative learning control scheme is applied to RTP without exact information on the dynamics. The learning gain of the iterative learning law is estimated by neural networks instead of a mathematical model. In addition, the control information obtained by the iterative learning controller (ILC) is accumulated in the feedforward neuro controller (FNC) for generalization to various reference profiles. Through numerical simulations, it is demonstrated that the proposed method can achieve an accurate output tracking even without an exact RTP model. The output errors decrease rapidly through iterations when using the learning gain estimated and the FNC yields a reduced initial error, and so requires small iterations     

Ag Nanowire Reinforced Highly Stretchable Conductive Fibers for Wearable Electronics

Stretchable conductive fibers have received significant attention due to their possibility of being utilized in wearable and foldable electronics. Here, highly stretchable conductive fiber composed of silver nanowires (AgNWs) and silver nanoparticles (AgNPs) embedded in a styrene–butadiene–styrene (SBS) elastomeric matrix is fabricated. An AgNW‐embedded SBS fiber is fabricated by a simple wet spinning method. Then, the AgNPs are formed on both the surface and inner region of the AgNW‐embedded fiber via repeated cycles of silver precursor absorption and reduction processes. The AgNW‐embedded conductive fiber exhibits superior initial electrical conductivity (σ₀ = 2450 S cm^?1) and elongation at break (900% strain) due to the high weight percentage of the conductive fillers and the use of a highly stretchable SBS elastomer matrix. During the stretching, the embedded AgNWs act as conducting bridges between AgNPs, resulting in the preservation of electrical conductivity under high strain (the rate of conductivity degradation, σ/σ₀ = 4.4% at 100% strain). The AgNW‐embedded conductive fibers show the strain‐sensing behavior with a broad range of applied tensile strain. The AgNW reinforced highly stretchable conductive fibers can be embedded into a smart glove for detecting sign language by integrating five composite fibers in the glove, which can successfully perceive human motions.