Improvement of RCA transistor using RTA annealing after theformation of interfacial oxide

A polysilicon emitter RCA transistor (an ultra-thin interfacial oxide layer exists between polysilicon and silicon emitter) is presented which can operate at 77 K for the first time. An ultra-thin (1.5 nm) interfacial oxide layer is grown deliberately between polysilicon and silicon emitter using RCA oxidation and excellent device stability is obtained after rapid thermal annealing (RTA) treatment in nitrogen atmosphere. The RCA transistor exhibits good electrical performance at very low temperature for an emitter area of 3 × 8 μm². The maximum toggle frequency of a 1:2 static divider is 1.2 GHz and 732 MHz at 300 K and 77 K, respectively     

Single-longitudinal-mode fiber ring laser employing an equivalent phase-shifted fiber Bragg grating

A novel single-longitudinal-mode (SLM) fiber ring laser that incorporates an equivalent phase-shifted fiber Bragg grating acting as an ultra-narrow bandpass filter in the laser cavity is proposed. The equivalent phase-shifted fiber Bragg grating has an ultra-narrow transmission bandwidth which ensures an SLM lasing. Stable SLM operation without mode hopping is demonstrated.     

A new efficient method for one‐pot conversions of aryl carboxylic acids into nitriles without solvent

A new efficient method for synthesising nitriles, important organic reagents, is reported in this paper. In an environmentally benign solvent‐free system, aryl carboxylic acids were converted into the corresponding nitriles via one‐pot reactions, by amidation with ethyl carbamate followed by dehydration with thionyl chloride, in excellent yields. The results showed that the method has the advantages of lower cost, higher yield, less pollution and greater ease of work‐up. Copyright © 2008 Society of Chemical Industry     

Silicon-to-steel bonding using rapid thermal annealing

This paper presents the rapid, low-temperature bonding between silicon and steel using the rapid thermal annealing process. Three different thin-film adhesion layer systems including silver, gold, and nickel were utilized as the intermediate bonding material to assist the eutectic Pb/Sn bonding between silicon and steel. The bonding temperature was set at 220/spl deg/C for 20 s, with a 20-s ramp-up time. Five experiments were conducted to determine the strength of the bond, including static tensile and compressive four-point bend tests, axial extension tests, tensile bending fatigue tests, and corrosion resistance tests. The test results have shown that the gold adhesion layer is the most robust, demonstrating minimal creep during fatigue tests, no delamination during the tensile or compressive four-point bend tests, and acceptable strength during the axial extension tests. Additionally, all adhesion layers have withstood four months of submersion in various high-temperature solutions and lubricants without failure. Simulations of the axial stresses and strains that developed during the four-point bend and axial extension tests were performed and showed that the presence of the silicon die provides a local reinforcement of the bond as observed in the experimental tests.     

3-D MCM封装技术及其应用

介绍了超大规模集成电路（VLSI）用的3-D MCM封装技术的最新发展，重点介绍了3-D MCM封装垂直互连工艺，分析了3-D MCM封装技术的硅效率、复杂程度、热处理、互连密度、系统功率与速度等问题，并对3-D MCM封装的应用作了简要说明。     

Analysis and comparison of two-dimensional permanent-magnet arrays for planar motor

This paper investigates three kinds of permanent-magnet arrays used in planar motors with polarity centers distributed in the lattices of a matrix. The magnetic field of every kind of magnet array is analyzed by analytical methods. First, we give a Laplace equation of magnetic scalar potential and a series of boundary conditions. Then, we derive the analytical expressions of magnet field strength and magnet flux density in the air gap of each kind of magnet array by the method of separation of variables. Finally, we compare the three types of magnet arrays on the basis of the analytical solutions.     

A Pervasive Computing Curriculum for Engineering and Science Students

Today, there's an urgent need for well-trained pervasive computing engineers and scientists. Pervasive computing has evolved into a critical field, influencing a broad range of industries from healthcare to manufacturing to defense. However, most computer engineering and computer science programs pay marginal attention, at best, to the field. In this issue, the authors of the Rochester Institute of Technology describes a set of courses on pervasive computing topics and a supporting laboratory designed for both computer engineering and computer science students     

Domain-Driven, Actionable Knowledge Discovery

Data mining increasingly faces complex challenges in the real-life world of business problems and needs. The gap between business expectations and R&D results in this area involves key aspects of the field, such as methodologies, targeted problems, pattern interestingness, and infrastructure support. Both researchers and practitioners are realizing the importance of domain knowledge to close this gap and develop actionable knowledge for real user needs.