Implementation of a self-timed segmented bus

We propose an asynchronous structure for implementation on a SoC. An intersegment topological arrangement preserves parallelization and, through a so-called central arbiter, efficiently organizes communication with high signaling speed in the proposed structure. Researchers proposed the concept of segmenting buses primarily for multicomputer architectures. More recent approaches address on-chip implementation of segmented buses. We present an asynchronous segmented-bus architecture targeted for the modular design of high-performance SoC applications. The structure not only enables faster operation than a conventional bus system but also offers lower power consumption per transferred data item. This is possible because segmentation is realized in such a way that the majority of data transfers in the system are intrasegment transactions on relatively short wires with low or moderate capacitive loads.     

A Distributed State Estimator Utilizing Synchronized Phasor Measurements

With the creation of balancing authorities by the North American Reliability Council that span large portions of the North American interconnection, and stringent requirements for real time monitoring of power system evolution, faster and more accurate state estimation algorithms that can efficiently handle systems of very large sizes are needed in the present environment. This paper presents a distributed state estimation algorithm suitable for large-scale power systems. Synchronized phasor measurements are applied to aggregate the voltage phase angles of each decomposed subsystem in the distributed state estimation solution. The aggregated state estimation solution is obtained from the distributed solution using a sensitivity analysis based update at chosen boundary buses. Placement of synchronized phasor measurements in the decomposed subsystems is also investigated in this paper. Test results on the IEEE 118-bus test bed are provided     

Cooling and Solidification of Melted Drops in an Immiscible Cooling Medium

The cooling and solidification of melted drops during their movement in an immiscible cooling medium is widely employed for granulation in the chemical industry, and a study of these processes to provides a basis for the design of the granulation tower height and the temperature of the cooling medium is reported. A physical model of the cooling and solidification of the drop is established and the numerical calculation is performed. The influences of the key factors in the solidification, i.e., Bi number, drop diameter, temperature of the cooling medium, etc. are presented. The cooling and solidification during wax granulation in a water‐cooling tower and during urea granulation in an air‐cooling tower (spraying tower) are described in detail. Characteristics of the solidification and temperature distribution within the particle at different times are shown. The model and calculations can be used for structure design of the granulation tower and optimization of the operation parameters.     

Evaluation of ProKappa

ProKappa is an expert system tool kit developed by IntelliCorp in C using X-Windows for graphical interface. The SUN 3 or 4 version costs $9995/£7000 and $2595/£1800 for the interactive C environment.
This review covers ProKappa version 1.1, installed on a colour SUN SPARC Station 1 with the minimum recommended values of 12 Mb of memory and 30 Mb of swap space.
IntelliCorp can be contacted in the USA at 1975 El Camino Real West, Mountain View, CA 94040-2216 (+1 (415) 965-5500) and in the UK at 10 Jewry Street, Winchester, Hampshire SO23 8RZ (+44 (0)962 735348).     

Fractoemission from Lead Zirconate-Titanate

We present measurements of the electron, positive ion, and photon emission accompanying the fracture in vacuum of poly-crystalline 95/5 lead zirconate-titanate. The intensities of the charged-particle components of this fractoemission are shown to depend strongly on the direction (relative to the direction of fracture) and magnitude of polarization. The most intense emission is observed when the fracture surfaces are perpendicular to the polarization direction. The emission intensity increases monotonically with polarization. These results are interpreted in terms of a model involving charge separation on the fracture surfaces leading to a microdischarge during fracture. Implications to the interpretation of triboluminesence effects are discussed.     

Effect of grain boundaries on isothermal solidification during transient liquid phase brazing

The influence of liquid penetration at grain boundary regions on the rate of advance of the solid-liquid interface during isothermal solidification of transient liquid phase (TLP) brazed nickel joints has been examined. The test samples used in this study were Ohno-cast nickel with a grain size of >4 mm and a fine-grained nickel with a grain size of around 40 μm. Both Ni-base materials had the same chemical composition. The rate of isothermal solidification was greater when fine-grained nickel was employed during TLP brazing using Ni-11 wt pct P filler metal at 1200 °C. Liquid penetration at grain boundaries accelerates the isothermal solidification process by increasing the effective solid-liquid interfacial area and increasing the rate of solute diffusion into the base material. An analysis of electron channeling patterns has confirmed that random high-angle boundaries have a greater influence on the rate of isothermal solidification than ordered boundaries including small-angle or twin boundaries. Formerly Visiting Scientist, Department of Metallurgy and Materials Science, University of Toronto. Formerly Postdoctoral Fellow, Department of Metallurgy and Materials Science, University of Toronto