Optimal design of APD biasing circuit

This paper proposes a control method for avalanche photodiode(APD) reverse bias with temperature compensation and load resistance compensation. The influence of background light and load resistance on APD detection circuit is analyzed in detail. A theoretical model of temperature compensation and load resistance compensation is established,which is used for APD biasing circuit designing. It is predicted that this control method is especially suitable for LD laser range finder used on vehicles. Experimental results confirm that the design proposed in this paper can considerablely improve the performance of range finder.     

基于RCM 的导弹装备最佳预防性维修周期决策

针对目前确定预防性维修周期时存在不确定性的问题,建立了基于RCM的导弹装备维修周期决策模型。分别以总费用最小和可用度最大为目标建立导弹装备维修周期决策模型,采用蒙特卡罗仿真进行模型求解,采用模糊决策方法确定多目标综合最佳预防性维修周期,并以某型导弹装备密封圈为例,验证方法的有效性。实践分析结果表明:该方法综合权衡了费用和可用度因素,能较好地解决可用度低下且维修费用居高不下的问题,有一定应用和参考价值。     

串行时钟芯片DS1302在温度测量记录仪表中的应用

对测量仪表中普遍使用的实时时钟技术做了分析,简要介绍了串行时钟芯片DS1302的功能及主要特点,并结合在温度测量记录仪表的应用实例,论述了DS1302的重要作用,详细给出了与单片机STC89C51接口的软硬件设计,通过软硬件实验与调试,总结了应用DS1302的技术难点与注意事项,证明了仪表实时时钟运行的准确性与可靠性。该设计硬件简单可靠,软件编程容易,可方便的移植到其它控制系统中。     

The influence of solder volume and pad area on Sn–3.8Ag–0.7Cu and Ni UBM reaction in reflow soldering and isothermal aging

This paper examines various aspects of SAC (Sn–3.8Ag–0.7Cu wt.%) solder and UBM interactions which may impact interconnection reliability as it scales down. With different solder joint sizes, the dissolution rate of UBM and IMC growth kinetics will be different. Solder bumps on 250, 80 and 40 μm diameter UBM pads were investigated. The effect of solder volume/pad metallization area (V/A) ratio on IMC growth and Ni dissolution was investigated during reflow soldering and solid state isothermal aging. Higher V/A ratio produced thinner and more fragmented IMC morphology in SAC solder/Ni UBM reflow soldering interfacial reaction. Lower V/A ratio produced better defined IMC layer at the Ni UBM interface. When the ratio of V/A is constant, the IMC morphology and growth trend was found to be similar. After 250 h of isothermal aging, the IMC growth rate of the different bump sizes leveled off. No degradation in shear strength was observed in these solder bump after 500 h of isothermal aging.     

Experimental Demonstration of Multipoint Temperature Warning Sensor Using a Multichannel Matched Fiber Bragg Grating

A novel time-division-multiplexing fiber Bragg grating (FBG) sensor for multipoint temperature warning sensor is proposed and demonstrated. A multiwavelength pulsed laser based on a multichannel matched FBG is employed. The sensor array consists of multiple uniform FBGs at different positions and with different nominal wavelengths. When the temperature exceeds the threshold at a certain position, the light at the corresponding time slot and wavelength can be detected. The sensor provides a simple and flexible solution to locate the abnormal temperature increase with different tolerable thresholds at different locations.     

Optimal Filtering for Systems With Multiple Packet Dropouts

This paper is concerned with the optimal filtering problem for discrete-time stochastic linear systems with multiple packet dropouts, where the number of consecutive packet dropouts is limited by a known upper bound. Without resorting to state augmentation, the system is converted to one with measurement delays and a moving average (MV) colored measurement noise. An unbiased optimal filter is developed in the linear least-mean-square sense. Its solution depends on the recursion of a Riccati equation and a Lyapunov equation. A numerical example shows the effectiveness of the proposed filter.      

Predicting fingertip forces by imaging coloration changes in the fingernail and surrounding skin

This paper presents an external camera method for measuring fingertip forces by imaging the fingernail and surrounding skin. A 3-D model of the fingernail surface and skin is obtained with a stereo camera and laser striping system. Subsequent images from a single camera are registered to the 3-D model by adding fiducial markings to the fingernail. Calibration results with a force sensor show that the measurement range depends on the region of the fingernail and skin. A generalized least squares model is developed to predict fingertip force given coloration changes, and results for normal and shear force measurement are presented.     

A 6 Gbps/pin Low‐Power Half‐Duplex Active Cross‐Coupled LVDS Transceiver with Switched Termination

A novel linear switched termination active cross‐coupled low‐voltage differential signaling (LVDS) transceiver operating at 1.5 GHz clock frequency is presented. On the transmitter side, an active cross‐coupled linear output driver and a switched termination scheme are applied to achieve high speed with low current. On the receiver side, a shared preamplifier scheme is employed to reduce power consumption. The proposed LVDS transceiver implemented in an 80 nm CMOS process is successfully demonstrated to provide a data rate of 6 Gbps/pin, an output data window of 147 ps peak‐to‐peak, and a data swing of 196 mV. The power consumption is measured to be 4.2 mW/pin at 1.2 V.     

Structural and optical properties of AIN sputtering deposited on sapphire substrates with various orientations

AIN thin films were deposited on c-,a-and r-plane sapphire substrates by the magnetron sputtering technique.The in-fluence of high-temperature thermal annealing (HTTA) on the structural,optical properties as well as surface stoichiometry were comprehensively investigated.The significant narrowing of the (0002) diffraction peak to as low as 68 arcsec of AIN after HTTA implies a reduction of tilt component inside the AIN thin films,and consequently much-reduced dislocation densities.This is also supported by the appearance of E2(high) Raman peak and better Al-N stoichiometry after HTTA.Furthermore,the in-creased absorption edge after HTTA suggests a reduction of point defects acting as the absorption centers.It is concluded that HTTA is a universal post-treatment technique in improving the crystalline quality of sputtered AIN regardless of sapphire orienta-tion.