消泡剂在发酵工业中的应用

泡沫问题是发酵工业中一个棘手的问题,几乎所用的液体深层发酵都会用到天然或者化学消泡剂。在过去的发酵过程中,泡沫控制一般是依靠经验,关于消泡剂的系统知识较少。本文综述了发酵工业中消泡剂的种类和作用机制,以及消泡剂的应用进展。     

含氮、磷有机配体对(CdSe)_2量子点结构和电子性质的影响

使用密度泛函理论方法研究了量子点(CdSe)2与配体L(L=PH3、PH2Me、PHMe2、PMe3、NH3、NH2Me、NHMe2、NMe3)之间的相互作用及其产物的结构和性质。配体中的P或N原子与Cd原子上分别形成较强的Cd—P和Cd—N配位键,从而影响(CdSe)2的结构和电子性质。配体作用下,(CdSe)2的几何结构、电荷分布、轨道能级、吸收光谱等均发生变化,但2类配体的影响,尤其是甲基数目的影响,存在较大差异。     

磁场中双量子位Heisenberg模型的纠缠与量子相变

以双量子位Heisenberg模型为例,讨论了磁场方向对纠缠的影响。结果表明：一定温度下,保持磁场的大小不变,仅改变其方向,不仅能获得最大纠缠,还产生了量子相变。     

Infrared heat treatment of Ti-6Al-4V with electroplated Cu

The objective of this study is to investigate an innovative infrared (IR) technique to enhance adhesion of electroplated copper (Cu) on Ti-6Al-4V without dichromate dipping. The ultimate goal is to develop a Cu coating process on Ti-6Al-4V without hazardous hexavalent chromium (Cr) solution treatments. Cu coatings of around 50 μm were electroplated on Ti-6Al-4V specimens at a current density of 0.03 A/cm² in an acidic Cu solution. To improve adhesion of coatings, IR heat treatments were performed on the Cu-coated samples at different temperatures and durations: 860 °C for 600 s and 875 °C for 20–120 s. This process was accomplished in an attempt to replace the use of dichromate dipping before electroplating. For samples heat treated at 860 °C, no bonding existed, even after 600 s. It is believed that solid-state diffusion prevailed at 860 °C and that 600 s was not enough for sufficient diffusion to occur. Adhesion was poor when samples were heat treated at 875 °C for 20 s. Excellent adhesion was observed when the heat treatment holding time was increased to 40 s. For 90 s, the surface appearance of coatings partially changed from Cu-colored to a grayish color. There was no Cu left on the surface after a 120 s heat treatment. From optical microscopic observations on sample cross sections, an interlayer between the Cu and Ti-6Al-4V formed when heat treated at 875 °C for 40 s and longer. The interlayer thickness increased as the holding time increased, until depletion of Cu. The sheet resistivity of coated specimens was on the order of pure Cu for samples heat treated at 875 °C and less than 90 s. During the 875 °C heat treatment, the following occurred: solid-state diffusion of Cu in Ti-6Al-4V, formation of eutectic solutions, dissolution of Cu and Ti-6Al-4V into the liquid phase, and the formation of intermetallic compounds. The lowest eutectic temperature of 875 °C played a key role in this innovative process of Cu coating on Ti-6Al-4V. This paper was presented at the 2nd International Surface Engineering Congress sponsored by ASM International, on September 15–17, 2003, in Indianapolis, Indiana and appears on pp. 403–10 of the Proceedings.     

硬质合金磨削温度的实验研究

采用半人工和人工热电偶法，对硬质合金YG6和YT30平面磨削的磨削温度进行了实验研究。并对磨削参数与磨削温度的关系，进行了理论分析及实验验证。结果表明：磨削深度和工作台速度增加，磨削温度升高，但工作台速度的改变，对磨削温度的影响较小．     

TWO KINDS OF VARIANT IN SHAPE MEMORY MATERIAL

In shape memory materials,that have been trained to have a two way shape memory effect(TWSM),themartensitic variants are classified into two groups,i.e.,preferentially oriented variants and self-accommodatingvariants.Applied stress may promote or constrain the transition of preferentially oriented variants and so changetransformation temperatures but has no essential effect on self-accommodating variants.According to the pointof view mentioned above,some experimental phenomena during thermocycling of a TWSM device may be ex-plained,such as the absence of synchronization between the plot of resistance change.temperature and the plotof memory strain vs.temperature.     

一种新型不同容量逆变器并联方法

传统的逆变器并联方法一般只适用于功率容量一致的逆变器,针对不同容量逆变器的并联方法较少。本文在对几种不同容量逆变器并联方法分析研究的基础上,提出了一种新型的逆变器并联方法。该方法采用电压型逆变器和电流型逆变器混合并联的方式,利用电压型逆变器提供电压基准,电流型逆变器输出电流可以稳定电网电压,实现并联。该方法算法简单,适合大部分的逆变器并联场合,经过仿真和实验证明了其有效性和可行性。