一种基于ECDSA的USB存储设备访问控制方案

文章针对使用USB存储设备造成的内部泄密问题,提出了一种USB存储设备访问控制方案,该方案对用户的身份认证基于安全强度很高的椭圆曲线数字签名算法,同时使用过滤器驱动程序实现了USB存储设备的读写控制,因而此方案具有较好的安全性、实用性和通用性。     

A high-performance multichannel dual-gate poly-Si TFT fabricated by excimer laser irradiation on a floating a-Si thin film

A new excimer laser annealing (ELA) process that uses a floating amorphous-Silicon (a-Si) thin film with a multichannel structure is proposed for high-performance poly-Si thin-film transistors (TFTs). The proposed ELA method produces two-dimensional (2-D) grain growth, which can result in a high-quality grain structure. The dual-gate structure was employed to eliminate the grain boundaries perpendicular to the current flow in the channel. A multichannel structure was adapted in order to arrange the grain boundary to be parallel to the current flow. The proposed poly-Si TFT exhibits high-performance electrical characteristics, which are a high mobility of 504 cm/sup 2//Vsec and a low subthreshold slope of 0.337 V/dec.     

Development of a safety critical software requirements verification method with combined CPN and PVS: a nuclear power plant protection system application

Safety-critical software systems such as certain nuclear instrumentation and control (NI&C) systems should be developed with thorough verification. This study presents a method of software requirement verification with a case study for a nuclear power plant (NPP) protection system. The verification introduces colored petri net (CPN) for system modeling and prototype verification system (PVS) for mathematical verification. In order to aid flow-through from modeling by CPN to mathematical proof by PVS, an information extractor from CPN models has been developed in this paper. In order to convert the extracted information to the PVS specification language, a translator has also been developed. This combined method has been applied to the functional requirements of the Wolsong NPP Shut Down System #2 (SDS2); logical properties of the requirements were verified. Through this research, guidelines and a tool support for the use of formal methods have been developed for application to NI&C software verification.     

Development of core mode blocker with H/sub 2/-loaded Ge-B codoped fibres

A novel fabrication method of the core mode blocker by exposing H/sub 2/-loaded Ge-B codoped fibres to local electric arc discharge for application to the LPFGs-based tunable all-fibre bandpass filter with 6.5 nm bandwidth and 40 nm tuning range is presented.     

Exposed Die-Top Encapsulation Molding for an Improved High- Performance Flip Chip BGA Package

The recent advancement in high- performance semiconductor packages has been driven by the need for higher pin count and superior heat dissipation. A one-piece cavity lid flip chip ball grid array (BGA) package with high pin count and targeted reliability has emerged as a popular choice. The flip chip technology can accommodate an I/O count of more than five hundreds500, and the die junction temperature can be reduced to a minimum level by a metal heat spreader attachment. None the less, greater expectations on these high-performance packages arose such as better substrate real estate utilization for multiple chips, ease in handling for thinner core substrates, and improved board- level solder joint reliability. A new design of the flip chip BGA package has been looked into for meeting such requirements. By encapsulating the flip chip with molding compound leaving the die top exposed, a planar top surface can be formed. A, and a flat lid can then be mounted on the planar mold/die top surface. In this manner the direct interaction of the metal lid with the substrate can be removed. The new package is thus less rigid under thermal loading and solder joint reliability enhancement is expected. This paper discusses the process development of the new package and its advantages for improved solder joint fatigue life, and being a multichip package and thin core substrate options. Finite-element simulations have been employed for the study of its structural integrity, thermal, and electrical performances. Detailed package and board-level reliability test results will also be reported     

改性乳化沥青的发展和应用概况

综述了改性乳化沥青的发展及应用概况,重点讨论了改性乳化沥青的生产、制备工艺、稳定性影响因素,并对国内外改性乳化沥青的应用情况加以概述。     

基于MPEG-2文件的合并

介绍了具有相同音频、视频编码方式的MPEG - 2节目流如何合并成一个节目流。合并后的文件播放流畅并且时间显示正确 ,它包括PATPMT表的重写 ,系统头部分相关字段的更改 ,PCR值的修改 ,解码时间标签 (DTS)和显示时间标签 (PTS)的重新确定 ,传送速率的修改以及添加相应的空包     

Ethylene polymerization over MgO‐supported zirconocene catalysts

Supported zirconcene catalysts on a new support, MgO, were prepared and tested in ethylene polymerization. Three types of impregnation methods were employed to find an optimum supporting method for MgO. The direct impregnation of Cp₂ZrCl₂ on MgO showed low metal loading and polymerization activity, while the catalyst had a higher metal loading and polymerization activity when MgO was treated with methylaluminoxane (MAO) before supporting. Treatment of MgO with MAO during the supporting step invoked two types of catalytic sites, which was evidenced by the bimodal molecular weight distribution of the polymer products. MgO is considered to have potential as a support for metallocenes.     

混合动力电动汽车用电机及驱动控制器的电磁兼容设计

电机及驱动控制器作为电动汽车的关键部件,其电磁兼容设计对于保证电动汽车的可靠运行非常重要.介绍了国家十五项目中某混合动力轿车用电机及控制器系统的电磁兼容措施,分别从控制电路、信号电缆、功率电路及屏蔽机箱等工程角度进行了分析和设计.该系统的电磁兼容性符合GB/T17619-1998的要求,且已应用于实际混合动力电动汽车,运行情况良好.     

一种基于混沌同步的噪音衰减算法

论文提出了一种混沌通信系统的噪音衰减算法,该算法利用混沌同步现象在接收端获得正确的噪音估计值,从而从接收信号中滤除噪音恢复出正确的信号。通过数值仿真试验表明该方法是可行的。