Capillary self-alignment of polygonal chips: a generalization for the shift-restoring force

Capillary-driven self-alignment using droplets is currently extensively investigated for self-assembly and microassembly technology. In this technique, surface tension forces associated to capillary pinning create restoring forces and torques that tend to bring the moving part into the alignment. So far, most studies have addressed the problem of square chip alignment on a dedicated patch of a wafer, aiming to achieve 3D microelectronics. In this study, we investigate the shift-restoring forces for more complex moving parts such as regular—convex and non-convex—polygons and regular polygons with regular polygonal cavities. A closed-form approximate expression is derived for each of these polygonal geometries; this expression agrees with the numerical results obtained with the Surface Evolver software. For small shifts, it is found that the restoring force does not depend on the shift direction or on the polygonal shape. In order to tackle the problem of microsystem packaging, an extension of the theory is done for polygonal shapes pierced with connection vias (channels), and a closed form of the shift-restoring force is derived for these geometries and again checked against the numerical model. In this case, the restoring force depends on the shift direction. Finally, a non-dimensional number, the shift number, is proposed that indicates the isotropic or anisotropic behavior of the chip according to the shift direction.     

Real-time scalable hardware architecture for 3D-HEVC bipartition modes

This article presents a real-time scalable hardware architecture for the bipartition modes of 3D high-efficiency video coding (3D-HEVC) standard, which includes the depth modeling modes 1 (DMM-1) and 4 (DMM-4). A simplification of the DMM-1 algorithm was done, removing the refinement step. This simplification causes a small BD-rate increase (0.09 %) with the advantage of better using our hardware resources, reducing the necessary memory required for storing all DMM-1 wedgelet patterns by 30 %. The scalable architecture can be configured to support all the different block sizes supported by the 3D-HEVC and also to reach different throughputs, according to the application requirements. Then, the proposed solution can be efficiently used for several encoding scenarios and many different applications. Synthesis results considering a test case show that the designed architecture is capable of processing HD 1080p videos in real time, but with other configurations, higher resolutions are also possible to be processed.     

Lead‐Free Polycrystalline Ferroelectric Nanowires with Enhanced Curie Temperature

Ferroelectrics are important technological materials with wide‐ranging applications in electronics, communication, health, and energy. While lead‐based ferroelectrics have remained the predominant mainstay of industry for decades, environmentally friendly lead‐free alternatives are limited due to relatively low Curie temperatures (T _C) and/or high cost in many cases. Efforts have been made to enhance T _C through strain engineering, often involving energy‐intensive and expensive fabrication of thin epitaxial films on lattice‐mismatched substrates. Here, a relatively simple and scalable sol–gel synthesis route to fabricate polycrystalline (Ba_0.85Ca_0.15)(Zr_0.1Ti_0.9)O₃ nanowires within porous templates is presented, with an observed enhancement of T _C up to ≈300 °C as compared to ≈90 °C in the bulk. By combining experiments and theoretical calculations, this effect is attributed to the volume reduction in the template‐grown nanowires that modifies the balance between different structural instabilities. The results offer a cost‐effective solution‐based approach for strain‐tuning in a promising lead‐free ferroelectric system, thus widening their current applicability.     

A new biobased plasticizer for poly(vinyl chloride) based on epoxidized cottonseed oil

The use of epoxidized cottonseed oil as plasticizer for poly(vinyl chloride) was studied. The plasticizer content was set to 70 phr and the optimum isothermal curing conditions were studied in the temperature range comprised between 160 and 220 °C with varying curing times in the 7.5–17.5 min range. The influence of the curing conditions on overall performance of cured plastisols was followed by the evolution of mechanical properties (tensile tests with measurements of tensile strength, elongation at break, and modulus), change in color, surface changes of fractured samples by scanning electron microscopy (SEM), thermal transitions by differential scanning calorimetry, and migration in n‐hexane. The optimum mechanical features of cured plastisols are obtained for curing temperatures in the 190–220 °C range. For these curing conditions, fractography analysis by SEM gives evidences of full curing process as no PVC particles and free plasticizer can be found. © 2016 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2016 , 133, 43642.