轧钢加热炉高效运行的新模式

介绍了综合应用新型无水冷技术和热管技术的轧钢加热炉高效运行的新模式，并结合首钢第一线材厂的实践，进一步阐明了该模式的实用性和给企业带来的良好效益。     

从诸葛亮的失误谈领导者人才管理理念的更新

知识经济时代,人力资源的管理与开发成为企业在激烈的市场竞争中决定成败的关键。然而,由于受到传统文化思想潜移默化的影响和束缚,一些企业的领导者在对待人才的管理、培养和使用上存在误区,导致企业的“核心软件”即人力资源管理不能正常发挥作用。企业领导者应以史为鉴,更新人才管理理念。     

Determination of polymer–polymer interaction parameters using inverse gas chromatography

A modified method is discussed that is based on Farooque and Deshpande's method to obtain polymer–polymer interaction parameters using inverse gas chromatography (IGC) data. In the Farooque and Deshpande method, the ratio of the difference of probe–polymer interaction parameters between two polymers and the probe volume [(χ₁₂ ? χ₁₃)/V₁] is used as the abscissa. In the modified method, the ratio [(?₂χ₁₂ + ?₃χ₁₃)/V₁] is used as the abscissa. Experimental data previously reported for a poly(?‐caprolactone)‐polyepichlorohydrin (PCL/PECH) blend and a poly(ethyl acrylate)‐poly(vinyl propionate) (PEA/PVPr) blend are analyzed. It is found that the slopes obtained by the new method had smaller deviations from the theoretical values than the Farooque and Deshpande method. The standard deviations of both slopes and intercepts obtained from the new method are also smaller. Using the new method, the polymer–polymer interaction parameters obtained from the intercept are negative numbers for the PCL/PECH system and very small positive numbers for PEA/PVPr. Explanations are given for the probe and concentration dependency of the polymer–polymer interaction parameters that are generally observed in IGC studies. A new method for selecting the best probe for calculating the interaction parameter is discussed. © 2003 Wiley Periodicals, Inc. J Appl Polym Sci 90: 671–680, 2003     

A Novel Segmentation and Feedback Model for Resolving Contention in Optical Burst Switching

A novel segmentation and feedback model (SFM) applied to resolve contention is proposed. Simulation and performance analyses show that the SFM effectively avoids contentions in optical burst switching (OBS). The long delay time of deflection routing and the immature technology of wavelength converters and optical buffers are not deployed in the SFM. The SFM does not only realize fast switching but also allows preemption by higher priority bursts.     

Design of photonic crystal fibers for dispersion-related applications

A general procedure for design of photonic crystal fibers (PCFs) with desirable dispersion properties is presented. The design model is based on the combination of a rigorous vector mode solver and a scaling transformation for the dispersion properties of the PCFs. In comparison with the conventional design method, the new design procedure is more efficient and can be readily automated for the purpose of design optimization. Several applications of the design procedure, e.g., the design optimization for dispersion shifted fibers, dispersion flattened fibers, and dispersion compensation fibers, are demonstrated and discussed.     

Mutual coupling of two collocated orthogonally oriented circular thin-wire loops

Coupling between two collocated orthogonal circular thin-wire loops is analyzed in this paper. Two coupled integral equations for the loop currents are derived and their solution in general form is found in terms of Fourier series. An analytical expression for currents induced through the mutual coupling is obtained for the case when all loop current harmonics higher than first can be ignored. It is found that strong coupling can exist for all loop current harmonics, except for the fundamental. It is also found that coupling for orthogonal collocated loop antennas depends on the relative locations of the loop terminals.     

无线光接入技术

无线光通信系统以其高带宽、低成本和安装迅捷等优势成为非常有竞争力的光接入新技术。对无线光通信系统的关键技术、主要优势和存在的问题及国内外相关产品的发展状况和主要特点进行了论述和介绍。     

Hermetic Packaging Using Eutectic SnPb Solder and Cr/Ni/Cu Metallurgy Layer

We have developed an easy, low-cost, and low-temperature optoelectronic hermetic packaging technology utilizing the eutectic SnPb solder and the Cr/Ni/Cu bonding pad. Bonding characteristics of the design were investigated in three different setups: silicon-silicon, silicon-glass, and glass-glass samples. Hermeticity was achieved at 200 degC without flux for all samples during the final bonding process. The bonding pads did not dewet during or after the reflow process. By utilizing the eutectic SnPb solder, the self-alignment process can be achieved. Because the bonding process was conducted through visual alignment, original misalignment was estimated to be more than 100 mum. The surface tension of melting solder during the reflow process allowed the samples to self-align and obtain a misalignment of less than 20 mum after solidification, which was 4% of the entire solder width. The bonding strength of the three setups ranged from 3 to 10 MPa. Among the three setups, glass-glass samples appear to have the strongest bonding strength. This low-temperature and cost-effective soldering process has demonstrated its feasibility and potential utilization in optoelectronic packaging     

Measurement of gain spectrum for Fabry-Perot semiconductor lasers by the Fourier transform method with a deconvolution process

To improve the accuracy of measured gain spectra, which is usually limited by the resolution of the optical spectrum analyzer (OSA), a deconvolution process based on the measured spectrum of a narrow linewidth semiconductor laser is applied in the Fourier transform method. The numerical simulation shows that practical gain spectra can be resumed by the Fourier transform method with the deconvolution process. Taking the OSA resolution to be 0.06, 0.1, and 0.2 nm, the gain-reflectivity product spectra with the difference of about 2% are obtained for a 1550-nm semiconductor laser with the cavity length of 720 /spl mu/m. The spectra obtained by the Fourier transform method without the deconvolution process and the Hakki-Paoli method are presented and compared. The simulation also shows that the Fourier transform method has less sensitivity to noise than the Hakki-Paoli method.     

超深亚微米非对称Halo LDD低功耗新器件的研究分析

提出了一种新的器件结构——非对称Halo L DD低功耗器件,该器件可以很好地抑制短沟效应,尤其可以很好地改善DIBL效应、热载流子效应以及降低功耗等,是低功耗高集成度电路的优选结构之一.分析了非对称HaloL DD器件的主要特性,并将其与常规结构、非对称L DD结构、非对称Halo结构的器件进行了比较并进行了参数优化分析.