Aircraft type recognition in satellite images

This paper proposes a hierarchical classification algorithm to accurately recognise aircraft in satellite images. Before recognition, a novel symmetry-based algorithm is proposed to estimate an aircraft's optimal orientation for rotation correction. Then, distinguishable features are derived from each aircraft for aircraft recognition. However, different features have different discrimination abilities to recognise the types of aircraft. Therefore, a novel booting algorithm is proposed to learn a set of proper weights from training samples for feature integration. Owing to this integration, significant improvements in terms of recognition accuracy and robustness can be achieved. Last, a hierarchical recognition scheme is proposed to recognise the types of aircraft by using the area feature, first for a rough categorisation on which detailed classifications are then achieved using several suggested features. Experiments were conducted on a wide variety of satellite images. Experimental results reveal the feasibility and validity of the proposed approach in recognising aircraft in satellite images.     

Fabrication of 1.55 μm VCSELs on Si using metallic bonding

Using AuGeNiCr multilayered metals as the wafer bonding medium, long-wavelength GaInAsP/InP vertical cavity surface emitting lasers employing Al-oxide/Si as the upper and lower distributed Bragg reflectors were fabricated on Si substrate with the bonding interface formed outside the vertical cavity surface emitting laser cavity. Laser emission at 1.545 μm was measured under pulsed operations near room temperature. The low-temperature metallic bonding process demonstrates a great potential in device fabrication     

Intermetallic growth of wire-bond at 175°C high temperature aging

Two types of samples were applied in this wire-bond evaluation work for an Al-pad diffusion process. One was finished product for the cross-section examination of wire-bond and the other was without compound encapsulant used for the plane view examination of wire-bond interface. These samples were aged at 175 C in air from 0 h to 1008 h. It is found that the normal product which was ready on board existed ∼1 μm Au₂Al and Au₅Al₂ phases. The Au₂Al phase was then transformed to Au₅Al₂ phase in a 4 ∼ 72 h aging period. The Au₄Al phase formed along with the Au₅Al₂ phase in 72 h to 240 h aging period showing some porosity within the reacted phases. The total phase thickness increased to ∼4μm after 240 h aging. The Au₄Al phase became the major phase after 336 aging h. The reacted phase layer thickness increased to ∼6 μm and reached the steady state. A titanium-rich thin layer was also induced within the reacted phase layer. Three ternary phases as AlAu₂Ti, AlAuTi, and Al₂Au₂Ti are found in this titanium-rich layer. In particular, Al₂Au₂Ti could be a new phase.     

大尺寸TFT-LCD电视的彩色和图像增强

最近几年,薄膜晶体管液晶显示器(TFT-LCD)技术取得了快速而显著的进步,其性能超过了PDP、CRT以及投影显示。毫无疑问,TFT-LCD已经成为高清电视应用的最佳实现方案。本文将介绍进一步增强大尺寸LCD电视的彩色和图像性能的技术。     

Wideband microwave filter constructed by asymmetrical compact microstrip resonator and floating plate coupling structure

The realisation of a microwave filter is presented by using the asymmetrical compact microstrip resonator and floating plate coupling structures. The filter demonstrates the properties of low insertion loss, wide pass bandwidth and two controllable transmission zeros, which results in fast roll-off responses near to the corner frequencies of the passband. It also has the advantages of compact size, ease of fabrication and absence of via holes. An X-band prototype with 34% fractional bandwidth was designed and fabricated to verify the proposed design concept. Good agreement between simulation and measurement was obtained.     

Ball Impact Reliability of Zn-Sn High-Temperature Solder Joints Bonded with Different Substrates

In this study, the high-speed deformation behavior of solder joints formed with Pb-free Zn-Sn and commercial Pb-Sn alloys bonded on different substrates was investigated by the ball impact test method. Overall, Zn-Sn joints exhibited greater impact strength but inferior impact toughness than Pb-Sn joints. This can be ascribed to the high hardness of Zn-Sn solders resulting in partial or overall interfacial fracture. In contrast, the joints with soft Pb-Sn solders all showed a ductile fracture feature. It is suggested that, for the joints revealing brittle fracture, the impact toughness (impact energy) increased with the plastic ability of interfacial intermetallic compounds, while for those showing a ductile fracture mode, the impact energy deteriorated with a hardened solder matrix resulting from substrate dissolution.     

Investigation of a solid-state detector for advanced computed tomography

Utilization of solid-state detectors for computed tomography (CT) has been the focus of many studies. Previous phantom and clinical experiments have shown that one of the important performance parameters for the solid-state detector is the primary speed and afterglow. In this paper, we present a detailed investigation on the signal decay characteristics of the HiLight (GE Medical Systems, Milwaukee, WI) scintillating detector. The detector primary speed and afterglow are modeled by a multiexponential function and fully characterized by a set of time constants and relative strengths. The sensitivity of these parameters to X-ray photon energy, detector aging, and radiation exposure is then established and analyzed. No statistically significant variation is observed in these parameters due to changes in the above external variables. The impact of various decay time constants on CT image quality, such as spatial resolution, noise, and artifacts, is subsequently illustrated with computer simulations and phantom experiments. Finally, an algorithmic correction scheme is derived to compensate for detector afterglow. The correction scheme employs a recursive filter to remove adverse effects of the detector decay on image quality. Experimental results have shown that the correction scheme successfully restores system spatial resolution, produces a more homogeneous noise pattern, and eliminates ring-band image artifacts due to detector afterglow. The effectiveness and robustness of the correction scheme are demonstrated by extensive phantom and clinical experiments.     

Application of an auto-tuning neuron to sliding mode control

This paper presents a control strategy that incorporates an auto-tuning neuron into the sliding mode control (SMC) in order to eliminate the high control activity and chattering due to the SMC. The main difference between the auto-tuning neuron and the general one is that a modified hyperbolic tangent function with adjustable parameters is employed. In this proposed control structure, an auto-tuning neuron is then used as the neural controller without any connection weights.. The control law will be switched from the sliding control to the neural control, when the state trajectory of system enters in some boundary layer. In this way, the chattering phenomenon will not occur. The results of numerical simulations are provided to show the control performance of our proposed method.     

Dynamics analysis and controller synthesis forzero-voltage-transition PWM power converters

A small signal model for zero-voltage-transition pulse width modulation (ZVT-PWM) buck converters is proposed in this paper. It shows that the ZVT-PWM buck converter exhibits better dynamical behavior than the conventional PWM buck converter. Based on the derived model consisting of line voltage disturbances and load variations, μ-synthesis is applied for a robust controller design to achieve performance requirement. In addition, a classical controller and a sliding mode controller with modified integral variable structure are also designed for performance comparisons. Finally, simulation and experimental results are presented to verify the requirement for robust performance of ZVT-PWM converters     

Effect of oval defects in GaAs on the reliability of SiNx metal–insulator–metal capacitors

In this paper, we will assess the reliability of extrinsic defects in SiN_x metal–insulator–metal (MIM) capacitors as part of a GaAs high voltage (HV) FET process. The epitaxial GaAs layers used for this process contain a density of oval defects. Since the SiN_x is deposited at low temperatures, the MIM capacitors are amorphous and will always contain a certain amount of extrinsic defects. It will be shown that the number of extrinsic defects depends on the presence of the oval defects in the epitaxial GaAs layers. The reliability assessment will be done using electric field breakdown (Ebd), time dependent dielectric breakdown (TDDB) measurements and visual inspection. It will be shown that this combination can lead to an estimate of the lifetime and screening of capacitors containing extrinsic defects.