Control of structure and tack properties of acrylic pressure‐sensitive adhesives designed by a polymerization process

Free radical emulsion polymerization of methyl methacrylate (MMA) and 2‐ethylhexyl acrylate (EHA) results in the synthesis of pressure‐sensitive adhesives (PSAs) with good tack properties. Management of both the copolymer composition and the polymerization process allows one to control the behavior of the PSA. Semicontinuous (SC) processes create polymer particles whose instantaneous composition is close to that of the feed particle The SC Mixture process (continuous feeding with comonomer blends) affords nearly homogeneous latex particles and PSA films. The SC Gradient process (separate feedings at inversely varying rates) affords heterogeneous particles and films. The Batch process leads to somewhat heterogeneous films, but the hard (MMA‐rich) microdomains are made compatible with their soft (EHA‐rich) matrix because of the assumed formation of tapered‐type copolymers. Tack measurements indicate the importance of the particle and film structures. Too much hardness or softness leads to unacceptable lacks of adhesion and cohesion, respectively. Homogeneous structures prove adequate, but their tack properties collapse with rising temperature. Heterogeneous structures, with extensive phase segregation, prove unsatisfactory because they lack adhesion and cohesion. Finally, the association of well‐balanced composition and compatible heterogeneity is the criterion for suitable PSA behavior. © 2003 Wiley Periodicals, Inc. J Appl Polym Sci 89: 2749–2756, 2003     

Bottlenecks and strategies of green mold compounds

The mold compound protects integrated circuit (IC) devices from the environmental attacks (e.g., moisture, contaminants) for its lifetime. Driven by market pressure, environmental regulations, the electronics industry is migrating to provide environmental friendly ("green") products and systems. Two major changes associated with this migration are elimination of lead and toxic halogens from the products. Thus, the halogen-free mold compound will be a part of the "green" IC package. The migration to lead-free electronics impacts the current nongreen IC packaging technology, cost and reliability of manufacturers. This article presents the technology challenges and development trend that manufacturers and end users are facing right now with the introduction of green mold compounds.     

广州地铁集中冷站的自动控制

本文介绍广州地铁二号线集中冷站的空调制冷自动控制系统的设计，对其控制原理与节能优化进行分析。     

Low RF noise and power loss for ion-implanted Si having an improved implantation process

Very-low-transmission line noise of <0.25 dB at 18 GHz and low power loss /spl les/0.6 dB at 110 GHz have been measured on transmission lines fabricated on proton-implanted Si. In contrast, a standard Si substrate gave much higher noise of 2.5 dB and worse power loss of 5 dB. The good RF integrity of proton-implanted Si results from the high isolation impedance to ground, as analyzed by an equivalent circuit model. The proton implantation is also done after forming the transmission lines at a reduced implantation energy of /spl sim/4 MeV. This enables easier process integration into current VLSI technology.     

Flammability and thermal stability studies of ABS/Montmorillonite nanocomposite

Acrylonitrile–butadiene–styrene (ABS)/montmorillonite nanocomposites have been prepared using a direct melt intercalation technique by blending ABS and organophilic clay of two different particle sizes: OMTa (5 µm) and OMTb (38 µm). Their structure and flammability properties were characterized by X‐ray diffraction, high resolution electronic microscopy (HREM), thermogravimetric analysis (TGA) and cone calorimeter experiments. The results of HREM showed that ABS/5 wt% OMTa nanocomposite was a kind of intercalated–delaminated structure, while ABS/5 wt% OMTb nanocomposite was mainly an intercalated structure. The nanocomposites showed a lower heat release rate peak and higher thermal stability than the original ABS by TGA and cone calorimeter experiments. Also, the intercalated nanocomposite was more effective than an exfoliated–intercalated nanocomposite in fire retardancy. Copyright © 2003 Society of Chemical Industry     

基于MOBILE的JK触发器设计

介绍了一种新型量子逻辑单元电路——单稳双稳转换逻辑单元及其工作原理,在此基础上探讨并设计了以MOBILE为基本单元电路的具有同步置位复位功能的边沿型JK触发器电路,从而丰富了量子电路中触发器的类型     

二维地震过障碍观测系统模式及其参数设计

在二维地震勘探中,为了避免因地表障碍物使地震反射剖面出现间断现象,需要改变观测系统设计,跨越障碍物(江河、城镇等),以保证反射同相轴能连续追踪对比。在以往地震勘探中,有时因过障碍观测系统设计不合理,不但增加勘探费用,而且影响采集质量。因此只有科学合理地设计过障碍观测系统模式和参数,才能保证地震测线顺利通过障碍物,得到较好的障碍物下方的地震资料并降低勘探成本。为此本文在调查和研究大量野外实际的过障碍观测系统的基础上,总结归纳成三大类过障碍观测系统模式,并分析其特点和应用范围。采用图解法,推导出主要模式的跨越宽度、最小炮检距及最大炮检距等参数公式。采用这套过障碍观测模式不仅可以得到和障碍区两侧等质量的地震资料,而且可以有效地降低勘探成本。     

高功率双工旋转场移相器

旋转场移相器具有移相精度高(均方根误差可小于1°)和温度稳定性好等特点,通过改进射频传输结构,可大大提高他的功率容量。利用旋转场移相器的互易特性和铁氧体圆极化器的非互易特性,设计出高功率双工旋转场移相器。其双工特性可将收/发信号分开,实现移相器和环行器的双重功能,用于天线的收发通道等场合时,可省去一个高功率环行器,结构紧凑。分析了双工旋转场移相器的工作原理,阐述了高功率应用下的设计方法,推导出了管状铁氧体的相移量计算公式,按此方法设计了实用的器件,并给出了试验数据。     

A One‐Kilobit PQR‐CMOS Smart Pixel Array

The photonic quantum ring (PQR) laser is a three dimensional whispering gallery (WG) mode laser and has anomalous quantum wire properties, such as microampere to nanoampere range threshold currents and √T‐dependent thermal red shifts. We observed uniform bottom emissions from a 1‐kb smart pixel chip of a 32×32 InGaAs PQR laser array flip‐chip bonded to a 0.35 µm CMOS‐based PQR laser driver. The PQR‐CMOS smart pixel array, now operating at 30 MHz, will be improved to the GHz frequency range through device and circuit optimization.