Effects of cobalt and potassium doping on thermal stability and electrical properties of radiation grafted acrylic acid onto poly(tetrafluoroethylene ethylene) copolymer films

Grafted copolymer of poly(tetrafluoroethylene ethylene) (ET) with acrylic acid (AAc) was prepared by direct radiation method. The obtained films were modified by treating with small amounts of Co²⁺ and K⁺ ions (1.0 wt %). The effects of such treatment on the thermal stability and electrical conductivity of these films were studied. Cobalt treatment did not much affect the thermal degradation of the films. The results obtained revealed that k⁺ treatment enhanced the thermal degradation of ET‐g‐PAAc, which started 273 K lower than that observed in the case of the untreated and Co²⁺‐treated films. Potassium and cobalt treatment of the investigated films increased their electrical conductivity (σ) and decreased the activation energy ΔE_σ. The increase in σ values was, however, more pronounced in the case of K⁺‐treated film. These results were discussed in terms of the effective increase in the hydrophilicity of the films, especially those treated with potassium. © 2005 Wiley Periodicals, Inc. J Appl Polym Sci 97: 867–871, 2005     

Advanced underfill for high thermal reliability

The key to the success of flip‐chip technology lies in the availability of sucessful underfill materials. However, the reliability of flip‐chip technology using current underfill materials is generally found to be lower than that of conventional wire‐bond connection packaging materials such as epoxy molding compound (EMC) because of the high coefficients of thermal expansion (CTE) and moisture absorption of cured underfill material. In this study desbimide (DBMI), which has a low melting point (about 80°C), was used in the underfill materials as a cohardener. As a result, DBMI‐added underfill can show excellent thermal reliability, which is due to the superior properties of the CTE, the elastic modulus, and water resistance. When the properties of a 2 wt % DBMI‐added underfill were compared with those of a typical underfill (epoxy/anhydride), the CTE value was reduced to less than one‐half at the solder reflow temperature (about 200°C), the elastic modulus was reduced to less than one‐half in the temperature region below the glass‐transition temperature, and the water resistance was improved twofold. © 2002 Wiley Periodicals, Inc. J Appl Polym Sci 83: 2617–2624, 2002     

Curing kinetics and mechanical properties of epoxy nanocomposites based on different organoclays

The effect of different organoclays and mixing methods on the cure kinetics and properties of epoxy nanocomposites based on Epon828 and Epicure3046 was studied. The two kinds of organoclay used in this study, both based on natural montmorillonite but differing in intercalant chemistry, were I.30E (Nanomer I.30E—treated with a long‐chain primary amine intercalant) and C.30B (Cloisite 30B—treated with a quaternary ammonium intercalant, less reactive with epoxy than the primary amine). The two mixing processes used to prepare the nanocomposites were (i) a room‐temperature process, in which the clay and epoxy are mixed at room temperature, and (ii) a high‐temperature process, in which the clay and epoxy are mixed at 120°C for 1 h by means of mechanical mixing. The nanocomposites were cured at room temperature and at high temperature. The quality of dispersion and intercalation/exfoliation were analyzed by scanning electron microscopy, transmission electron microscopy, and X‐ray diffraction. The heat evolution of the epoxy resin formulation and its nanocomposite systems was measured using differential scanning calorimetry at different heating rates of 2.5, 5, 10, 15, and 20°C min^?1. The cure kinetics of these systems was modeled by means of different approaches. Kissinger and isoconversional models were used to calculate the kinetics parameters while the Avrami model was utilized to compare the cure behavior of the epoxy systems. The cure kinetics and mechanical properties were found to be influenced by the presence of nanoclay, by the type of intercalant, and by the mixing method. POLYM. ENG. SCI., 47:649–661, 2007. © 2007 Society of Plastics Engineers.     

Synthesis and properties of polyimide (containing naphthalene) nanocomposites with organo‐modified montmorillonites

2,7‐Bis(4‐aminophenoxy) naphthalene (BAPN), a naphthalene‐containing diamine, was synthesized and polymerized with a 3,3′,4,4′‐benzophenone tetracarboxylic dianhydride (BTDA) to obtain a polyimide (PI) via thermal imidization. To enhance the thermal and mechanical properties of the polymer, PI–Montmorillonite (MMT) nanocomposites were prepared from a DMAc solution of poly(amic acid) and a DMAc dispersion of MMT, which were organo‐modified with various amounts of n‐dodecylamine (DOA) or cetylpyridium chloride (CPC). FTIR, XRD, and TEM (transmission electron microscopy) were used to verify the incorporation of the modifying agents into the clay structure and the intercalation of the organoclay into the PI matrix. Results demonstrated that the introduction of a small amount of MMT (up to 5%) led to the improvement in thermal stability and mechanical properties of PI. The decomposition temperature of 5% weight loss (T_d,5%) in N₂ was increased by 46 and 36°C in comparison with pristine PI for the organoclay content of 5% with DOA and CPC, respectively. The nanocomposites were simultaneously strengthened and toughened. The dielectric constant, CTE, and water absorption were decreased. However, at higher organoclay contents (5–10%), these properties were reduced because the organoclay was poorly dispersed and resulted in aggregate formation. The effects of different organo‐modifiers on the properties of PI–MMT nanocomposite were also studied; the results showed that DOA was comparable with CPC. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci, 2006     

Dependence of the Microstructure and the Electrical Properties of Lanthanum-Substituted (Na1/2Bi1/2)TiO3 on Cation Vacancies

The sintering and electrical characteristics of La-modified Na_1/2Bi_1/2TiO₃ (NBT) was investigated from a defect structure viewpoint. To reveal the role of cation vacancies, two series of ceramics, with different cation vacancies, were processed to compensate the excess positive charge of lanthanum ions. In a region of complete solid solution, the grain size of NBLT-B {[(Na_0.5Bi_0.5)_{1− x} La _x ]Ti_{1−0.25 x} O₃} was smaller than that of NBLT-A {[(Na_0.5Bi_0.5)_{1−1.5 x} La _x ]TiO₃} and densification was enhanced more effectively in NBLT-B. With the aid of thermoelectric power, electric conductivity, and electrotransport measurements, it was found that different sintering behaviors between NBLT-A and NBLT-B specimens were related to the change in the type of cation vacancies present and that lanthanum ion–cation vacancy pairs played an important role in reducing the grain growth and enhancing the densification process.     

Synthesis and luminescence properties of new blue‐light‐emitting polyconjugated poly{1,1′‐biphenyl‐4,4′‐diyl‐[1‐(4‐t‐butylphenyl)]vinylene} polymers and copolymers

Three new soluble polyconjugated polymers, all of which emitted blue light in photoluminescence and electroluminescence, were synthesized, and their luminescence properties were studied. The polymers were poly{1,1′‐biphenyl‐4,4′‐diyl‐[1‐(4‐t‐butylphenyl)]vinylene}, poly((9,9‐dioctylfluorene‐2,7‐diyl)‐alt‐{1,4‐phenylene‐[1‐(4‐t‐butylphenyl)vinylene‐1,4‐phenylene]}) [P(DOF‐PVP)], and poly([N‐(2‐ethyl) hexylcarbazole‐3,6‐diyl]‐alt‐{1,4‐phenylene‐[1‐(4‐t‐butylphenyl)]vinylene‐1,4‐phenylene}). The last two polymers had alternating sequences of the two structural units. Among the three polymers, P(DOF‐PVP) performed best in the light‐emitting diode devices of indium–tin oxide/poly(ethylenedioxythiophene) doped with poly(styrene sulfonate) (30 nm)/polymer (150 nm)/Li:Al (100 nm). This might have been correlated with the balance in and magnitude of the mobility of the charge carriers, that is, positive holes and electrons, and also the electronic structure, that is, highest occupied molecular orbital (HOMO) and lowest unoccupied molecular orbital (LUMO) levels, of the polymers. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 100: 307–317, 2006     

Effect of time/temperature treatment parameters on depolymerization of chitosan

Depolymerization of the biopolymer chitosan by an autoclaving process at 121°C and 15 psi was investigated using various treatments. Acetic acid was found to be the most effective solvent in decreasing chitosan viscosity among the six organic acids tested. The rate of viscosity decrease increased with increasing chitosan concentration. The viscosity of 1% chitosan in 1% acetic acid decreased rapidly to 91% of the initial viscosity following the initial 15 min of autoclaving. This decreased gradually to 93% and 94% in 30 and 60 min, respectively, without being adversely affected by the chitosan solution volume. The degree of deacetylation was comparable before and after autoclaving for 60 min. Chitosan at three molecular weights (M_r = 1597, 1110, and 789 kDa) decreased in molecular weight by 46%–51% in the 15‐min treatment, 55%–60% in the 30‐min treatment, and 60%–62% in the 60‐min treatment. The addition of 0.1%–1.0% (v/v) concentrations of hydrogen peroxide to the chitosan solution autoclaved for 15 min decreased viscosity by 94%–98% and molecular weight by 69%–83%. This process is a simple, timesaving, homogeneous depolymerization procedure, and it is possible to prepare partially hydrolyzed chitosan with specified molecular weights by regulating the time of treatment. © 2003 Wiley Periodicals, Inc. J Appl Polym Sci 87: 1890–1894, 2003     

Properties of chitosan‐based biopolymer films with various degrees of deacetylation and molecular weights

An increase in the depolymerization of chitosan was found with an increased concentration of sodium perborate. Acetic anhydride was added to reacetylated chitosan in a molar ratio per gulcosamine unit, and the amide I band of IR spectra changed with the addition of acetic anhydride. Sixteen chitosans with various molecular weights (MWs) and degrees of deacetylation (DODs) were prepared. X‐ray diffraction patterns indicated their amorphous and partially crystalline states. Increases in the chitosan MW and DOD increased the tensile strength (TS). TS of the chitosan films ranged from 22 to 61 MPa. However, the elongation (E) of chitosan films did not show any difference with MW. TS of chitosan films decreased with the reacetylation process. However, E of chitosan films was not dependent on DOD. The water vapor permeabilities (WVPs) of the chitosan films without a plasticizer were between 0.155 and 0.214 ng m/m² s Pa. As the chitosan MW increased, the chitosan film WVP increased, but the values were not significantly different. Moreover, the WVP values were not different from low DOD to high DOD. © 2003 Wiley Periodicals, Inc. J Appl Polym Sci 89: 3476–3484, 2003     

Novel method for preparation of quaternary ammonium ionomer from epoxidized styrene–butadiene–styrene triblock copolymer and its use as compatibilizer for blending of styrene–butadiene–styrene and chlorosulfonated polyethylene

A novel method for the preparation of a quaternary ammonium ionomer of styrene–butadiene–styrene triblock copolymer (SBS) was developed by a ring‐opening reaction of epoxidized SBS with triethylamine hydrochloride in the presence of a phase transfer catalyst. The optimum conditions were studied. The ionomer was characterized by quantitative analysis, IR spectroscopy, and ¹H‐NMR spectroscopy. Its water absorbency, oil absorbency, dilute solution viscosity, and use as a compatibilizer for the blending of SBS and chlorosulfonated polyethylene (CSPE) were investigated. The results showed that, under optimum conditions, the epoxy groups can be completely converted to the quaternary ammonium groups. The IR spectrum did not exhibit the absorption peak for quaternary ammonium groups, whereas the ¹H‐NMR spectrum and titration method demonstrated it. With increasing ionic group content, the water absorbency of the ionomer increased whereas its oil absorbency decreased. These indicated the amphiphilic character of the SBS ionomer. The dilute solution viscosity of the ionomer in toluene/methanol (9/1) solvent increased with increasing quaternary ammonium group content. The ionomer was used as a compatibilizer for the blends of SBS and CSPE. The addition of a small amount of the ionomer to the blend enhanced the mechanical properties of the blends: 2 wt % ionomer based on the blend increased the tensile strength and ultimate elongation of the blend nearly 2 times. The blends of equal parts SBS and CSPE behaved as oil‐resistant thermoplastic elastomers. © 2005 Wiley Periodicals, Inc. J Appl Polym Sci 99: 1975–1980, 2006     

Exothermic effect in the process of electron‐beam curing of epoxy resins

Temperature measurements have been performed in the process of electron‐beam curing of EB‐I and EB‐II epoxy resin systems. The influence of initiator content, resin type, and dose rate on the temperature of the systems was studied. Transverse and longitudinal temperatures of samples in the glass vessel were also analyzed. The nature of temperature curves varied with the different epoxy resin systems in the steel mold, but did not change with different contents of the initiator. At the same time, the heat had no effect on the gel fraction of epoxy resin systems. The temperature curve was greatly affected by the dose rate, and its peak value, peak width, and plateau value also increased with it. The transverse temperature of EB‐II glass vessel samples increased as the radiation dose increased and, in the same sample, the temperature reduced as the distance between the radiation center and the test point increased. The longitudinal temperature of EB‐I and EB‐II resin systems in a glass vessel decreased as the radiation depth increased. As the radiation dose increased, the temperature of the EB‐I resin system increased simultaneously, while that of the EB‐II resin system initially increased and then kept constant when the dose reached a certain value. The temperatures of these two resin systems decreased rapidly when the radiation process stopped. © 2004 Wiley Periodicals, Inc. J Appl Polym Sci 94: 2217–2222, 2004