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21.
End-to-End QoS for Video Delivery Over Wireless Internet   总被引:6,自引:0,他引:6  
Providing end-to-end quality of service (QoS) support is essential for video delivery over the next-generation wireless Internet. We address several key elements in the end-to-end QoS support, including scalable video representation, network-aware end system, and network QoS provisioning. There are generally two approaches in QoS support: the network-centric and the end-system centric solutions. The fundamental problem in a network-centric solution is how to map QoS criterion at different layers respectively, and optimize total quality across these layers. We first present the general framework of a cross-layer network-centric solution, and then describe the recent advances in network modeling, QoS mapping, and QoS adaptation. The key targets in end-system centric approach are network adaptation and media adaptation. We present a general framework of the end-system centric solution and investigate the recent developments. Specifically, for network adaptation, we review the available bandwidth estimation and efficient video transport protocol; for media adaptation , we describe the advances in error control, power control, and corresponding bit allocation. Finally, we highlight several advanced research directions.  相似文献   
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In the literature the concept of representative volume element (RVE) was introduced to correlate the effective or macroscopic properties of materials with the properties of the microscopic constituents and microscopic structures of the materials. However, to date little quantitative knowledge is available about minimum RVE sizes of various engineering materials. In our recent paper [J. Mech. Phys. Solids 50 (2002) 881], a new definition of minimum RVE size was introduced based on the concept of nominal modulus. Numerical experiments using the finite element method (FEM) were then carried out for determining the minimum RVE sizes of more than 500 cubic polycrystals in the plane stress problem, under the assumption that all grains in a polycrystal have the same square shape––called the simple polycrystal model. The major finding is that the minimum RVE sizes for effective elastic moduli have a roughly linear dependence on crystal anisotropy degrees. The present paper takes into account the effect of grain sizes, shapes, and distribution on the minimum RVE sizes for real cubic polycrystals that are formed by crystallization processes. Similar roughly linear dependence is found again, with the slope about 19% lower than that in the simple polycrystal model. This finding is interesting and useful because numerical experiments on minimum RVE sizes for a large number of crystals are quite time-consuming and the simple polycrystal model reduces significantly the FEM pre- and post-processing works. This should be particularly true in numerically testing minimum RVE sizes for three-dimensional polycrystals and for nonelastic properties in future works. With a maximum relative error 5%, all the polycrystals tested have a minimum RVE size of 16 or less times the grain size.  相似文献   
25.
The adsorption of xylene isomers in AlPO4-11 (AEL network) was investigated using biased grand canonical Monte Carlo (GCMC) simulations. Preferential o-xylene adsorption was predicted by the simulations, in agreement with previously reported experimental data. In AlPO4-11 the selective adsorption behavior comes from the smaller length of the o-xylene molecule along the crystallographic c-axis compared to p-xylene. This is in contrast to AlPO4-5 and AlPO4-8, where the ortho-selectivity is caused by the characteristic face-to-face positioning of o-xylene. Energy minimization studies were also performed in a flexible AlPO4-11 lattice to study the structural changes upon xylene adsorption. The energy minimization study showed that the AlPO4-11 crystal distorts upon p- and o-xylene adsorption. The distortion mechanism is related to the strong interaction between xylene methyl groups and the sieve oxygen atoms in the O3 position in the wide region of the pore.  相似文献   
26.
The ennoblement of corrosion potential (Ecorr) of passive metal immersed in seawater was investigated with electrochemical technology and epifluorescence microscopy. The in situ observation showed that the bacteria number increased on the metal surface according to an exponential law which was in the same way with the ennoblement of Ecorr. At the same time, the anodic polarization current of high‐Mo stainless steel decreased in the initial days. According to the mix‐potential theory and the characteristics of polarization curves of high‐Mo steel in natural seawater, the ennoblement of corrosion potential may be induced by the decrease of the passive current density.  相似文献   
27.
Exposed pad packages were introduced in the late 1980s and early 1990s because of their excellent thermal and electrical performance. Despite these advantages, the exposed pad packages experience a lot of thermo-hygro-mechanical related reliability problems during qualification and testing. Examples are die lift, which occurs predominantly after moisture sensitivity level conditions, and die-attach to leadframe delamination leading to downbond stitch breaks during temperature cycling. In this chapter, nonlinear finite element (FE) models using fracture mechanics based J-integral calculations are used to assess the reliability problems of the exposed pad package family. Using the parametric FE models any geometrical and material effects can be explored to their impact on the occurrence diepad delamination, and dielift. For instance the impact of diepad size is found to be of much less importance as the impact of die thickness is. Using the fracture mechanics approach, the starting location for the delamination from thermo-hygro-mechanical point of view is deducted. The results indicate that when diepad delamination is present, cracks are likely to grow beneath the die and dielift will occur. The interaction between dielift and other failure modes, such as lifted ball bonds, are not found to be very significant. The FE models are combined with simulation-based optimization methods to deduct design guidelines for optimal reliability of the exposed pad family.  相似文献   
28.
In an anisotropic conductive adhesive (ACA) assembly, the electrical conduction is usually achieved with the conductive particles between the bumps of integrated circuit (IC) and corresponding conductive tracks on the glass substrate. Fully understanding of the mechanical and electrical characteristics of ACA particles can help to optimize the assembly process and improve the reliability of ACA interconnection. Most conductive particles used in the ACA assembly are with cracks in the metal coating of the particles after the ACA bonding. This paper introduced the fracture analysis by applying the cohesive elements in the numerical model of the nickel-coated polymer particle and further simulating the cracks initiation and propagation in the nickel coating during the ACA bonding. The simulation results showed that the stress distribution on the nickel-coated particle with cracks was significantly different from that on the nickel-coated particle without crack, indicating that the stress analysis by taking the crack into consideration is very important for the reliability assessment of the ACA interconnection. The stress analysis of cohesive elements indicated that the cracks initiated at the central area of the nickel coating and propagated to the polar area. Furthermore, by the introduction of a new parameter of the virtual resistance, a mathematical model was established to describe the electrical characteristics of the nickel-coated particle with cracks. The particle resistance of the nickel-coated particle with cracks was found to be much higher than that of the particle without crack in the optimized bonding pressure range, indicating that it is necessary to take the crack into consideration for the particle conduction analysis as well. Therefore, the fracture analysis on the conductive particle by taking the crack into consideration could accurately evaluate the reliability of ACA interconnection and avoid serious reliability issues.  相似文献   
29.
利用K2 +2 ,Ca2 +/ /SO2 -4 ,Cl2 -2 ,NH3—H2 O混合体系相图作为工艺指导 ,进行硫酸钙制取硫酸钾工艺的相图研究和分析 ,确定实验优选因素及水平并进行正交实验 ,根据实验结果进行极差分析 ,得出新的结论。合适的工艺条件为 :氨浓度为 40 % ,配料比n( 2KCl) :n(CaSO4 ·2H2 O)为 1:1,反应温度为 5℃ ,反应时间为 1h。  相似文献   
30.
基于DSP+CPLD的高精度信号发生器   总被引:2,自引:0,他引:2  
楚然  廖佳 《电子工程师》2004,30(5):32-34
介绍了基于直接数字式频率合成(DDS)原理的全数字信号发生器(DSP),利用DSP芯片快速、高精度的运算优势以及CPLD芯片灵活的编程逻辑、大容量存储功能的特点,采用通用可编程芯片以及数字波形合成技术,形成高稳定、高精度、高动态的数字合成信号.该信号发生器可产生0~25 kHz的正弦波、三角波和方波,输出电压峰峰值为0~5 V,频率步进1 Hz,幅度步进0.001 V.  相似文献   
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