Tool path planning for 5-axis flank milling of ruled surfaces considering CNC linear interpolation

This paper investigates tool path planning for 5-axis flank milling of ruled surfaces in consideration of CNC linear interpolation. Simulation analyses for machining error show insights into the tool motion that generates a precision machined surface. Contradicting to previous thoughts, the resultant tool path does not necessarily produce minimal machining error when the cutter contacts the rulings of a developable surface. This effect becomes more significant as the distance between two cutter locations is increased. An optimizing approach that adjusts the tool position locally may not produce minimal error as far as the entire surface is concerned. The optimal tool path computed by a global search scheme based on dynamic programming supports this argument. A flank milling experiment and CMM measurement further validate the findings of this work.     

Prediction error method for identification of LPV models

This paper is concerned with identification of linear parameter varying (LPV) systems in an input-output setting with Box-Jenkins (BJ) model structure. Classical linear time invariant prediction error method (PEM) is extended to the LPV PEM. Under the new LPV framework, identification of two types of input-output LPV models is considered: one is based on parameter interpolation and the other is based on model interpolation. The effectiveness of the proposed solution is validated by comparison with other existing LPV identification approaches through simulation examples and demonstrated by experiment studies.     

Determining the number of new employees with learning, forgetting and variable wage with a Newsvendor model in pull systems

This paper develops a new quantitative model to find the optimal number of new employees with a Newsvendor model in a pull production system. This model allows learning, forgetting and variable wage. This paper also provides numerical results on sensitivity analysis, and compares the numerical results in three different situations: the situation with both learning and forgetting effect, that with learning effect but without forgetting effect and the situation with neither learning nor forgetting effect. The conclusions drawn from the comparison may offer theoretical insight for human resource managers to make appropriate employment decisions.     

Pressure-induced non-bulk superconductivity in Eu1.2Mo6(S1−x Se x )8

High-pressure study has been made both resistively and magnetically on Eu_1.2Mo₆(S_1–x Se _x )₈. Superconductivity was detected at a lower pressure in samples forx0 than forx=0 in spite of the larger unit cell volume of the former. The superconductivity observed remains non-bulk up to 20 kbar. The maximum onset temperature of the superconductivity transition decreases withx.On leave from the Physics Institute, Chinese Academy of Sciences, Peking, China.     

Preparation and characterization of sputtered Cu films containing insoluble Nb

Copper films containing various amounts of insoluble Nb (up to 24.7 at.%) were prepared by r.f. magnetron sputtering. The crystallography and microstructure of the films were investigated for as-deposited and annealed Cu(Nb) thin films. Cu(Nb) thin films are found to consist of non-equilibrium supersaturated solid solution of Nb in Cu with a nanocrystalline microstructure. X-ray diffraction and scanning electron microscope analyses revealed a reduction in the grain sizes of the films with increasing Nb content in the films leading to a grain refinement. The electrical resistivity of as-deposited and annealed Cu(Nb) thin films is found to be low for an Nb content 2.7 at.%. Significant drops in the resistivity were observed for the high Nb contents after annealing at 530 °C which may be due to grain growth and formation of Nb-bearing phase in the film. Microhardness of the films was found to increase with the Nb concentration due to the combined effects of grain refinement and the solute strengthening of Nb.     

Hemocompatibility of lanthanum oxide films fabricated by dual plasma deposition

Lanthanum oxide films were fabricated using dual plasma deposition. X-ray photoelectron spectroscopy (XPS) showed that La existed in the + 3 oxidation state. X-ray diffraction (XRD) revealed a (101) oriented hexagonal structure. Blood platelet adhesion tests and endothelial cell cultures were used to evaluate the hemocompatibility of the as-deposited films. Scanning electron microscopy (SEM) and optical microscopy were employed to evaluate the surface morphology of the blood platelets and endothelial cells on the films. The results showed that the number of adhered, aggregated and morphologically changed platelets was reduced compared to that observed on low-temperature isotropic carbon (LTIC). Endothelial cells culture tests indicated good adhesion and proliferation of human umbilical vein endothelial (HUVE) cells in vitro. Our study suggests that lanthanum oxide films are potential blood-contacting biomedical materials.     

Optoelectronic and microwave transmission characteristics of indium solder bumps for low-temperature flip-chip applications

This paper describes low-temperature flip-chip bonding for both optical interconnect and microwave applications. Vertical-cavity surface-emitting laser (VCSEL) arrays were flip-chip bonded onto a fused silica substrate to investigate the optoelectronic characteristics. To achieve low-temperature flip-chip bonding, indium solder bumps were used, which had a low melting temperature of 156.7/spl deg/C. The current-voltage (I-V) and light-current (L-I) characteristics of the flip-chip bonded VCSEL arrays were improved by Ag coating on the indium bump. The I-V and L-I curves indicate that optical and electrical performances of Ag-coated indium bumps are superior to those of uncoated indium solder bumps. The microwave characteristics of the solder bumps were investigated by using a flip-chip-bonded coplanar waveguide (CPW) structure and by measuring the scattering parameter with an on-wafer probe station for the frequency range up to 40 GHz. The indium solder bumps, either with or without the Ag coating, provided good microwave characteristics and retained the original characteristic of the CPW signal lines without degradation of the insertion and return losses by the solder bumps.     

Tunable Optical Notch Filter Realized by Shifting the Photonic Bandgap in a Silicon Photonic Crystal Line-Defect Waveguide

A tunable optical notch filter was realized by thermally shifting the TM-like (the light's electric field perpendicular to the substrate) bandgap of a silicon photonic crystal slab W1 line-defect waveguide with silica cladding. This device is compact-its footprint is 340times16 mum², excluding the electrode pads. The 3-dB bandwidth of the device was about 5 nm, and the extinction ratio at the center wavelength was as high as 40 dB. A maximum center wavelength shift of 17.9 nm was attained at a heating power of 0.7W, with a tuning efficiency of 25.5 nm/W. The tuning response time was less than 100 mus     

Synchronized transform-limited operation of 10-GHz colliding pulse mode-locked laser

We report a 10-GHz colliding pulse mode-locked laser fabricated with integrated active-passive waveguides. The laser fabrication adopted a deep reactive ion etching and single-step metal-organic vapor phase epitaxy regrowth process for forming the buried heterostructure waveguide. Clean output pulses resulted from laterally tilting the active-passive interface and effectively suppressing residual back-reflections at the interface. Hybrid mode-locking resulted in a synchronized transform-limited sech/sup 2/optical waveform. Pulsewidth, chirp, timing jitter, and frequency-locking range were investigated through systematic device biasing condition optimization.