Structural and Superconducting Property Variations with Nominal Mg Non‐Stoichiometry in MgxB2 and Its Enhancement of Upper Critical Field

By applying a combination of characterisation tools, changes in structural and superconducting properties with nominal Mg non‐stoichiometry in Mg_xB₂ are found. The non‐stoichiometry produces enhanced in‐field critical current densities (J_c's) and upper critical field / irreversibility field (H_c2/H_irr(T)) values. Upper critical fields of ～ 21 T (4.2 K) were obtained in nominal Mg‐deficient samples compared to ～ 17 T (4.2 K) for near‐stoichiometric samples.     

Ennoblement of stainless steel in natural seawater – A new explanation

The ennoblement of corrosion potential (E_corr) of passive metal immersed in seawater was investigated with electrochemical technology and epifluorescence microscopy. The in situ observation showed that the bacteria number increased on the metal surface according to an exponential law which was in the same way with the ennoblement of E_corr. At the same time, the anodic polarization current of high‐Mo stainless steel decreased in the initial days. According to the mix‐potential theory and the characteristics of polarization curves of high‐Mo steel in natural seawater, the ennoblement of corrosion potential may be induced by the decrease of the passive current density.     

Entropy of multidimensional cellular automata

Since the topological entropy of a vast class of two-dimensional cellular automata (CA) is infinite, of interest is the possibility to renormalize it so that to obtain a positive finite value. We find the asymptotics of the information function of a multidimensional CA and, accordingly, introduce the renormalized topological entropy as a coefficient of this asymptotics. We describe some properties of the introduced quantity, in particular, its positivity for CA of the type of “The Game of Life.” Also, we give an example of an explicit evaluation of this parameter for a particular cellular automaton.     

Driving Mechanisms of Delamination Related Reliability Problems in Exposed Pad Packages

Exposed pad packages were introduced in the late 1980s and early 1990s because of their excellent thermal and electrical performance. Despite these advantages, the exposed pad packages experience a lot of thermo-hygro-mechanical related reliability problems during qualification and testing. Examples are die lift, which occurs predominantly after moisture sensitivity level conditions, and die-attach to leadframe delamination leading to downbond stitch breaks during temperature cycling. In this chapter, nonlinear finite element (FE) models using fracture mechanics based J-integral calculations are used to assess the reliability problems of the exposed pad package family. Using the parametric FE models any geometrical and material effects can be explored to their impact on the occurrence diepad delamination, and dielift. For instance the impact of diepad size is found to be of much less importance as the impact of die thickness is. Using the fracture mechanics approach, the starting location for the delamination from thermo-hygro-mechanical point of view is deducted. The results indicate that when diepad delamination is present, cracks are likely to grow beneath the die and dielift will occur. The interaction between dielift and other failure modes, such as lifted ball bonds, are not found to be very significant. The FE models are combined with simulation-based optimization methods to deduct design guidelines for optimal reliability of the exposed pad family.     

Inter-vehicle communication systems: a survey

Inter-vehicle communication (IVC) systems (i.e., systems not relying on roadside infrastructure) have the potential to radically improve the safety, efficiency, and comfort of everyday road travel. Their main advantage is that they bypass the need for expensive infrastructure; their major drawback is the comparatively complex networking protocols and the need for significant penetration before their applications can become effective. In this article we present several major classes of applications and the types of services they require from an underlying network. We then proceed to analyze existing networking protocols in a bottom-up fashion, from the physical to the transport layers, as well as security aspects related to IVC systems. We conclude the article by presenting several projects related to IVC as well as a review of common performance evaluation techniques for IVC systems.     

Grouped Approach for the Design of H.264/AVC Motion Estimation Architectures

This letter presents a novel approach for organizing computational resources into groups within H.264/AVC motion estimation architectures, leading to reductions of up to 75% in the equivalent gate count with respect to state‐of‐the‐art designs.     

Inverted Solution Processable OLEDs Using a Metal Oxide as an Electron Injection Contact.

A new type of bottom‐emission electroluminescent device is described in which a metal oxide is used as the electron‐injecting contact. The preparation of such a device is simple. It consists of the deposition of a thin layer of a metal oxide on top of an indium tin oxide covered glass substrate, followed by the solution processing of the light‐emitting layer and subsequently the deposition of a high‐workfunction (air‐stable) metal anode. This architecture allows for a low‐cost electroluminescent device because no rigorous encapsulation is required. Electroluminescence with a high brightness reaching 5700 cd m^–2 is observed at voltages as low as 8 V, demonstrating the potential of this new approach to organic light‐emitting diode (OLED) devices. Unfortunately the device efficiency is rather low because of the high current density flowing through the device. We show that the device only operates after the insertion of an additional hole‐injection layer in between the light‐emitting polymer (LEP) and the metal anode. A simple model that explains the experimental results and provides avenues for further optimization of these devices is described. It is based on the idea that the barrier for electron injection is lowered by the formation of a space–charge field over the metal‐oxide–LEP interface due to the build up of holes in the LEP layer close to this interface.     

Development of Stretch Solder Interconnections for Wafer Level Packaging

A wafer level packaging technique has been developed with an inherent advantage of good solder joint co-planarity suitable for wafer level testing. A suitable weak metallization scheme has also been established for the detachment process. During the fabrication process, the compliancy of the solder joint is enhanced through stretching to achieve a small shape factor. Thermal cycling reliability of these hourglass-shaped, stretch solder interconnections has been found to be considerably better than that of the conventional spherical-shaped solder bumps.     

A Tutorial on GrÖbner Bases With Applications in Signals and Systems

This paper is a tutorial on GrÖbner bases and a survey on the applications of GrÖbner bases in the broad field of signals and systems. A reasonably detailed review is given of several fundamental theoretical issues that occur in the use of GrÖbner bases in multidimensional signals and systems applications. These topics include the primeness of multivariate polynomial matrices, multivariate unimodular polynomial matrix completion, and prime factorization of multivariate polynomial matrices. A brief review is also presented on the wide-ranging applications of GrÖbner bases in multidimensional as well as one-dimensional circuits, networks, control, coding, signals, and systems and other related areas like robotics and applied mechanics. The impact and scope of GrÖbner bases in signals and systems are highlighted with respect to what has already been accomplished as a stepping stone to expanding future research.