吐丝圈径对大规格高碳盘条组织性能的影响

计算与分析了斯太尔摩冷线上盘条的吐丝圈径、搭接密度及"佳灵"装置横向布风曲线之间的关系,研究了吐丝圈径的大小对大规格82B盘条组织和性能的影响,确定了大规格82B盘条最小吐丝圈径应为980mm.     

由制碱废渣制脱硫吸收剂配比优选的研究

文章探讨了由制碱废渣和电石渣混合制取脱硫吸收剂 ,不同混合比例对吸收剂的比表面积、脱硫能力的影响 ,从而确定最佳配比方案     

烯烃聚合单活性中心非茂催化剂的最新研究进展

综述了近几年来烯烃聚合用单活性中心非茂催化剂的研究进展。简要介绍了 2 3种由前、后过渡金属组成的配位化合物催化剂的结构与性能     

In-Situ observation on microfracture behavior ahead of the crack tip in 63Sn37Pb solder alloy

in-situ transmission electron microscopy (TEM) tensile tests on as-cast and aged 63Sn37Pb solder alloys were conducted, and the fracture behavior in nanometer scale ahead of the crack tip was inspected and discussed. Results show that the fracture was completed by connecting the discontinuous cracks or voids. Dislocation behavior was concentrated along the grain boundaries for as-cast samples, and displayed mainly as dislocation climb. The crack was intergranular dominated under the lower strain rate. While remarkable mutual dislocation emission was detected in the aged solder. Transgranular cracks were dominant in the fractured area, and they propagated by linking up with the nanometer scale cracks ahead of the crack tips under the effective promotion of the inverse dislocation emission. At the same time, the partial interphase or intergranular cracks in the thinned area were also found. Under this condition, a new critical stress intensity factor K _c ^′ to define the mutual dislocation emission was proposed.     

聚丙烯酸钠类高吸水性树脂的研究

采用反相悬浮聚合法合成高吸水性树脂.将丙烯酸(单体,水相)用氢氧化钠部分中和,然后与环己烷(溶剂,油相)共混,用水溶性的过硫酸钾做引发剂,N,N-亚甲基双丙烯酰胺做交联剂,在一定的反应温度和时间下,得到聚丙烯酸钠高吸水性树脂.     

Perfect Blind-Channel Shortening for Multicarrier Systems

In multicarrier systems, when the order of a channel impulse response is larger than the length of the cyclic prefix (CP), there is a significant performance degradation due to interblock interference (IBI). This paper proposes a blind-channel shortening method in which the equalizer parameter vector is formed by the noise subspace of the received signal correlation matrix so that the output power is maximized. The proposed method can not only shorten the effective channel impulse response to within the CP length but also maximize the output signal-to-interference-and-noise ratio while eliminating the IBI. We point out that the performance depends on the choice of a decision delay and propose a simple method for determining the appropriate delay. We propose both a batch algorithm and an adaptive algorithm and show by simulation that they are superior to the conventional algorithms.     

ADI-FDTD Method With Fourth Order Accuracy in Time

This letter presents an unconditionally stable alternating direction implicit finite-difference time-domain (ADI-FDTD) method with fourth order accuracy in time. Analytical proof of unconditional stability and detailed analysis of numerical dispersion are presented. Compared to second order ADI-FDTD and six-steps SS-FDTD, the fourth order ADI-FDTD generally achieves lower phase velocity error for sufficiently fine mesh. Using finer mesh gridding also reduces the phase velocity error floor, which dictates the accuracy limit due to spatial discretization errors when the time step size is reduced further.     

Investigation of Mechanical and Electrical Characteristics for Cracked Conductive Particle in Anisotropic Conductive Adhesive (ACA) Assembly

In an anisotropic conductive adhesive (ACA) assembly, the electrical conduction is usually achieved with the conductive particles between the bumps of integrated circuit (IC) and corresponding conductive tracks on the glass substrate. Fully understanding of the mechanical and electrical characteristics of ACA particles can help to optimize the assembly process and improve the reliability of ACA interconnection. Most conductive particles used in the ACA assembly are with cracks in the metal coating of the particles after the ACA bonding. This paper introduced the fracture analysis by applying the cohesive elements in the numerical model of the nickel-coated polymer particle and further simulating the cracks initiation and propagation in the nickel coating during the ACA bonding. The simulation results showed that the stress distribution on the nickel-coated particle with cracks was significantly different from that on the nickel-coated particle without crack, indicating that the stress analysis by taking the crack into consideration is very important for the reliability assessment of the ACA interconnection. The stress analysis of cohesive elements indicated that the cracks initiated at the central area of the nickel coating and propagated to the polar area. Furthermore, by the introduction of a new parameter of the virtual resistance, a mathematical model was established to describe the electrical characteristics of the nickel-coated particle with cracks. The particle resistance of the nickel-coated particle with cracks was found to be much higher than that of the particle without crack in the optimized bonding pressure range, indicating that it is necessary to take the crack into consideration for the particle conduction analysis as well. Therefore, the fracture analysis on the conductive particle by taking the crack into consideration could accurately evaluate the reliability of ACA interconnection and avoid serious reliability issues.     

计算机高速并行通信的实现方案

利用CPLD芯片实现单片机与ISA总线接口之间的高速并行通信，给出系统的总体设计方法及程序框图。采用这种通信方式，在12MHz晶振的MCS51单片机控制的数据采集系统中，可以满足与PCI04 ISA总线接口实时通信的要求，通信速率达200khit／s。在开发工具MAX plusⅡ下，完成了整个设计的输入、编译和仿真，达到了预期效果。本设计方案能够推广应用到计算机的高速并行通信中。