电信企业信息化统一模型构建策略

电信企业信息化的实质就是赋予电信企业精细化的企业资源整合能力，本以此认识为出发点，通过定义基本的信息化业务元素，需求参数和基本信息处理机制，构建出带有行业共性的电信企业信息化统一模型，该模型针对目前电信企业信息化中常见的和潜在的问题提供了有效的解决措施。     

运动饮料配方设计概论

运动中，人体生理发生一系列的变化，包括水分损失、血糖／糖原消耗、电解质损失等，导致运动中／后的疲劳和运动能力下降。以运动中人体生理特点为基础，通过讨论运动前／中／后补充水、碳水化合物及电解质的问题，论证了运动饮料配方设计的原理依据。     

Exposed Die-Top Encapsulation Molding for an Improved High- Performance Flip Chip BGA Package

The recent advancement in high- performance semiconductor packages has been driven by the need for higher pin count and superior heat dissipation. A one-piece cavity lid flip chip ball grid array (BGA) package with high pin count and targeted reliability has emerged as a popular choice. The flip chip technology can accommodate an I/O count of more than five hundreds500, and the die junction temperature can be reduced to a minimum level by a metal heat spreader attachment. None the less, greater expectations on these high-performance packages arose such as better substrate real estate utilization for multiple chips, ease in handling for thinner core substrates, and improved board- level solder joint reliability. A new design of the flip chip BGA package has been looked into for meeting such requirements. By encapsulating the flip chip with molding compound leaving the die top exposed, a planar top surface can be formed. A, and a flat lid can then be mounted on the planar mold/die top surface. In this manner the direct interaction of the metal lid with the substrate can be removed. The new package is thus less rigid under thermal loading and solder joint reliability enhancement is expected. This paper discusses the process development of the new package and its advantages for improved solder joint fatigue life, and being a multichip package and thin core substrate options. Finite-element simulations have been employed for the study of its structural integrity, thermal, and electrical performances. Detailed package and board-level reliability test results will also be reported     

Intelligent process analytics for CRM

Many organisations use decision models in their processes such as tables or trees to provide decision support to their operational divisions. For example, in fault management, customer contact centre operators usually use a decision model in the form of prescribed interviews. Based on the answers given by customers, the operator navigates through the decision model to reach an assessment of the problem. In order to achieve customer satisfaction and operational excellence, it is very important to constantly monitor the performance of a decision model not only on an overall level, but also on the level of individual decisions. In this paper we present a configurable business process analytics tool, known as the intelligent Universal Service Management System, that constantly monitors decision data and is capable of optimising the decisions based on high-level business objectives. We explain the various features of the software and show how it can be used to optimise decision processes. We also show how we can easily provide a customised version to monitor the performance of provision processes.     

有线电视系统工程的招标

针对有线电视系统工程建设的特点，依照《招标投标法》的规定和程序，对有线电视系统工程招标的种类、招标方式、招标工程必备的条件、标底的编制及审定、开标、评标和中标的原则进行详细介绍，对招标文件的编制进行具体说明。     

在基于MPLS的层次化移动IP网络中支持DiffServ的研究

MPLS支持DiffServ、流量工程,能为网络提供较好的QoS保证,而移动IP(MIP)能为移动设备提供较好的移动性支持。文章探讨了在无线接入网中MPLS和MIP结合实现DiffServ的方案,并给出了一种在基于MPLS的层次化MIP网络结构中支持DiffServ的体系结构,设计了其节点功能模型和关键协议。方案中利用了层次化结构的区域注册和重路由机制,减少了切换时延和网络的信令负荷。     

High-performance MIM capacitor using ALD high-k HfO/sub 2/-Al/sub 2/O/sub 3/ laminate dielectrics

For the first time, we successfully fabricated and demonstrated high performance metal-insulator-metal (MIM) capacitors with HfO/sub 2/-Al/sub 2/O/sub 3/ laminate dielectric using atomic layer deposition (ALD) technique. Our data indicates that the laminate MIM capacitor can provide high capacitance density of 12.8 fF//spl mu/m/sup 2/ from 10 kHz up to 20 GHz, very low leakage current of 3.2 /spl times/ 10/sup -8/ A/cm/sup 2/ at 3.3 V, small linear voltage coefficient of capacitance of 240 ppm/V together with quadratic one of 1830 ppm/V/sup 2/, temperature coefficient of capacitance of 182 ppm//spl deg/C, and high breakdown field of /spl sim/6 MV/cm as well as promising reliability. As a result, the HfO/sub 2/-Al/sub 2/O/sub 3/ laminate is a very promising candidate for next generation MIM capacitor for radio frequency and mixed signal integrated circuit applications.     

单元串联式多电平高压变频器的起源、现状和展望

本文对单元串联式多电平高压变频器的起源和现状进行了总结,同时从无速度传感器矢量控制、大容量化、冗余设计等方面对该技术未来的发展趋势进行了展望。     

用CMOS工艺实现VSR光电集成接收机的途径

介绍了10Gbit／s速率的甚短距离光传输系统VSR(Very Short Reach)中的接收机。分析了几种有希望用于VSR系统的CMOS工艺兼容的光电探测器。提出用CMOS电路实现VSR光电集成(OEIC)接收机的可能性和实现方法。     

A Study on Turbo—rotor Multi—fault Diagnosis Based on a Neural Network

The multi-fault phenomena are common in the turbo-rotor system of a liquid rocket engine.As it has many excellent qualities,the neural network might be used to solve the problems of multi-fault diagnasis of a turbo-rotor system.First,the feature expression of a common turbo-rotor fault was studied in order to build up the standard fault pattern and satisfy the need of neural network studying and diagnosing.Then.the turbo-rotor fault identification and diagnosis problems were investigated by using a BP(back-propaga-tion)neural network.According to the BP neural network problems,the parallel BP neural network method of multi-fault diagnosis and classification was presented and investigated.The results indicated that the parallel Bp neural network method could solve the turbo-rotor multi-fault diagnosis problems.