噻吩在镍基非晶态合金上的吸附和脱附

应用静态吸附、动态吸附、程序升温脱附和程序升温还原等实验方法，考察了噻吩在Ni基非晶态合金上的吸附和脱附行为。常温下，噻吩分子首先吸附在清洁的Ni表面，并立刻被活化，发生氢解反应，C-S键断裂，释放出烃类部分，S留在Ni原子上。噻吩可以在Ni基非晶态合金表面发生强度不同的化学吸附。弱化学吸附的噻吩可以脱附；强化学吸附的噻吩不会脱附，而在高温下发生氢解反应。     

复合材料层合曲梁分层问题的解析解法

根据叠加原理将含有分层的复合材料层合曲梁在横向载荷作用下的受力状态分解为在面受力状态与出面受力状态,再将出面受力状态分解为无分层曲梁受横向载荷状态与含分层曲梁承受附加剪切载荷状态。将分层问题归结为在附加剪切载荷状态中,层合梁附加位移与附加应力的分析,并据此建立了一个简单的力学模型。最后得到了由分层引起的附加位移与应力的解析解答,并用能量释放率方法确定了应力强度因子。     

Exposed Die-Top Encapsulation Molding for an Improved High- Performance Flip Chip BGA Package

The recent advancement in high- performance semiconductor packages has been driven by the need for higher pin count and superior heat dissipation. A one-piece cavity lid flip chip ball grid array (BGA) package with high pin count and targeted reliability has emerged as a popular choice. The flip chip technology can accommodate an I/O count of more than five hundreds500, and the die junction temperature can be reduced to a minimum level by a metal heat spreader attachment. None the less, greater expectations on these high-performance packages arose such as better substrate real estate utilization for multiple chips, ease in handling for thinner core substrates, and improved board- level solder joint reliability. A new design of the flip chip BGA package has been looked into for meeting such requirements. By encapsulating the flip chip with molding compound leaving the die top exposed, a planar top surface can be formed. A, and a flat lid can then be mounted on the planar mold/die top surface. In this manner the direct interaction of the metal lid with the substrate can be removed. The new package is thus less rigid under thermal loading and solder joint reliability enhancement is expected. This paper discusses the process development of the new package and its advantages for improved solder joint fatigue life, and being a multichip package and thin core substrate options. Finite-element simulations have been employed for the study of its structural integrity, thermal, and electrical performances. Detailed package and board-level reliability test results will also be reported     

梯度材料电场辅助自蔓延燃烧合成机理研究

采用电场辅助自蔓延高温合成技术制备了SiC-TiC-xNi梯度功能材料.利用电场的焦耳加热效应,使那些通过单一自蔓延高温合成(SHS)技术难以进行或不能进行的反应物的制备得以实现;电场加快离子的扩散与迁移速度,减少晶体缺陷,使反应更加充分.实验发现,随着电场强度的增大,反应体系的温度升高、电流值变大.     

基于MPEG-2文件的合并

介绍了具有相同音频、视频编码方式的MPEG - 2节目流如何合并成一个节目流。合并后的文件播放流畅并且时间显示正确 ,它包括PATPMT表的重写 ,系统头部分相关字段的更改 ,PCR值的修改 ,解码时间标签 (DTS)和显示时间标签 (PTS)的重新确定 ,传送速率的修改以及添加相应的空包     

基于系统矩阵有序实Schur分解的模型降阶

对复杂高阶系统进行模型简化，为研究与设计系统提供了方便的条件。对系统模型的降阶是控制系统设计与仿真工作者的一个重要研究课题，对高阶复杂系统的分析、设计、仿真等具有重要的理论意义和工程实用价值。针对目前比较成熟的基于系统矩阵的有序实Schur分解方法，提出了采用时矩输出拟合来改善降阶系统输出响应逼近程度的改进方法，从而使简化模型具有输出误差更小、计算简便等优点，通过给出的实例仿真证实了这一点。     

新型微光探测器激光防护材料的研究

系统分析了微光夜视器的结构及其原理，并结合当前器件存在的激光致盲威胁，提出了增强系统安全的新措施。同时，系统地介绍了防激光滤光材料一些重要的性能参数以及滤光材料的组成、制备加工工艺。研究结果表明，新型的防激光材料能够有效地防护800nm，900nm以及10613nm等三个波长的激光，并且可见光透过率大于85％。     

企业产品执行标准管理的信息化建设

标准化的目的是“获得最佳秩序和社会效益”，而最佳秩序是企业进行高效率生产和管理的前提条件。能够更及时准确的对企业的生产标准、技术标准、安全标准、管理标准进行监督和管理工作；有助于更好的督促企业在每个环节都建立起互相适应、配套的标准体系，使企业生产活动和经营管理活动井然有序，避免混乱；能够进一步加强对认证及认证咨询工作的质量，提高认证企业质量体系运行的有效性。为此我们提出了建设《哈尔滨市企业产品执行标准数据库管理系统》，对企业的产品执行标准进行登记注册管理，这将有助于组织、监督标准实施工作；有助于组织制订地方标准；推行采用国际标准和国外先进标准；有助于协调指导企业产品标准的制订并管理其备案；组织重要标准的宣传贯彻，监督检查重要标准的实施情况。     

Numerical Study of Finite Element Method Based Solutions for Propagation of Wetting Fronts in Unsaturated Soil

The accurate prediction of the propagation of a wetting front in an unsaturated soil subjected to surficial infiltration is of practical importance to many geotechnical and geoenvironmental problems. The finite element method is the most common solution technique as the hydraulic soil properties are highly nonlinear. Two important issues are often found to create difficulties in such analyses. First, numerical oscillations are usually observed in the calculated pore pressures at the wetting front. Second, when a reasonable mesh size and time step are used, the elevation of the wetting front may be seriously overpredicted. This paper is focused on the second issue. The under-relaxation (UR) technique used in the iterative process within each time step is found to have a serious impact on rate of convergence with refinement in mesh size and time step. Two different techniques are typically used; the first evaluates the hydraulic conductivity using an average of heads calculated from the preceding time node and the most recent iteration of the current time node (UR1), and the second evaluates the hydraulic conductivity using the average of heads calculated from the two most recent iterations of the current time nodes (UR2). The study shows that UR1, which is adopted in programs such as SEEP/W, ensures that the solution converges rapidly to a stable solution within a time step, but may converge to the wrong wetting front at a given elapsed time unless a sufficiently refined mesh is used. UR2 converges much more slowly within a time step, but the error in the wetting front is smaller than that generated by UR1.     

校园网宿舍网络管理模式的探讨

讨论了高校学生宿舍区网络的特点，结合天津商学院校园网的实践，讨论了校园网宿舍网络管理的模式。