Low-energy electron-enhanced etching of HgCdTe

Low-energy electron-enhanced etching (LE4) is applied to HgCdTe to eliminate ion-induced surface damage. First, LE4 results for patterned samples are illustrated. The LE4 mechanism is understood from a mechanistic study in terms of three etch variables: direct current (DC) bias, gas composition, and sample temperature. For this paper, the effects of DC bias (electron energy) and gas composition (CH₄ concentration) are summarized qualitatively, followed by quantitative evidence. Etch rate, the amount of polymer, surface stoichiometry, and surface roughness have specific relations with each etch variable under competition between pure LE4 and polymer deposition.     

Layer-transfer process for silicon-on-insulator with improved manufacturability

We observe hydrogen platelet buildup in single-crystalline silicon caused by hydrogen-plasma processing. The platelets are aligned along a layer of lattice defects formed in silicon before the plasma processing. The buried-defect layer is formed by either silicon-into-silicon or argon-into-silicon implantation. We discuss the platelet nucleation, growth, and merge phenomena and discuss applicability of the plasma hydrogenation to silicon-on-insulator (SOI) wafer fabrication by layer transfer.     

Solid-state intermetallic compound layer growth between copper and 95.5Sn-3.9Ag-0.6Cu solder

Long-term, solid-state intermetallic compound (IMC) layer growth was examined in 95.5Sn-3.9Ag-0.6Cu (wt.%)/copper (Cu) couples. Aging temperatures and times ranged from 70°C to 205°C and from 1 day to 400 days, respectively. The IMC layer thicknesses and compositions were compared to those investigated in 96.5Sn-3.5Ag/Cu, 95.5Sn-0.5Ag-4.0Cu/Cu, and 100Sn/Cu couples. The nominal Cu₃Sn and Cu₆Sn₅ stoichiometries were observed. The Cu₃Sn layer accounted for 0.4–0.6 of the total IMC layer thickness. The 95.5Sn-3.9Ag-0.6Cu/Cu couples exhibited porosity development at the Cu₃Sn/Cu interface and in the Cu₃Sn layer as well as localized “plumes” of accelerated Cu₃Sn growth into the Cu substrate when aged at 205°C and t>150 days. An excess of 3–5at.%Cu in the near-interface solder field likely contributed to IMC layer growth. The growth kinetics of the IMC layer in 95.5Sn-3.9Ag-0.6Cu/Cu couples were described by the equation x=x_o+Atⁿexp [−ΔH/RT]. The time exponents, n, were 0.56±0.06, 0.54±0.07, and 0.58±0.07 for the Cu₃Sn layer, the Cu₆Sn₅, and the total layer, respectively, indicating a diffusion-based mechanism. The apparent-activation energies (ΔH) were Cu₃Sn layer: 50±6 kJ/mol; Cu₆Sn₅ layer: 44±4 kJ/mol; and total layer: 50±4 kJ/mol, which suggested a fast-diffusion path along grain boundaries. The kinetics of Cu₃Sn growth were sensitive to the Pb-free solder composition while those of Cu₆Sn₅ layer growth were not so.     

Concentrations of native and gold defects in HgCdTe from first principles calculations

We have studied the defect formation energies of the various native (vacancies, interstitials, and antisites) and Au defects in Hg_1−xCd_xTe using density functional-based total energy calculations with ultrasoft pseudo-potentials. These studies are important for infrared (IR) detection technology where the device performance can be severely degraded because of defects. To calculate formation energies, we modeled the neutral and charged defects using supercells containing 64 atoms. From the formation energies, we have determined the defect concentrations as a function of stoichiometry and temperature. We find the prevalent neutral defects to be Au at the Hg site (Au_Hg ), Hg vacancies (V_Hg ), and Te antisites (Te_Hg ). We have also explicitly studied charged defects and have found Te _Hg ²⁺ , Au _Hg ¹⁻ , V _Hg ¹⁻ , V _Hg ²⁻ , and V _Te ²⁺ to have low formation energies. We have identified Au_Hg to be the prevalent Au defect, having concentrations several orders of magnitude greater than the other Au defects. We find that the charge state of V_Hg is primarily (1−) or (2−) depending on the electronic chemical potential.     

Phase equilibria of the Sn-Ag-Cu-Ni quaternary system at the sn-rich corner

Knowledge of phase equilibria of the Sn-Ag-Cu-Ni quaternary system at the Sn-rich corner is important for the understanding of the interfacial reactions at the Sn-Ag-Cu/Ni contacts, which are frequently encountered in recent microelectronic products. Various Sn-Ag-Cu-Ni alloys were prepared and equilibrated at 250°C. The alloys were then quenched and analyzed. The phases were determined by metallography, compositional analysis, and x-ray diffraction (XRD) analysis. No quaternary phases were found. The isoplethal sections at 60at.%Sn, 70at.%Sn, 80at.%Sn, and 90at.%Sn at 250°C are determined. The phase equilibrium relationship was proposed based on the quaternary experimental results and the 250°C isothermal sections of the four constituent ternary systems, Sn-Ag-Cu, Sn-Ag-Ni, Sn-Cu-Ni, and Cu-Ag-Ni. Because there are no ternary phases in all these three systems, all the compounds are in fact binary compounds with various solubilities of the other two elements.     

Rapid thermal annealing effects on the photoluminescence properties of molecular beam epitaxy-grown GaIn(N)As quantum wells with Ga(N)As spacers and barriers

This article describes the effects of rapid thermal annealing (RTA) on the photoluminescence (PL) emission from a series of GaIn(N)As quantum wells. Indium compositions of both 20% and 32% were examined with nominal N compositions of 1% or 2%. The N location was varied within our quantum structure, which can be divided into three regions: (1) quantum well, (2) Ga(N)As spacer layers at the barrier-to-well interface and well-to-barrier interface, and (3) barriers surrounding each quantum well. Eight combinations of samples were examined with varying In content, Ga(N)As spacer layer thickness, N content, and N location in the structure. In the best cases, the presence of these Ga(N)As spacer layers improves the PL properties, due to annealing, with a reduction in the emission wavelength blueshift by ～400 Å, a reduction of the decrease in the full-width at half-maximum (FWHM) by ～5 meV, and a threefold reduction of the increase in integrated intensity. It was also observed that relocating N from the quantum wells to the barriers produces a comparable emission wavelength both before and after annealing. Our results further show that the composition of incorporated N in the material is most influential during the stages of RTA in which relatively small amounts of thermal energy is present from our lower annealing times and temperatures. Hence, we believe a low thermal-energy anneal is responsible for the recovery of the plasma-related crystal damage that was incurred during its growth. However, the In composition in the quantum well is most influential during the latter stages of thermal annealing, at increased times and temperatures, where the wavelength blueshift was roughly independent of the amount of incorporated N. As a result, our investigations into the effects of RTA on the PL properties support other reports that suggest the wavelength blueshift is not due to N diffusion.     

Influence of Si<Subscript>3</Subscript>N<Subscript>4</Subscript> passivation on surface trapping in SiC metal-semiconductor field-effect transistors

The SiC metal-semiconductor field-effect transistors (MESFETs) have been reported to have current instability and strong dispersion caused by trapping phenomena at the surface and in the substrate, which degrade direct-current (DC) and radio-frequency (RF) performance. This paper illustrates the change in electrical characteristics of SiC MESFETs after Si₃N₄ passivation. Because of a reduction of surface trapping effects, Si₃N₄ passivation can diminish current collapse under pulsed DC conditions, increasing the RF power performance. The reduction of surface trapping effects is verified by the change in the ratio of the drain current to the gate current under pinch-off conditions.     

Secure encrypted-data aggregation for wireless sensor networks

This paper proposes a secure encrypted-data aggregation scheme for wireless sensor networks. Our design for data aggregation eliminates redundant sensor readings without using encryption and maintains data secrecy and privacy during transmission. Conventional aggregation functions operate when readings are received in plaintext. If readings are encrypted, aggregation requires decryption creating extra overhead and key management issues. In contrast to conventional schemes, our proposed scheme provides security and privacy, and duplicate instances of original readings will be aggregated into a single packet. Our scheme is resilient to known-plaintext attacks, chosen-plaintext attacks, ciphertext-only attacks and man-in-the-middle attacks. Our experiments show that our proposed aggregation method significantly reduces communication overhead and can be practically implemented in on-the-shelf sensor platforms.     

Curvelet-based fingerprint anti-spoofing

Existing perspiration-based liveness detection algorithms need two successive images (captured in certain time interval), hence they are slow and not useful for real-time applications. Liveness detection methods using extra hardware increase the cost of the system. To alleviate these problems, we propose new curvelet-based method which needs only one fingerprint to detect liveness. Wavelets are very effective in representing objects with isolated point singularities, but fail to represent line and curve singularities. Curvelet transform allows representing singularities along curves in a more efficient way than the wavelets. Ridges oriented in different directions in a fingerprint image are curved; hence curvelets are very significant to characterize fingerprint texture. Textural measures based on curvelet energy and co-occurrence signatures are used to characterize fingerprint image. Dimensionalities of feature sets are reduced by running Pudil’s sequential forward floating selection (SFFS) algorithm. Curvelet energy and co-occurrence signatures are independently tested on three different classifiers: AdaBoost.M1, support vector machine and alternating decision tree. Finally, all the aforementioned classifiers are fused using the “Majority Voting Rule” to form an ensemble classifier. A fingerprint database consisting of 185 real, 90 Fun-Doh and 150 Gummy fingerprints is created by using varieties of artificial materials for casts and moulds of spoof fingerprints. Performance of the new liveness detection approach is found very promising, as it needs only one fingerprint and no extra hardware to detect vitality.     

Co Solubility in Sn and Interfacial Reactions in Sn-Co/Ni Couples

It has been reported that minute Co additions to Sn-based solders are very effective for reducing undercooling, probably due to low Co solubility in Sn. In this study, Co solubility in molten Sn was determined experimentally. According to results of metallographic analysis, Co solubility in molten Sn is as low as 0.04 wt.% at 250°C. Interfacial reactions in Sn-Co/Ni couples at 250°C were examined for Co contents from 0.01 wt.% to 0.4 wt.%. The Ni₃Sn₄ phase was the only interfacial reaction phase in almost the entire Sn-0.01 wt.%Co/Ni couple. For Sn-Co/Ni couples with a Co content higher than 0.01 wt.%, a thin, continuous Ni₃Sn₄ layer and a discontinuous decahedron (Ni,Co)Sn₄ phase were formed in the initial stage of reaction. The reaction products evolved with time. With longer reaction time, the Sn content in the decahedron (Ni,Co)Sn₄ phase decreased, and the (Ni,Co)Sn₄ phase transformed into the (Ni,Co)Sn₂ phase and cleaved into a sheet, which then detached from the interface, after which Ni₃Sn₄ began to grow significantly with longer reaction times.