全文获取类型
收费全文 | 2544篇 |
免费 | 47篇 |
国内免费 | 11篇 |
专业分类
电工技术 | 122篇 |
综合类 | 3篇 |
化学工业 | 601篇 |
金属工艺 | 48篇 |
机械仪表 | 60篇 |
建筑科学 | 36篇 |
能源动力 | 96篇 |
轻工业 | 219篇 |
水利工程 | 5篇 |
石油天然气 | 5篇 |
无线电 | 245篇 |
一般工业技术 | 403篇 |
冶金工业 | 513篇 |
原子能技术 | 79篇 |
自动化技术 | 167篇 |
出版年
2023年 | 8篇 |
2022年 | 28篇 |
2021年 | 45篇 |
2020年 | 18篇 |
2019年 | 20篇 |
2018年 | 29篇 |
2017年 | 28篇 |
2016年 | 41篇 |
2015年 | 39篇 |
2014年 | 55篇 |
2013年 | 132篇 |
2012年 | 91篇 |
2011年 | 113篇 |
2010年 | 88篇 |
2009年 | 112篇 |
2008年 | 121篇 |
2007年 | 91篇 |
2006年 | 74篇 |
2005年 | 72篇 |
2004年 | 61篇 |
2003年 | 82篇 |
2002年 | 75篇 |
2001年 | 72篇 |
2000年 | 48篇 |
1999年 | 57篇 |
1998年 | 197篇 |
1997年 | 126篇 |
1996年 | 104篇 |
1995年 | 70篇 |
1994年 | 54篇 |
1993年 | 58篇 |
1992年 | 31篇 |
1991年 | 16篇 |
1990年 | 18篇 |
1989年 | 31篇 |
1988年 | 19篇 |
1987年 | 14篇 |
1986年 | 20篇 |
1985年 | 23篇 |
1984年 | 21篇 |
1983年 | 17篇 |
1982年 | 19篇 |
1981年 | 16篇 |
1980年 | 25篇 |
1979年 | 13篇 |
1978年 | 11篇 |
1977年 | 23篇 |
1976年 | 24篇 |
1974年 | 9篇 |
1973年 | 7篇 |
排序方式: 共有2602条查询结果,搜索用时 15 毫秒
41.
Huiyuan Geng Takahiro Ochi Shogo Suzuki Masaaki Kikuchi Satoru Ito Junqing Guo 《Journal of Electronic Materials》2013,42(7):1999-2005
Bulk multifilled n- and p-type skutterudites with La as the main filler were fabricated using the spark plasma sintering (SPS) method. The thermoelectric properties and thermal stability of these skutterudites were investigated. It was found that the interactions among the filling atoms also play a vital role in reducing the lattice thermal conductivity of the multifilled skutterudites. ZT = 0.76 for p-type La0.8Ba0.01Ga0.1Ti0.1Fe3CoSb12 and ZT = 1.0 for n-type La0.3Ca0.1Al0.1Ga0.1In0.2Co3.75Fe0.25Sb12 skutterudites have been achieved. Furthermore, the differential scanning calorimetry (DSC) results show that there is no skutterudite phase decomposition till 750°C for the La0.8Ba0.01Ga0.1Ti0.1Fe3CoSb12 sample. The thermal stability of the La0.8Ba0.01Ga0.1Ti0.1Fe3CoSb12 skutterudite is greatly improved. Using the developed multifilled skutterudites, the fabricated module with size of 50 mm × 50 mm × 7.6 mm possesses maximum output power of 32 W under the condition of hot/cold sides = 600°C/50°C. 相似文献
42.
本文给出了一种新的块匹配运动估计算法,它根据视频图像内容的复杂程度自适应地选择常规的或者低比特分辨率的图像来进行块匹配,并且采用了一种混合使用两种比特分辨率图像的新望远镜搜索算法.模拟结果表明,新算法具有较低的计算复杂性,并且能够保证较好的视频质量.基于该算法,我们设计了一种新的脉动阵列结构的搜索引擎.该引擎具有可分割的数据通道,从而在使用低比特分辨率图像进行块匹配时能够通过加强处理的并行性来提高吞吐率.新的运动估计器可工作在较低的时钟频率和电源电压之下,具有低的功耗消耗. 相似文献
43.
Aoki K.. Kondo J.. Iwata Y.. Hamajima A.. Ejiri T.. Mitomi O.. Minakata M.. 《Lightwave Technology, Journal of》2007,25(7):1805-1810
We propose a small-footprint X-cut thin-sheet lithium niobate optical modulator with high-speed and low-driving-voltage characteristics. Since an optical waveguide is folded by a mirror placed at one edge of the modulation chip, the chip can be shortened by about half. In addition, a wide modulation bandwidth can be achieved, because the path-length difference between the optical waveguide and the coplanar-waveguide (CPW) electrode is decreased to as short as possible by placing the CPW electrode as far as possible along the optical waveguide in the folded portion, and the microwave effective index is set to realize effective velocity matching between the lightwave and the microwave. A small footprint of 1.78 times 29 mm, a low half-wave voltage of 2.0 V at dc, and a 3-dBe modulation bandwidth of 20 GHz were obtained. 相似文献
44.
Ge Nie Takahiro Ochi Shogo Suzuki Masaaki Kikuchi Satoru Ito Junqing Guo 《Journal of Electronic Materials》2014,43(6):1752-1756
By multifilling with La, Ba, Ga, Ti, Yb, Ca, Al, and In, the dimensionless figure of merit ZT of filled skutterudites has been improved in this work. ZT reached 0.75 for p-type (La,Ba,Ga,Ti) x (Fe,Co)4Sb12 (x = 0.8 to 1.0) and 1.0 for n-type (Yb,Ca,Al,Ga,In) y (Co,Fe)4Sb12 (y = 0.7 to 0.9). After annealing at 873 K for 180 h, 300 h, 710 h, 1000 h, and 5000 h in vacuum, the Seebeck coefficient S and the electrical resistivity ρ of the samples increased while the thermal conductivity λ decreased with increasing annealing time. As a result, the ZT values of both p- and n-type skutterudites remained unchanged or were slightly improved, demonstrating the excellent thermal stability of these skutterudites. 相似文献
45.
Olindo Isabella Hitoshi Sai Michio Kondo Miro Zeman 《Progress in Photovoltaics: Research and Applications》2014,22(6):671-689
The flattened light‐scattering substrate (FLiSS) is formed by a combination of two materials with a high refractive index mismatch, and it has a flat surface. A specific realization of this concept is a flattened two‐dimensional grating. When applied as a substrate for thin‐film silicon solar cells in the nip configuration, it is capable to reflect light with a high fraction of diffused component. Furthermore, the FLiSS is an ideal substrate for growing high‐quality microcrystalline silicon (µc‐Si:H), used as bottom cell absorber layer in most of multijunction solar cell architectures. FLiSS is a three‐dimensional structure; therefore, a full‐wave analysis of the electromagnetic field is necessary for its optimal implementation. Using finite element method, different shapes, materials, and geometrical parameters were investigated to obtain an optimized FLiSS. The application of the optimized FLiSS in µc‐Si:H single junction nip cell (1‐µm‐thick i‐layer) resulted in a 27.4‐mA/cm2 implied photocurrent density. The absorptance of µc‐Si:H absorber exceeded the theoretical Yablonovitch limit for wavelengths larger than 750 nm. Double and triple junction nip solar cells on optimal FLiSS and with thin absorber layers were simulated. Results were in line with state‐of‐the‐art optical performance typical of solar cells with rough interfaces. After the optical optimization, a study of electrical performance was carried out by simulating current–voltage characteristics of nip solar cells on optimized FLiSS. Potential conversion efficiencies of 11.6%, 14.2%, and 16.0% for single, double, and triple junction solar cells with flat interfaces, respectively, were achieved. Copyright © 2012 John Wiley & Sons, Ltd. 相似文献
46.
The high residual stress in a resin-molded electronic package sometimes makes the electronic functions unstable. Therefore the residual stress in electronic packages, especially on the top surfaces of semiconductor chips, should be evaluated. The objective of this study is to present a simple method for evaluating residual stress in resin-molded semiconductor chips using a combination of experimental and numerical methods. The actual residual stress of the packaging process was measured by using test chips that included piezoresistive gauges. A linear thermoelastic finite element analysis was then carried out using a three-dimensional model. The finite element analysis was performed under a stress-free temperature determined by the temperature dependence of the residual stress, which was experimentally measured by using the piezoresistive test chips. The measured residual stress using the test chips agreed well with the results of the finite element analysis. It was therefore confirmed that the present evaluation method, combining experimental and numerical methods, is reliable and reasonable. 相似文献
47.
48.
Vladimir Svrcek Katerina Dohnalova Davide Mariotti Minh Tuan Trinh Rens Limpens Somak Mitra Tom Gregorkiewicz Koiji Matsubara Michio Kondo 《Advanced functional materials》2013,23(48):6051-6058
Substantial improvements of the absolute photoluminescence quantum yield (QY) for surfactant‐free silicon nanocrystals (Si‐ncs) by atmospheric pressure microplasma 3‐dimensional surface engineering are reported. The effect of surface characteristics on carrier multiplication mechanisms is explored using transient induced absorption and photoluminescence QY. Surface engineering of Si‐ncs is demonstrated to lead to more than 120 times increase in the absolute QY (from 0.1% up to 12%) within an important spectral range of the solar emission (2.3–3 eV). The Si‐ncs QY is shown to be stable when Si‐ncs are stored in ethanol at ambient conditions for three months. 相似文献
49.
S. Shirakata Y. Fujiwara M. Kondo T. Nishino Y. Hamakawa 《Journal of Electronic Materials》1986,15(6):323-329
The interface stress at InGaPAs/GaAs heterostructure has been investigated using the energy shift and splitting of the Cr-related
zero-phonon photoluminescence line at 0.839 eV observed in GaAs. It has been found that the GaAs substrate suffers both compressive
uniaxial stress and tensile hydrostatic pressure at the InGaPAs/GaAs heterointerface. These shifts and splittings of the 0.839
eV line have been systematically examined as a function of the lattice mismatch between InGaPAs and GaAs, and the thicknesses
of the epitaxial-layer and substrate. The amount of the interface stress existing at InGaPAs/GaAs heterostructure has been
estimated, based on uniaxial stress data for GaAs: Cr wafers. 相似文献
50.