Simple Iterative Procedures for Quantum-Mechanical Bound States

Iterative methods are developed to obtain approximate solutions for bound states of quantum-mechanical systems. A sequence of 2 × 2 secular equations is solved, to yield a specified eigensolution to the N × N secular equation. Our simplest procedure ensures convergence only for certain states, but a generalisation appears to converge for any state. Some sample calculations are presented, both for model (anharmonic oscillator) systems and for a two-electron atom.     

CAD off-line programming for industrial machine vision

CAD/CAM tools are essential components of the computer-integrated factory. Up to now, they have been used for tasks such as the simulation and path programming of numerically controlled machine tools, and sometimes industrial robots. The CAD-vision interconnection described here enables us to program parts learning on the workstation, to download piece features in the vision system for inspection on the production line, to simulate the recognition process on a set of parts stored in the computer, and to update vision files after modifications in the CAD system database.     

Application de l'impédancemétrie électrique à l'étude de la réticulation d'un adhésif en film. Cas d'un assemblage métal/métal

Under a thermal treatment, the curing of an adhesive film is associated with changes in rheological and electrical properties of the resin. A non destructive monitoring of the curing process of such a film is performed by using electrical impedance measurements. The interest of such techniques is demonstrated for the determination of the onset and the end of wetting of a prepolymer film (FM96) on a substrate, the gel point and the completion of the curing reaction occurring during the polymerization of the adhesive film sandwiched between two metallic plates (AISI 304 L (Z2 CN 18-10) stainless steel). The results thus obtained show a clear influence of the temperature and cure time. Impedance measurements performed during a subsequent thermal annealing cycle indicate the presence of multiple phases in the crosslinked adhesive. These results were confirmed by using DSC and DTMA.