A risk management approach to safety assessment of trenchless technologies for culvert rehabilitation

Proper functioning of culverts is not only critical to protecting the transportation system from flooding but also critical to maintaining the expected service life of the overall transportation system. During the service life of culverts, they deteriorate due to many reasons such as corrosion caused by road salt, blockage by debris and sediment, poor construction techniques, etc. Trenchless technologies have been used by several State Departments of Transportation (DOTs) to rehabilitate deteriorated drainage structures without disrupting the traffic and within a relatively short span of time. These technologies provide many benefits in terms of cost, time, quality, and expected service life. However, the safety aspects of these techniques have not been discussed and documented in detail probably due to the complexity and the lack of safety standards and specifications directly associated with the techniques. This paper discusses the application of a risk assessment framework to assess potential safety issues of currently available trenchless technologies for culvert rehabilitation. The findings of the study will provide additional information to improve the decision making process in selecting and planning culvert rehabilitation projects.     

学习实践科学发展观的思考

以上海市政工程设计研究总院为例,论述了与时俱进,增强科学发展需要解决的认识问题;分析了转变发展方式,谋求更大发展空间的工作重点;提出了加大政策引导和资源整合力度,抓好基层党建工作和企业文化建设的措施。     

频谱分析仪在测量过程中的优化使用

为了在测量中高效使用频谱分析仪,需要对其进行优化设置。主要阐述了如何在测量过程中根据测试目的优化设置频谱分析仪相关参数和状态,以获得高的测量精度、快的测量速度和大的动态范围从而达到优化使用频谱分析仪、提高测量效能的目的。     

Perovskite‐Induced Ultrasensitive and Highly Stable Humidity Sensor Systems Prepared by Aerosol Deposition at Room Temperature

A new capacitive‐type humidity sensor is proposed using novel materials and fabrication process for practical applications in sensitive environments and cost‐effective functional devices that require ultrasensing performances. Metal halide perovskites (CsPbBr₃ and CsPb₂Br₅) combined with diverse ceramics (Al₂O₃, TiO₂, and BaTiO₃) are selected as sensing materials for the first time, and nanocomposite powders are deposited by aerosol deposition (AD) process. A state‐of‐the‐art CsPb₂Br₅/BaTiO₃ nanocomposite humidity sensor prepared by AD process exhibits a significant increase in humidity sensing compared with CsPbBr₃/Al₂O₃ and CsPbBr₃/TiO₂ sensors. An outstanding humidity sensitivity (21426 pF RH%^?1) with superior linearity (0.991), fast response/recovery time (5 s), low hysteresis of 1.7%, and excellent stability in a wide range of relative humidity is obtained owing to a highly porous structure, effective charge separation, and water‐resistant characteristics of CsPb₂Br₅. Notably, this unprecedented result is obtained via a simple one‐step AD process within a few minutes at room temperature without any auxiliary treatment. The synergetic combination of AD technique and perovskite‐based nanocomposite can be potentially applied toward the development of multifunctional sensing devices.     

Enhanced thermal stability of a sputtered titanium-nitride film as a diffusion barrier for capacitor-bottom electrodes

The effect of a thin RuO_x layer formed on the Ru/TiN/doped poly-Si/Si stack structure was compared with that on the RuO_x/TiN/doped poly-Si/Si stack structure over the post-deposition annealing temperature ranges of 450–600°C. The Ru/TiN/poly-Si/Si contact system exhibited linear behavior at forward bias with a small increase in the total resistance up to 600°C. The RuO_x/TiN/poly-Si/Si contact system exhibited nonlinear characteristics under forward bias at 450°C, which is attributed to no formation of a thin RuO_x layer at the RuO_x surface and porous-amorphous microstructure. In the former case, the addition of oxygen at the surface layer of the Ru film by pre-annealing leads to the formation of a thin RuO_x layer and chemically strong Ru-O bonds. This results from the retardation of oxygen diffusion caused by the discontinuity of diffusion paths. In particular, the RuO_x layer in a nonstoichiometric state is changed to the RuO₂-crystalline phase in a stoichiometric state after post-deposition annealing; this phase can act as an oxygen-capture layer. Therefore, it appears that the electrical properties of the Ru/TiN/poly-Si/Si contact system are better than those of the RuO_x/TiN/poly-Si/Si contact system.     

Ubiquitous Information Services with JAIN Platform

To provide responsive information services in a ubiquitous computing environment, service software and system development are indispensable. A component-based ubiquitous information system with a JAIN (Java APIs for Integrated Networks) platform to achieve seamless transmissions and reach-everywhere communications was designed in our research. In this development, numerous ubiquitous service modules were identified: location management, roaming, mobile IP and WAP networking. These component-based network modules were constructed using a component composition language with component specification and interface definition, running on top of a distributed service architecture using a JAIN platform to distribute the ubiquitous information services to mobile users. Two applications, Wireless-Application-Protocol (WAP) Mail and Video-on-Demand (VoD) services, show that the JAIN-like platform with the developed networking components effectively fills the gap for application developers between mobile appliances and various kinds of ubiquitous information services.     

Simple K-band MMIC VCO utilizing a miniaturized hairpin resonator and a three-terminal p-HEMT varactor with low phase noise and high output power properties

Presents a fully monolithic K-band MMIC voltage-controlled oscillator (VCO) implemented by using a 0.25 /spl mu/m AlGaAs/InGaAs pseudomorphic HEMT (p-HEMT) technology. The use of a half-wavelength miniaturized hairpin-shaped resonator and a three-terminal p-HEMT varactor was effective in reducing the chip size and simplifying fabrication processes of the microwave MMIC VCO without impairing the performance of the circuit. The VCO provides a typical output power of 11.5 dBm at 20.8 GHz and a free-running phase noise of -82 dBc/Hz at 100 kHz offset and -95 dBc/Hz at 1 MHz offset. It also shows a tuning range of 70 MHz with little reduction in output power and high yield properties. The chip size of the MMIC VCO is 1.5 /spl times/ 2.0 mm/sup 2/.     

A noncooperative power control game for multirate CDMA data networks

The authors consider a multirate code-division multiple acess system, in which all users have the same chip rate and vary their data rate by adjusting the processing gain. The receivers are assumed to be implemented using conventional matched filters, whose performance is sensitive to the received power levels. The authors' goal is to maximize the total system throughput by means of power control. A game theoretic approach is adopted. It is shown that for a certain type of pricing function, a unique Nash equilibrium solution exists and it possesses nice global properties. For example, it can be shown that for the optimal solution a high-rate connection should maintain a higher energy per bit than low-rate ones. The asymptotic spectral efficiency is also derived.     

Interfacial reactions of Sn-Ag-Cu solders modified by minor Zn alloying addition

The near-ternary eutectic Sn-Ag-Cu alloys have been identified as leading Pb-free solder candidates to replace Pb-bearing solders in microelectronic applications. However, recent investigations on the processing behavior and solder joints reliability assessment have revealed several potential reliability risk factors associated with the alloy system. The formation of large Ag₃Sn plates in Sn-Ag-Cu joints, especially when solidified in a relatively slow cooling rate, is one issue of concern. The implications of large Ag₃Sn plates on solder joint performance and several methods to control them have been discussed in previous studies. The minor Zn addition was found to be effective in reducing the amount of undercooling required for tin solidification and thereby to suppress the formation of large Ag₃Sn plates. The Zn addition also caused the changes in the bulk microstructure as well as the interfacial reaction. In this paper, an in-depth characterization of the interfacial reaction of Zn-added Sn-Ag-Cu solders on Cu and Au/Ni(P) surface finishes is reported. The effects of a Zn addition on modification of the interfacial IMCs and their growth kinetics are also discussed.     

一种新型软X 射线气溶胶荷电器的开发与评测 #br#

现有荷电器对 1∼3 nm 气溶胶的通过效率和荷电效率都较低。研发了一种新型软 X 射线气溶胶双极荷电器, 通过结构设计的改进极大地提高了 3 nm 以下气溶胶的通过效率, 同时该荷电器对不同粒径气溶胶的本征荷电效率仍 与现有荷电器相近。实验室评测结果表明: 在 1 L·min−1 流量下, 新型荷电器对 3 nm 以下不同粒径气溶胶的通过效率 与 TSI 3088 软 X 射线荷电器相比可提高 175%∼300%; 在 2.5 L·min−1 流量下, 可提高 115%∼173%。同时, 新型荷电器 对 10∼40 nm 及 3 nm 以下气溶胶的本征荷电效率与目前广泛使用的 Fuchs 稳态理论近似公式计算得出的荷电效率及 其他类似荷电器的实测荷电效率基本吻合。相对于现有的商业荷电器, 该新型荷电器对 3 nm 以下气溶胶有着更高的 表观荷电效率, 具有潜在的应用价值。