Effective factors on synthesis of the hematite–silica red inclusion pigment

The work focuses on the synthesis of a red ceramic pigment by inclusion of hematite in a fumed silica matrix with different specific surface areas. Iron(II) sulfate was used as hematite precursor. Mixtures of iron(II) sulfate and fumed silica with different mole ratios were heated at different temperatures from 1000 to 1300 °C for 4 h.     

Identification of the temperature field and stresses in a thermosensitive cylinder according to the surface strains

We identify the time dependence of temperature of a surface of a long hollow thermosensitive cylinder and its thermal and thermal stressed states according to the known temperature and strains on the other surface. The posed problem is reduced to the inverse problem of thermoelasticity. By using the solution of the direct problem of thermoelasticity, we perform the numerical verification of the proposed procedure of solution of the inverse problem. __________ Translated from Fizyko-Khimichna Mekhanika Materialiv, Vol. 43, No. 6, pp. 55–61, November–December, 2007.     

Sensitometric characteristics of an all‐solid‐state photoelectrochromic pixel for an electrochromic light‐addressable display

Abstract— An all solid‐state photoelectrochromic element (PECE) was developed on the basis of electrochromic layers of WO₃ and polyaniline with a layer of polymer electrolyte placed on a base of polyamidosulfoacid, in which a thin‐film CdS_xSe_1?x photoresistor was used as an electronic key. The dependence of the sensitometric characteristics of the PECE on the applied voltage was studied.     

Cover Picture: UV‐Light‐Induced Swelling and Visible‐Light‐Induced Shrinking of a TiO2‐Containing Redox Gel (Adv. Mater. 9/2007)

Polyacrylate gels containing Ag⁺ and TiO₂ nanoparticles are shown to swell under UV light and shrink under visible light in water. In work reported by Tetsu Tatsuma and co‐workers on p. 1249, the TiO₂ absorbs UV light and reduces the Ag⁺, whereas the deposited Ag absorbs visible light and dissolves itself. These redox reactions change the interactions between the polymer chains and eventually the volume of the gel, as shown on the cover.     

Aging response of the young’s modulus and mechanical properties of Ti-29Nb-13Ta-4.6Zr for biomedical applications

Alloys for implant devices require improved strength but a reduced Young’s modulus, in order to become mechanically more compatible with adjacent bone tissues. In this study, a new metastable β-type titanium alloy, Ti-29Nb-13Ta-4.6Zr (wt pct), was subjected to aging treatment to produce different microstructures, and the resulting mechanical properties, including the Young’s modulus, were measured. The Young’s modulus of this alloy is found to be sensitive to microstructures generated by various heat treatments. For microstructures varying from (α + β) to (α + β + ω) and (β + ω), the Young’s modulus increases with an accompanying increase in tensile strength and hardness, but decreases in ductility. The (β + ω) microstructure has a low strength, high modulus, and poor ductility and cannot be used for biomedical applications. For an (α + β) microstructure, the volume fraction of the phases is shown to be the main factor that determines the mechanical properties.     

Radio sensing of a cometary nucleus: Possibilities for investigating the surface layer

The possibility for determining the structure of the surface layer of a cometary nucleus from the data of bistatic radar sensing is investigated. A rigorous solution formulated for this problem on the basis of vector equations of the electromagnetic field is presented.     

Development of Stretch Solder Interconnections for Wafer Level Packaging

A wafer level packaging technique has been developed with an inherent advantage of good solder joint co-planarity suitable for wafer level testing. A suitable weak metallization scheme has also been established for the detachment process. During the fabrication process, the compliancy of the solder joint is enhanced through stretching to achieve a small shape factor. Thermal cycling reliability of these hourglass-shaped, stretch solder interconnections has been found to be considerably better than that of the conventional spherical-shaped solder bumps.     

A Tutorial on GrÖbner Bases With Applications in Signals and Systems

This paper is a tutorial on GrÖbner bases and a survey on the applications of GrÖbner bases in the broad field of signals and systems. A reasonably detailed review is given of several fundamental theoretical issues that occur in the use of GrÖbner bases in multidimensional signals and systems applications. These topics include the primeness of multivariate polynomial matrices, multivariate unimodular polynomial matrix completion, and prime factorization of multivariate polynomial matrices. A brief review is also presented on the wide-ranging applications of GrÖbner bases in multidimensional as well as one-dimensional circuits, networks, control, coding, signals, and systems and other related areas like robotics and applied mechanics. The impact and scope of GrÖbner bases in signals and systems are highlighted with respect to what has already been accomplished as a stepping stone to expanding future research.