The corrosion behaviour of a friction stir welded AA7108 T79 aluminium alloy has been investigated using accelerated testing (ASTM G34 EXCO) and electrochemical measurements. The welded alloy showed the expected zones associated with friction stir welding, namely nugget, thermomechanically affected zone and heat affected zone. Corrosion testing revealed that the edge regions of the thermomechanically affected zone were most susceptible to corrosion. The localized corrosion occurs intergranularly due to the non-uniform distribution of η/η′ (MgZn2) precipitates within the thermomechanically affected zone. 相似文献
A mechanism of formation of copper nanoparticles is proposed for alkaline etching of a sputtering-deposited Al-30 at.%Cu alloy, simulating the equilibrium θ phase of 2000 series aluminium alloys. Their formation involves enrichment of copper in the alloy beneath a thin alumina film, clustering of copper atoms, and occlusion of the clusters, due to growth of alumina around the clusters, to form nanoparticles. The proposed mechanism is supported by medium energy ion scattering, Rutherford backscattering spectroscopy, X-ray photoelectron spectroscopy, and transmission electron microscopy of the alloy following immersion in the sodium hydroxide solution, which disclose the enrichment of copper and the generation of the nanoparticles in the etching product of hydrated alumina. The generation of the nanoparticles is dependent upon the enrichment of copper in the alloy in a layer of a few nanometres thickness, with no requirement for bulk de-alloying of the alloy. 相似文献
The influence of copper on the morphologies of porous anodic alumina has been investigated under current and voltage control using a sputtering-deposited Al-2.7 at.% Cu alloy and a commercial AA 2024-T3 aluminium alloy anodized in either sulphuric acid electrolyte or the same electrolyte but with addition of tartaric acid. The findings indicate that film development involves repeated formation of embryo cells of anodic alumina at the metal/film interface. During the initial stages of anodizing at constant voltage, cell formation is accompanied by current peaks in the current-time response. The porosity of the resultant films has a lateral aspect due to the layering of embryo cells. The thickness of individual layers is proportional to the formation voltage, with a ratio of the order 1 nm V−1. The cell formation is accompanied by enrichment of copper in the alloy, incorporation of copper species into the anodic film, in low amounts relative to the alloy, and evolution of oxygen. These processes disrupt the formation of the classical pore morphology, characteristic of high purity aluminium, due to continuous formation of fresh embryo cells and re-direction of pores. The main effect of the tartaric acid addition to the sulphuric acid was to reduce the rate of anodizing of the alloys at constant voltage by about 10-20%. 相似文献
Diamond coating tools have been increasingly used for machining advanced materials. Recently, a microwave plasma-assisted chemical vapor deposition (CVD) technology was developed to produce diamond coatings which consist of nano-diamond crystals embedded into a hard amorphous diamond-like carbon matrix. In this study, the nanocrystalline diamond (NCD) coating tools were evaluated in machining high-strength aluminum (Al) alloy. The conventional CVD microcrystalline diamond coating (MCD) tools and PCD tools were also tested for performance comparisons. In addition, stress distributions in diamond coating tools, after deposition and during machining, were analyzed using a 2D finite element (FE) thermomechanical model.
The results show that catastrophic failures, reached in all except one machining conditions, limit the NCD tool life, which is primarily affected by the cutting speed. In addition, coating delamination in the worn NCD tools is clearly evident from scanning electron microscopy (SEM) and force monitoring in machining can capture the delamination incident. At a high feed, coating delamination may extend to the rake face. Furthermore, SEM observations of coating failure boundaries show intimate coating-substrate contact. Though the NCD tools are inferior to the PCD tools, they substantially outperform the MCD tools, which failed by premature delamination. The diamond coating tools can have high residual stresses from the deposition and stresses at the cutting edge are highly augmented. Further machining loading causes the stress reversal pattern which seems to correlate with the tool wear severity. 相似文献
Gold and gold/platinum group metals (Au/PGM) catalysts are active under mild conditions or even at ambient temperature or
less and this makes them unique. They will therefore be effective in reducing running costs of chemical plants and increasing
the selectivity of the reactions involved where applicable. In pollution control applications such as air cleaning, low light-off
autocatalysts, and purification of hydrogen streams used for fuel cells they have the characteristics to become the catalysts
of choice, especially now that their durability and resistance to poisons is being shown to be better than was anticipated.
The mechanisms of these gold catalysed reactions are still uncertain but both oxidised and metallic gold are probably involved,
and the details depend on types of reaction and the conditions used. 相似文献
This work reports results of weight loss, potentiodynamic polarization and impedance measurements on the corrosion inhibition
of copper in aerated non-stirred 3% NaCl solutions in the temperature range 15–65 °C using sodium oleate (SO) as an anionic
surfactant inhibitor. These studies have shown that SO is a very good ”green”, mixed-type inhibitor. The inhibition process
was attributed to the formation of an adsorbed film on the metal surface that protects the metal against corrosive agents.
Scanning electron microscopy (SEM) and energy dispersion X-ray (EDX) observations of the electrode surface confirmed the existence
of such an adsorbed film. The inhibition efficiency increases with increasing surfactant concentration and time of immersion,
while it decreases with solution temperature. Maximum inhibition efficiency of the surfactant is observed at concentrations
around its critical micellar concentration (CMC). The potential of zero charge (pzc) of copper was studied by ac impedance,
and the mechanism of adsorption is discussed. The sigmoidal shape of the adsorption isotherm confirms the applicability of
Frumkin’s equation to describe the adsorption process. Thermodynamic functions for the adsorption process were determined. 相似文献