New and improved approaches for shared-path protection in WDM mesh networks

This paper investigates the problem of dynamic survivable lightpath provisioning in optical mesh networks employing wavelength-division multiplexing (WDM). In particular, we focus on shared-path protection because it is resource efficient due to the fact that backup paths can share wavelength links when their corresponding working paths are mutually diverse. Our main contributions are as follows. 1) First, we prove that the problem of finding an eligible pair of working and backup paths for a new lightpath request requiring shared-path protection under the current network state is NP-complete. 2) Then, we develop a heuristic, called CAFES, to compute a feasible solution with high probability. 3) Finally, we design another heuristic, called OPT, to optimize resource consumption for a given solution. The merits of our approaches are that they capture the essence of shared-path protection and approach to optimal solutions without enumerating paths. We evaluate the effectiveness of our heuristics and the results are found to be promising.     

悬臂式电磁发射导轨及壁板在发射状态下的强度分析

为进一步研究电磁炮的模型理论,建立了方型电磁发射装置的双层弹性基础悬臂梁模型。简化导轨和壁板为上、下梁,用解析法求解其在工作状态下的动态响应,并使用数值法求解与之比较。研究结果显示：解析法和数值法的计算结果较为吻合,解析法的可靠性在一定程度上得到了验证;双层弹性悬臂梁动态响应的最大值发生在距起始位置0~0.5 m范围内,且上梁的响应比下梁的大。研究结果可为电磁炮的强度分析以及设计提供一定参考。     

基于光纤光栅技术的全光纤单纵模激光器研究进展

实现单纵模光纤激光器的技术难点主要在于如何使谐振腔具有高的模式选择性能,以及如何加入适当的窄带滤波器来辅助选频,而光纤光栅技术在光纤激光器的设计与性能优化方面扮演着十分重要的角色。综合论述了近年来国内外利用光纤光栅产生单波长或多波长单纵模全光纤激光器的主要实现技术,并分析其优缺点,最后给出了总结与展望。     

认知无线电网络中次用户平均吞吐量的优化

协作频谱感知的认知无线电网络中,已有研究表明增加参与协作频谱感知的次用户数量能够提高感知性能,进而提高信道吞吐量。然而,由于信道容量的限制,不断增加参与协作感知的次用户数量并不会使信道吞吐量无限提高,反而会使次用户平均可获得的吞吐量不断降低。针对上述问题,该文以次用户平均吞吐量为优化目标,证明多信道条件下,对于任意给定的融合参数,次用户的平均吞吐量是感知时间的凸函数,并提出交叉迭代算法进行2维优化。仿真结果表明,当信噪比为-10 dB时,次用户使用交叉迭代算法获得的平均吞吐量较已有算法可提高20%以上。     

变频调速在空调系统中的应用

针对人们对生活环境的要求和节能技术的推进,介绍变频空调相对于定频空调节能舒适的优势,通过对变频调速的基本原理、压缩机的定子电压与频率关系的论述,详细分析将变频器引入空调系统的工作原理,结果表明变频空调已进入快速发展期,在我国变频空调将成为空调发展的必然趋势。     

新的非平面Flash Memory结构

提出了一种为在低压下工作的具有较快编程速度的新的非平面的flash memory单元结构,该结构采用简单的叠栅结构并只需增加一步光刻制做出这一新的沟道结构.对于栅长为1.2μm flash单元,获得了在Vg＝15V,Vd＝5V条件下编程时间为42μs,在Vg＝-5V,Vs＝8V条件下的擦除时间为24ms的高性能flash单元,这一新结构的编程速度比普通平面型快闪存储器要快很多.这种新结构flash单元在高速应用场合下具有很好的应用前景.     

基于F型管壳的旋转缝焊技术研究

本文深入研究了旋转缝焊技术,讨论了缝焊中焊边受力、速度变化和热量分布情况,分析了影响旋转缝焊气密性的主要因素.     

Throughput Optimization via Association Control in Wireless LANs

With the rapid development of the mobile computing, accessing the Internet everywhere is important for mobile device users. Wireless LAN is a stable and reliable technique to provide network access for mobile devices. The Wireless LAN Access Points(APs) have been densely deployed so that a user can access the Internet almost everywhere. However, this fact brings some new challenges. Since the regular AP association strategy is signal-based when a user receive the signals of multiple APs. The APs with strong signal will be too overloaded while the bandwidth resource in other APs is wasted. The throughput of the whole WLAN is not optimized. Moreover, the diverse bandwidth demands among users further exacerbate the situation. In this paper, aiming at optimizing the throughput over the whole WLAN, a joint AP association and bandwidth allocation problem is formulated. The different users’ bandwidth demands are added as new constraints. We comprehensively analyze the solution space and prove the problem NP-hard. Our trace-driven evaluations show that the throughput is improved about 23.1 % compared to the conventional schemes.     

Fabrication of a 100%fill-factor silicon microlens array

正A simple method has been developed for the fabrication of a silicon microlens array with a 100%fill factor and a smooth configuration.The microlens array is fabricated by using the processes of photoresist(SU8- 2005) spin coating,thermal reflow,thermal treatment and reactive ion etching(RIE).First,a photoresist microlens array on a single-polished silicon substrate is fabricated by both thermal reflow and thermal treatment technologies. A typical microlens has a square bottom with size of 25μm,and the distance between every two adjacent microlenses is 5μm.Secondly,the photoresist microlens array is transferred to the silicon substrate by RIE to fabricate the silicon microlens array.Experimental results reveal that the silicon microlens array could be formed by adjusting the quantities of the reactive ion gases of SF_6 and O_2 to proper values.In this paper,the quantities of SF_6 and O_2 are 60 sccm and 50 sccm,respectively,the corresponding etch ratio of the photoresist and the silicon substrate is 1 to 1.44.The bottom size and height of a typical silicon microlens are 30.1μm and 3μm,respectively. The focal lengths of the microlenses ranged from 15.4 to 16.6μm.