Evaluation and optimization of package processing and design through solder joint profile prediction

Solder joints are generated using a variety of methods to provide both mechanical and electrical connection for applications such as flip-chip, wafer level packaging, fine pitch, ball-grid array, and chip scale packages. Solder joint shape prediction has been incorporated as a key tool to aid in process development, wafer level and package level design and development, assembly, and reliability enhancement. This work demonstrates the application of an analytical model and the Surface Evolver software in analyzing a variety of solder processing methods and package types. Bump and joint shape prediction was conducted for the design of wafer level bumping, flip-chip assembly, and wafer level packaging. The results from the prediction methodologies are validated with experimentally measured geometries at each level of design.     

Analytic models for the latency and steady-state throughput of TCP Tahoe, Reno, and SACK

Continuing the process of improvements made to TCP through the addition of new algorithms in Tahoe and Reno, TCP SACK aims to provide robustness to TCP in the presence of multiple losses from the same window. In this paper we present analytic models to estimate the latency and steady-state throughput of TCP Tahoe, Reno, and SACK and validate our models using both simulations and TCP traces collected from the Internet. In addition to being the first models for the latency of finite Tahoe and SACK flows, our model for the latency of TCP Reno gives a more accurate estimation of the transfer times than existing models. The improved accuracy is partly due to a more accurate modeling of the timeouts, evolution of cwnd during slow start and the delayed ACK timer. Our models also show that, under the losses introduced by the droptail queues which dominate most routers in the Internet, current implementations of SACK can fail to provide adequate protection against timeouts and a loss of roughly more than half the packets in a round will lead to timeouts. We also show that with independent losses SACK performs better than Tahoe and Reno and, as losses become correlated, Tahoe can outperform both Reno and SACK.     

A VQ-based blind image restoration algorithm

Learning-based algorithms for image restoration and blind image restoration are proposed. Such algorithms deviate from the traditional approaches in this area, by utilizing priors that are learned from similar images. Original images and their degraded versions by the known degradation operator (restoration problem) are utilized for designing the VQ codebooks. The codevectors are designed using the blurred images. For each such vector, the high frequency information obtained from the original images is also available. During restoration, the high frequency information of a given degraded image is estimated from its low frequency information based on the codebooks. For the blind restoration problem, a number of codebooks are designed corresponding to various versions of the blurring function. Given a noisy and blurred image, one of the codebooks is chosen based on a similarity measure, therefore providing the identification of the blur. To make the restoration process computationally efficient, the principal component analysis (PCA) and VQ-nearest neighbor approaches are utilized. Simulation results are presented to demonstrate the effectiveness of the proposed algorithms.     

On trading wavelengths with fibers: a cost-performance based study

We consider the effect of multiple fibers on wavelength division multiplexing networks without wavelength conversion. We study networks with dynamic wavelength routing and develop accurate analytical models to compare various possible options using single- and multiple-fiber networks. We use results of an analytical model and simulation-based studies to evaluate the blocking performance and cost of multifiber networks. The number of fibers required providing high performance in multifiber networks and their costs are compared. A case is made for using multiple fibers in each link with fewer wavelengths instead of using a single fiber with many wavelengths. In particular, we show that a network with four fibers per link and with four wavelengths on each fiber without any wavelength conversion on any node yields similar same performance as the networks with one fiber per link and 16 wavelengths per fiber on each link and with full wavelength conversion capability on all nodes. In addition, the multifiber network may also offer the cost advantage depending on the relative cost of components. We develop a parametric cost model to show that multiple fibers in each link are an attractive option. Finally, such multifiber networks also has fault tolerance, with respect to a single fiber failure, already built into the system.     

Derivation of a second-order switching surface in the boundary control of buck converters

A second-order switching surface in the boundary control of buck converters is derived in this letter. The formulated switching surface can make the overall converter exhibit better steady-state and transient behaviors than the one with a first-order switching surface. The switching surface is derived by estimating the state trajectory movement after a switching action, resulting in a high state trajectory velocity along the switching surface. This phenomenon accelerates the trajectory moving toward the target operating point. The proposed control scheme has been successfully applied to a 120-W buck converter. The large-signal performance and a comparison with the first-order switching surface have been studied.     

Influence of device engineering on the analog and RF performances of SOI MOSFETs

This work presents a systematic comparative study of the influence of various process options on the analog and RF properties of fully depleted (FD) silicon-on-insulator (SOI), partially depleted (PD) SOI, and bulk MOSFET's with gate lengths down to 0.08 /spl mu/m. We introduce the transconductance-over-drain current ratio and Early voltage as key figures of merits for the analog MOS performance and the gain and the transition and maximum frequencies for RF performances and link them to device engineering. Specifically, we investigate the effects of HALO implantation in FD, PD, and bulk devices, of film thickness in FD, of substrate doping in SOI, and of nonstandard channel engineering (i.e., asymmetric Graded-channel MOSFETs and gate-body contacted DTMOS).     

An improved statistical analysis of the least mean fourth (LMF) adaptive algorithm

The paper presents an improved statistical analysis of the least mean fourth (LMF) adaptive algorithm behavior for a stationary Gaussian input. The analysis improves previous results in that higher order moments of the weight error vector are not neglected and that it is not restricted to a specific noise distribution. The analysis is based on the independence theory and assumes reasonably slow learning and a large number of adaptive filter coefficients. A new analytical model is derived, which is able to predict the algorithm behavior accurately, both during transient and in steady-state, for small step sizes and long impulse responses. The new model is valid for any zero-mean symmetric noise density function and for any signal-to-noise ratio (SNR). Computer simulations illustrate the accuracy of the new model in predicting the algorithm behavior in several different situations.     

2-D symmetry: theory and filter design applications

In this comprehensive review article, we present the theory of symmetry in two-dimensional (2-D) filter functions and in 2-D Fourier transforms. It is shown that when a filter frequency response possesses symmetry, the realization problem becomes relatively simple. Further, when the frequency response has no symmetry, there is a technique to decompose that frequency response into components each of which has the desired symmetry. This again reduces the complexity of two-dimensional filter design. A number of filter design examples are illustrated.     

Effect of anisotropy of tin on thermomechanical behavior of solder joints

Properties of body centered tetragonal tin are highly anisotropic. As a consequence large stresses can develop at the tin grain boundaries due to coefficient of thermal expansion mismatch during temperature excursions. A modeling approach to evaluate the 3D stress states that develop at grain boundaries during thermomechanical fatigue in tin-based solder is presented. Development of significant amounts of stresses in the plane of the grain boundary can cause grain-boundary sliding and surface-relief effects, while those normal to the grain boundary can cause grain-boundary decohesion and cracking.