Metabolism of phospholipids in the yeast Schizosaccharomyces pombe

The fission yeast Schizosaccharomyces pombe is an important model organism for the study of fundamental questions in eukaryotic cell and molecular biology. A plethora of cellular processes are membrane associated and/or dependent on the proper functioning of cellular membranes. Phospholipids are not only the basic building blocks of cellular membranes; they also serve as precursors to numerous signaling molecules. In this review, we describe the biosynthetic pathways leading to major S. pombe phospholipids, how these pathways are regulated, and what is known about degradation and turnover of fission yeast phospholipids. This review also addresses the synthesis, regulation and the role of water-soluble phospholipid precursors. The last chapter of the review is devoted to the use of S. pombe for the biotechnological production of value-added lipid molecules.     

On‐the‐Spot Immobilization of Quantum Dots,Graphene Oxide,and Proteins via Hydrophobins

Class I hydrophobin Vmh2, a peculiar surface active and versatile fungal protein, is known to self‐assemble into chemically stable amphiphilic films, to be able to change wettability of surfaces, and to strongly adsorb other proteins. Herein, a fast, highly homogeneous and efficient glass functionalization by spontaneous self‐assembling of Vmh2 at liquid–solid interfaces is achieved (in 2 min). The Vmh2‐coated glass slides are proven to immobilize not only proteins but also nanomaterials such as graphene oxide (GO) and quantum dots (QDs). As models, bovine serum albumin labeled with Alexa 555 fluorophore, anti‐immunoglobulin G antibodies, and cadmium telluride QDs are patterned in a microarray fashion in order to demonstrate functionality, reproducibility, and versatility of the proposed substrate. Additionally, a GO layer is effectively and homogeneously self‐assembled onto the studied functionalized surface. This approach offers a quick and simple alternative to immobilize nanomaterials and proteins, which is appealing for new bioanalytical and nanobioenabled applications.     

Computational Fluid Dynamics Study on a Top-Blown Smelting Process with Lance Failure in an Isa Furnace

JOM - The Isa/Ausmelt smelting technology with a top submerged lance (TSL) has been extensively used in copper smelting processes. However, the TSL is extremely vulnerable to damage and failure...     

Corrosion behaviour of AA2024 aluminium alloy in different tempers in NaCl solution and with the CeCl3 corrosion inhibitor

The paper analyses the corrosion behaviour of naturally and artificially aged AA2024 alloy in NaCl solution and in the presence of an environment-friendly corrosion inhibitor, CeCl₃. On the basis of the values of polarisation resistance and corrosion current density, the corrosion resistance of the protective inhibitor film is established as well as the general corrosion resistance of this aluminium alloy. Resistance to pit formation is determined based on the difference in pitting and corrosion potentials while resistance to pit growth is determined based on the amount of charge consumed during pit growth. A scanning electron microscope is used to examine the morphology of the pits formed during the pitting corrosion testing, as well as to determine the cerium content on intermetallic particles and the matrix AA2024 alloy. The corrosion behaviour of AA2024 alloy is investigated after different test periods in NaCl solution and in the same solution with the CeCl₃ inhibitor. The corrosion resistance of both tempers of AA2024 alloy is more than one order of magnitude higher in the presence of CeCl₃. An explanation of the observed differences in the corrosion behaviour of the naturally and artificially aged AA2024 alloy is proposed. Different corrosion behaviour of the alloy after different test periods is also explained.     

炼油达标污水回用处理试验研究

采用曝气生物滤池、多介质过滤、超滤、反渗透工艺,对炼油达标外排污水进行回用处理中试试验。结果表明,曝气生物滤池对油、COD和浊度去除效果良好,超滤、反渗透膜化学清洗周期达到 2个月以上,脱盐率稳定在98％以上,产水品质达到回用要求。     

管道风险管理方法研究

按照管道风险管理的流程分别对管道风险评价、风险控制和决策支持、效能测试和响应进行了论述。针对目前国内管道行业的情况，提出了进行管道风险评价的有效方法及维护措施。着重介绍了国外管道风险可接受标准的情况，作为国内制定管道风险评价标准的参考。     

智能动态网络资源分配系统

通过对解决GSM移动通信网络热点区域话务拥塞问题的研究，提出了利用可控功分器实现智能动态网络资源的分配，解决不同种类的话务拥塞问题，并着重讨论了该系统目前的成功运用及前景。     

Exposed Die-Top Encapsulation Molding for an Improved High- Performance Flip Chip BGA Package

The recent advancement in high- performance semiconductor packages has been driven by the need for higher pin count and superior heat dissipation. A one-piece cavity lid flip chip ball grid array (BGA) package with high pin count and targeted reliability has emerged as a popular choice. The flip chip technology can accommodate an I/O count of more than five hundreds500, and the die junction temperature can be reduced to a minimum level by a metal heat spreader attachment. None the less, greater expectations on these high-performance packages arose such as better substrate real estate utilization for multiple chips, ease in handling for thinner core substrates, and improved board- level solder joint reliability. A new design of the flip chip BGA package has been looked into for meeting such requirements. By encapsulating the flip chip with molding compound leaving the die top exposed, a planar top surface can be formed. A, and a flat lid can then be mounted on the planar mold/die top surface. In this manner the direct interaction of the metal lid with the substrate can be removed. The new package is thus less rigid under thermal loading and solder joint reliability enhancement is expected. This paper discusses the process development of the new package and its advantages for improved solder joint fatigue life, and being a multichip package and thin core substrate options. Finite-element simulations have been employed for the study of its structural integrity, thermal, and electrical performances. Detailed package and board-level reliability test results will also be reported