Exposed Die-Top Encapsulation Molding for an Improved High- Performance Flip Chip BGA Package

The recent advancement in high- performance semiconductor packages has been driven by the need for higher pin count and superior heat dissipation. A one-piece cavity lid flip chip ball grid array (BGA) package with high pin count and targeted reliability has emerged as a popular choice. The flip chip technology can accommodate an I/O count of more than five hundreds500, and the die junction temperature can be reduced to a minimum level by a metal heat spreader attachment. None the less, greater expectations on these high-performance packages arose such as better substrate real estate utilization for multiple chips, ease in handling for thinner core substrates, and improved board- level solder joint reliability. A new design of the flip chip BGA package has been looked into for meeting such requirements. By encapsulating the flip chip with molding compound leaving the die top exposed, a planar top surface can be formed. A, and a flat lid can then be mounted on the planar mold/die top surface. In this manner the direct interaction of the metal lid with the substrate can be removed. The new package is thus less rigid under thermal loading and solder joint reliability enhancement is expected. This paper discusses the process development of the new package and its advantages for improved solder joint fatigue life, and being a multichip package and thin core substrate options. Finite-element simulations have been employed for the study of its structural integrity, thermal, and electrical performances. Detailed package and board-level reliability test results will also be reported     

Parametric effects on the transient Voltage performance of a DC superconducting cable

The objective of this work was to determine the significant parameters of a 3-GW 200-kV dc superconducting cable system which influence the transient voltage distribution in the various parts of the cable. The cable system consists of four coaxial metallic cylinders. It was found that the dielectric constant and the electrical resistivity of the soil significantly affect the severity of the transient voltages; lower dielectric constant and higher resistivity of the soil will increase the magnitudes of the transient voltages by increasing the earth-return impedance. It was also found that the effect of the conductor internal impedances of the cable is insignificant. Shorting the coaxial cylinders of the cryogen flow and the cryostat will lessen the severity of the transient voltages. Grounding the second, third, and fourth cylinders at regular intervals with low-impedance grounding impedance will also improve the transient performance of the cable. More research is needed to evaluate these procedures.     

Protecting local access telecommunications networks: Toward a minimum-cost solution

The problem of designing fibre-optic networks for local-access telecommunications generates (at least) three non-trivial subproblems. In the first of these subproblems one must determine how many fibre-optic cables (fibres) are required at either end of a street. In the next subproblem a minimum-cost network must be designed to support the fibres. The network must also provide distinct paths from either end of the street to the central exchange(s). Finally, the fibre-optic cables must be placed in protective covers. These covers are available in a number of different sizes, allowing some flexibility when covering each section of the network. In this paper we describe a dynamic programming (DP) formulation for finding a minimum-cost (protective) covering for the network (the third of the subproblems). This problem is a generalised set covering problem with side constraints and is further complicated by the introduction of fixed and variable welding costs. The DP formulation selects covers along each arc (in the network), but cannot exactly model the fixed costs and so does not guarantee optimality. We also describe an integer programming (IP) formulation for assessing the quality of the DP solutions. The cost of the networks constructed by the IP model is less than those designed using the DP model, but the saving is not significant for the problems examined (less than 0.1%). This indicates that the DP model will generally give very good solutions. Furthermore, as the problem dimensions grow, DP gives significantly better solution times than IP.     

Fracture response of fibre-reinforced materials with macro/microcrack damage using the Boundary Element Technique

The Boundary Element Method (BEM) incorporating the Embedded Cell Approach (ECA) has been used to analyse the effects of constituent material properties, fibre spatial distribution and microcrack damage on the localised behaviour of transversely fractured, unidirectional fibre-reinforced composites. Three specific composites, i.e., glass fibre reinforced polyester, carbon fibre reinforced epoxy and a glass-carbon hybrid, are considered. The geometrical structures examined were perfectly periodic, uniformly spaced fibre arrangements in square and hexagonal embedded cells. In addition, numerical simulations were also conducted using embedded cells containing randomly distributed fibres. The models involve both elastic fibres and matrix, with the interfaces between the different phases being fully bonded. The results indicate that the constituent material properties (two phase composite) and spatial distribution have a significant effect on the localised stress distributions around the primary crack tip. However, the strain energy release rate associated with crack propagation is predominantly influenced by the material composition. The three-phase hybrid composite exhibited an apparent intermediate fracture toughness value, compared to the all-glass and all-carbon models. Furthermore, the strain energy release rate for the macrocrack lowers as it enters a zone of localised damage (microcracking). The presence of microcracks relaxes the stress field, which can result in a significant reduction in the energetics of the primary crack.     

A real-time architecture for time-aware agents

This paper describes the specification and implementation of a new three-layer time-aware agent architecture. This architecture is designed for applications and environments where societies of humans and agents play equally active roles, but interact and operate in completely different time frames. The architecture consists of three layers: the April real-time run-time (ART) layer, the time aware layer (TAL), and the application agents layer (AAL). The ART layer forms the underlying real-time agent platform. An original online, real-time, dynamic priority-based scheduling algorithm is described for scheduling the computation time of agent processes, and it is shown that the algorithm's O(n) complexity and scalable performance are sufficient for application in real-time domains. The TAL layer forms an abstraction layer through which human and agent interactions are temporally unified, that is, handled in a common way irrespective of their temporal representation and scale. A novel O(n2) interaction scheduling algorithm is described for predicting and guaranteeing interactions' initiation and completion times. The time-aware predicting component of a workflow management system is also presented as an instance of the AAL layer. The described time-aware architecture addresses two key challenges in enabling agents to be effectively configured and applied in environments where humans and agents play equally active roles. It provides flexibility and adaptability in its real-time mechanisms while placing them under direct agent control, and it temporally unifies human and agent interactions.     

A comparative study of DPSK and OOK WDM transmission over transoceanic distances and their performance degradations due to nonlinear phase noise

We have compared experimentally the transmission performance of return-to-zero differential phase-shift keying (RZ-DPSK) with RZ-ON-OFF keying (OOK), nonreturn-to-zero differential phase-shift keying (NRZ-DPSK), and NRZ-OOK for 100/spl times/10-Gb/s transmission with a spectral efficiency of 0.22 b/s/Hz over transoceanic distances. The Q degradation of the RZ-DPSK after transmission over 9180 km was 3 dB greater than that of RZ-OOK. The experimental results clearly showed the major cause of degradation for DPSK is not cross-phase modulation but self-phase modulation. The calculated nonlinear phase noise, i.e., the Gordon-Mollenauer effect, agreed with the experimental results. A distributed-Raman-amplifier assisted erbium-doped-fiber-amplified transmission line acted well in reducing the nonlinear phase noise.     

Magnetic Properties of Fe-Doped Rutile

Ball-milling method was applied to dissolve Fe into titanium dioxide (TiO₂). X-ray diffraction indicated the starting anatase changed to a rutile-type structure with oxygen deficiency after ball milling. Transmission electron microscopy and X-ray absorption experiments were conducted to examine the possible existence of magnetic impurities in the ball-milled powders after they were leached in HCl solutions. Temperature dependence of the resistivity shows semiconducting behavior and the magnetic hysteresis loops at 5 and 300 K exhibit ferromagnetic characteristics. Fe-doped TiO₂ films were also prepared by pulsed laser deposition. The magnetic properties of the films are discussed.     

实时GPS定位中的自适应故障检测

给出了一种GPS卡尔曼滤波的自适应方案,该方案能根据GPS导航中变化的动态来估计协方差.当增强卡尔曼滤波器时,方案可得到更精确的定位修正.此外,也可将此估计方法用于完整监测,以增强故障检测的阈值选择.采用模拟数据验证了提出方法的正确性.