移动式宽频带高产额中子发生器

多用途中子发生器有着广阔的市场和应用领域 ,文章对移动式宽频带高产额中子发生器 ,在设计制造过程中所涉及到的技术难点 :绝缘尺寸小、频率适应范围宽、为中子管提供靶压的高压负载特性好等作了技术分析 ,使多用途中子发生器在更广阔的范围内应用 ,提供了广阔前景。     

参数化图形库技术

本文论述了参数化图形库的实现原理，建立了以尺寸叠加算法为基础的参数化图形库开发工具，利用这种开发工具建立的图形数据可以由数据库管理，方便有效。     

无机高分子絮凝剂聚硫酸铁合成条件的研究

实验研究了以工业硫酸亚铁及废硫酸为原料,分别采用NaClo_3、KClO_3、H_2O_2及(o_2+NaNO_2)为氧化剂成聚硫酸铁的条件。在以(O_2+NaNO_2)为氧化剂的合成过程中,发现添加微量助催化剂(型号为HG-1、HG-2和HG-3),对提高合成速度及反应过程的稳定性具有重大作用。     

CA／PAN中空纤维血浆分离膜的结构与性能

本研究以CA及PAN的共混溶液,通过干-湿法纺丝制取中空纤维,利用共混高聚物各组分在凝固剂中相分离速度的差异,形成具有稳定结构的中空纤维孔膜,该膜用于分离血液中的血浆成分具有良好效果。讨论了成型条件及添加剂等对膜结构、性能的影响,用SEM及图相分析仪、MAP压汞仪及DSC等分析手段,对膜的微孔结构、形态、孔尺寸及中空纤维膜的血浆通量和水通量等进行了系统的考查。     

银狐皮毛被及皮板组织构造的研究

用光学显微镜和扫描电镜观察了国产人工饲养银狐的毛被和皮板组织构造 ,测定了毛的长度、细度、密度、毛的鳞片高度和皮板厚度。提供了毛和皮板组织学图片 15幅。     

Interfacial segregation of Ti in the brazing of diamond grits onto a steel substrate using a Cu-Sn-Ti brazing alloy

Diamond grits were brazed onto a steel substrate using a prealloyed Cu-10Sn-15Ti (wt pct) brazing alloy at 925 °C and 1050 °C. Due to the relatively high concentration of Ti in the brazing alloy, the braze matrix exhibited a composite structure, composed of β-(Cu,Sn), a Cu-based solid solution, and various intermetallic compounds with different morphologies. The reaction of Ti with diamond yielded a continuous TiC layer on the surfaces of the diamond grits. On top of the TiC growth front, an intermetallic compound, composed of Sn and Ti, nucleated and grew into a randomly interwoven fine lacey structure. An interfacial structure developed as the interwoven fine lacey phase was semicoherently bonded to the TiC layer, with the Cu-based braze matrix filling its interstices. The thickness of such a composite layer was increased linearly with the square root of isothermal holding time at 925 °C, complying with the law of a diffusion-controlled process. However, at 1050 °C, the segregation behavior of Ti and Sn to the interfaces between the TiC layer and the braze matrix diminished, due to the increased solubility of Ti in the Cu-based liquid phase. The enhanced dissolution of Ti in the Cu-based liquid phase at 1050 °C also caused the precipitation of rod-like CuTi with an average diameter of about 0.2 μm during cooling. SnTi₃ was the predominant intermetallic compound and existed in three different forms in the braze matrix. It existed as interconnected grains of large size which either floated to the surface of the braze matrix or grew into faceted grains. It also exhibited a nail-like structure with a mean diameter of about 1 μm for the rod section and a lamellar structure arising from a eutectic reaction during cooling.     

新型高k栅介质材料研究进展

随着半导体技术的不断发展，MOSFET（metal-oxide-semiconductor field effect transistor）的特征尺寸不断缩小，栅介质等效氧化物厚度已小至nm数量级。这时电子的直接隧穿效应将非常显著，将严重影响器件的稳定性和可靠性。因此需要寻找新型高k介质材料，能够在保持和增大栅极电容的同时，使介质层仍保持足够的物理厚度来限制隧穿效应的影响。本文综述了研究高k栅介质材料的意义；MOS栅介质的要求；主要新型高k栅介质材料的最新研究动态；展望了高k介质材料今后发展的主要趋势和需要解决的问题。     

浅析2020年前美军事战略重点的转变--从装备发展看美国军事战略重点可能的变化

美国21世纪前期的军事战略重点将是争夺外空优势，夺取制天权和制信息权。分析了美国夺取外空优势的原因，及其为夺取外空优势在国家政策、航天发展和技术准备等方面采取的措施。     

编码解码芯片HD3-6408-9及其应用

编码解码芯片HD3 64 0 8 9是一种高性能的CMOS器件。这种大规模芯片主要由编码器和解码器两部分组成。在数据传输应用中 ,采用两个独立的单片机系统 ,利用编码解码芯片 (HD3 64 0 8 9)组成数字信号的接收、发送及显示部分来完成数据传输功能     

探讨缩聚催化剂对聚酯切片质量的影响

通过试验，分析比较了江西Sb2O3、南宁Sb2O3和大连Sb(Ac)3三种缩聚催化剂对聚酯切片质量的影响。试验结果表明，Sb(Ac)3是优良的缩聚催化剂。