Modeling and analysis of vias in multilayered integrated circuits

A method for modeling and analyzing vias the multilayered integrated circuits is presented. The model is based on microwave network theory. The whole via structure is divided into cascaded subnetworks, including a vertical via passing through different layers and transitions from the microstrip line and/or striplines to the vertical via. The parameters of each subnetwork are obtained from electromagnetic field analysis. Numerical results in the frequency domain and the time domain are presented. Validation of the model has been carried out by both measurements and finite-difference-time-domain (FDTD) modeling. The results show good agreement with the measurements in the frequency range for which the components of the experimental model are within specification. The time domain simulation results also agree well with the FDTD results     

A Linear Cross-Coupled Control System for High-Speed Machining

We present a linear cross-coupled controller to improve highspeed contouring accuracy independently of tracking accuracy in a biaxial machine tool feed drive servomechanism. Unlike conventional cross-coupled controllers, the cross-coupled controller presented here is a linear system, so it is very easy to perform the stability and steady-state error analysis, and to optimise the controller parameters. The proposed controller is evaluated experimentally on a CNC LOM machine and compared to an uncoupled controller and a conventional cross-coupled controller. Controller performance is evaluated for a circular contour at a feedrate of 30 m min _1 . The experimental results show that the proposed controller can greatly reduce the contour error at large feedrates. The linear cross-coupled controller is simple to implement and is practical.     

The influence of the fabrication process on the buckling of thin-walled steel box sections

Steel box sections are usually fabricated from flat plates which are welded at the corners. The welding process can introduce residual stresses and geometric imperfections into the sections which can influence their strength. For some thin-walled sections, large periodic geometric imperfections have been observed in manufactured sections. Subsequent investigations have indicated that the imperfections are in fact buckling deformations i.e. the box section has buckled due to welding residual stresses prior to any application of external load. The welding procedure and the behaviour of the box sections under load has been modelled using a finite element analysis that accounts for both geometric and material non-linearities. Tests have been carried out on box sections with a range of width to thickness ratios for the plate elements. Modelling has been shown to give good correlation with the test results. The conditions for buckling to take place as a result of the welding process have been established. A design method has been proposed.     

Systematic characterization of Cl2 reactive ion etchingfor improved ohmics in AlGaN/GaN HEMTs

Pre-metal-deposition reactive ion etching (RIE) was performed on an Al_0.3Ga_0.7N/AlN/GaN heterostructure in order to improve the metal-to-semiconductor contact resistance. An optimum AlGaN thickness for minimizing contact resistance was determined. An initial decrease in contact resistance with etching time was explained in terms of removal of an oxide surface layer and/or by an increase in tunnelling current with the decrease of the AlGaN thickness. The presence of a dissimilar surface layer was confirmed by an initial nonuniform etch depth rate. An increase in contact resistance for deeper etches was experienced. The increase was related to depletion of the two-dimensional (2-D) electron gas (2-DEG) under the ohmics. Etch depths were measured by atomic force microscopy (AFM). The contact resistance decreased from about 0.45 Ωmm for unetched ohmics to a minimum of 0.27 Ωmm for 70 Å etched ohmics. The initial thickness of the AlGaN layer was 250 Å. The decrease in contact resistance, without excessive complications on device processing, supports RIE etching as a viable solution to improve ohmic contact resistance in AlGaN/GaN HEMTs     

斗晏水电站混凝土面板堆石坝趾板设计

阐述了江西省重点建设项目斗晏水电站混凝土面板堆石趾板设计，并重点介绍较大断层上趾板设计处理方式。     

苯磺隆干悬浮剂技术浅析

通过对苯磺隆干悬浮剂项目的研究,进一步了解干悬浮剂的加工工艺和配方中各种助剂的相互作用;剖析助剂对主要技术指标的影响。     

High-resolution electron microscopy of the twinning and intergrowth in Ca4Al6SO16 and Ca3SrAl6SO16

The microstructures of unhydrated calcium aluminosulphate Ca₄Al₆SO₁₆ and Ca₃SrAl₆SO₁₆ have been studied by high-resolution electron microscopy (HREM). The results showed that twinning and twinned slabs could be introduced taking the [1 1 2] direction as the twin axis so that it seems to be coincident with the law of twinning formed in body-centred cubic structures. A previously reported superlattice with a repeat period twice that of the fundamental structure along the 〈1 1 0〉 direction has also been found in both matrix and twin variants. The close intergrowth of Ca₃SrAl₆SO₁₆ and another phase, possibly Sr₃Al₂O₆ existing as an inclusion between these two twin variants, was determined and clearly revealed by electron diffraction and HREM images. The coherent interphase boundaries and orientation relationship between them can also be deduced.     

A Note on PIN Polynomials and PRIN Rational Functions

This brief presents a necessary and sufficient condition for testing positive, real, imaginary, and negative rational functions. A related term, the positive, imaginary, and negative polynomial, is defined and two necessary and sufficient conditions for testing it are given.