Optimal mean-square prediction of the mobile-radio fading envelope

Long-range prediction of the mobile-radio fading envelope is an enabling technology for many fading compensation approaches. Because the fading envelope is well modeled as a bandlimited process, it has special predictability properties. In this paper, we find a linear predictor that is optimal in the mean-square sense when the predictor impulse response is energy constrained. This solution may be used to determine the minimum mean squared error of a prediction based on past values that are corrupted with estimation errors.     

Optical intensity-modulated direct detection channels: signal space and lattice codes

Traditional approaches to constructing constellations for electrical channels cannot be applied directly to the optical intensity channel. This work presents a structured signal space model for optical intensity channels where the nonnegativity and average amplitude constraints are represented geometrically. Lattice codes satisfying channel constraints are defined and coding and shaping gain relative to a baseline are computed. An effective signal space dimension is defined to represent the precise impact of coding and shaping on bandwidth. Average optical power minimizing shaping regions are derived in some special cases. Example lattice codes are constructed and their performance on an idealized point-to-point wireless optical link is computed. Bandwidth-efficient schemes are shown to have promise for high data-rate applications, but require greater average optical power.     

A fuzzy logic based-method for prognostic decision making in breast and prostate cancers

Accurate and reliable decision making in oncological prognosis can help in the planning of suitable surgery and therapy, and generally, improve patient management through the different stages of the disease. In recent years, several prognostic markers have been used as indicators of disease progression in oncology. However, the rapid increase in the discovery of novel prognostic markers resulting from the development in medical technology, has dictated the need for developing reliable methods for extracting clinically significant markers where complex and nonlinear interactions between these markers naturally exist. The aim of this paper is to investigate the fuzzy k-nearest neighbor (FK-NN) classifier as a fuzzy logic method that provides a certainty degree for prognostic decision and assessment of the markers, and to compare it with: 1) logistic regression as a statistical method and 2) multilayer feedforward backpropagation neural networks an artificial neural-network tool, the latter two techniques having been widely used for oncological prognosis. In order to achieve this aim, breast and prostate cancer data sets are considered as benchmarks for this analysis. The overall results obtained indicate that the FK-NN-based method yields the highest predictive accuracy, and that it has produced a more reliable prognostic marker model than both the statistical and artificial neural-network-based methods.     

Spontaneous and stimulated emission from CdxHg1−x Te semiconductor films

The experimental data on observation of spontaneous and stimulated emission from thin epitaxial Cd_xHg_1?x Te films optically pumped by Nd: YAG laser radiation are reported. A simple theoretical model is suggested to describe the initiation of population inversion under these conditions. The parameters realized under the experimental conditions are theoretically estimated.     

Exposed Die-Top Encapsulation Molding for an Improved High- Performance Flip Chip BGA Package

The recent advancement in high- performance semiconductor packages has been driven by the need for higher pin count and superior heat dissipation. A one-piece cavity lid flip chip ball grid array (BGA) package with high pin count and targeted reliability has emerged as a popular choice. The flip chip technology can accommodate an I/O count of more than five hundreds500, and the die junction temperature can be reduced to a minimum level by a metal heat spreader attachment. None the less, greater expectations on these high-performance packages arose such as better substrate real estate utilization for multiple chips, ease in handling for thinner core substrates, and improved board- level solder joint reliability. A new design of the flip chip BGA package has been looked into for meeting such requirements. By encapsulating the flip chip with molding compound leaving the die top exposed, a planar top surface can be formed. A, and a flat lid can then be mounted on the planar mold/die top surface. In this manner the direct interaction of the metal lid with the substrate can be removed. The new package is thus less rigid under thermal loading and solder joint reliability enhancement is expected. This paper discusses the process development of the new package and its advantages for improved solder joint fatigue life, and being a multichip package and thin core substrate options. Finite-element simulations have been employed for the study of its structural integrity, thermal, and electrical performances. Detailed package and board-level reliability test results will also be reported     

Global stability of Internet congestion controllers with heterogeneous delays

In this paper, we study the problem of designing globally stable, scalable congestion control algorithms for the Internet. Prior work has primarily used linear stability as the criterion for such a design. Global stability has been studied only for single node, single source problems. Here, we obtain conditions for a general topology network accessed by sources with heterogeneous delays. We obtain a sufficient condition for global stability in terms of the increase/decrease parameters of the congestion control algorithm and the price functions used at the links.     

Improving narrow bandgap a-SiGe:H alloys grown by hot-wire chemical vapor deposition

We have improved the electronic properties of narrow-bandgap (Tauc gap below 1.5 eV) amorphous-silicon germanium alloys (a-SiGe:H) grown by hot-wire chemical vapor deposition (HWCVD) by lowering the substrate temperature and deposition rate. Prior to this work, we were unable to grow a-SiGe:H alloys with bandgaps below 1.5 eV that had photo-to-dark conductivity ratios comparable with our plasma-enhanced CVD (PECVD) grown materials [B.P. Nelson et al., Mater. Res. Soc. Symp. 507 (1998) 447]. Decreasing the filament diameter from our standard configuration of 0.5 mm to 0.38 or 0.25 mm provides first big improvements in the photoresponse of these alloys. Lowering the substrate temperature from our previous optimal temperatures (T_sub starting at 435 °C) to at 250 °C provides additional photo-to-dark conductivity ratio increasing by two orders of magnitude for growth conditions containing 20–30% GeH₄ in the gas phase (relative to the total GeH₄+SiH₄ flow).