Atomistic simulations of the solubilization of single-walled carbon nanotubes in toluene

Solubilization of the armchair, metallic (10,10) single-walled carbon nanotubes (SWCNTs) in toluene is modeled using molecular dynamics simulations. Inter- and intra-molecular atomic interactions in the SWCNT + toluene system are represented using COMPASS (Condensed-phased Optimized Molecular Potential for Atomistic Simulation Studies), the first ab initio forcefield that enables an accurate and simultaneous prediction of various gas-phase and condensed-phase properties of organic and inorganic materials.The results obtained show that due to a significant drop in the configurational entropy of toluene, the solvation Gibbs free energy for these nanotubes in toluene is small but positive suggesting that a suspension of these nanotubes in toluene is not stable and that the nanotubes would fall out of the solution. This prediction is consistent with experimental observations.     

A new colloidal precursor cooperative conversion route to nanocrystalline quaternary copper sulfide

A novel milk-like Cu-thiourea colloid has been synthesized. Nanocrystalline quaternary copper sulfide Cu₂FeSnS₄ was obtained through the Cu-thiourea colloidal precursor cooperative conversion route at low temperature. The samples were characterized by means of X-ray powder diffraction, transmission electron microscopy, scanning electron microscopy, inductively coupled plasma atomic emission spectroscopy, and X-ray energy dispersive spectroscopy techniques. The reaction details and features were described and discussed.     

Silicon-to-steel bonding using rapid thermal annealing

This paper presents the rapid, low-temperature bonding between silicon and steel using the rapid thermal annealing process. Three different thin-film adhesion layer systems including silver, gold, and nickel were utilized as the intermediate bonding material to assist the eutectic Pb/Sn bonding between silicon and steel. The bonding temperature was set at 220/spl deg/C for 20 s, with a 20-s ramp-up time. Five experiments were conducted to determine the strength of the bond, including static tensile and compressive four-point bend tests, axial extension tests, tensile bending fatigue tests, and corrosion resistance tests. The test results have shown that the gold adhesion layer is the most robust, demonstrating minimal creep during fatigue tests, no delamination during the tensile or compressive four-point bend tests, and acceptable strength during the axial extension tests. Additionally, all adhesion layers have withstood four months of submersion in various high-temperature solutions and lubricants without failure. Simulations of the axial stresses and strains that developed during the four-point bend and axial extension tests were performed and showed that the presence of the silicon die provides a local reinforcement of the bond as observed in the experimental tests.     

Nanoscale structural characteristics and electron field emission properties of transition metal–fullerene compound TiC60 films

Transition-metal compound TiC₆₀ thin films were grown by co-deposition from two separated sources of fullerene C₆₀ powder and titanium. Study of structural properties of the films, by Raman spectroscopy, atomic force microscopy, and scanning tunneling spectroscopy reveals that the films have a deformed C₆₀ structure with certain amount of sp³ bonds and a rough surface with a large number of nanoclusters. z–V tunnelling spectroscopic measurements suggest that several charge transport mechanisms are involved in as the tip penetrates into the thin film. Conventional field electron emission (FEE) measurements show a high emission current density of 10 mA/cm² and a low turn-on field less than 8 V/μm, with the field enhancement factors being 659 and 1947 for low-field region and high-field region, respectively. By exploiting STM tunneling spectroscopy, local FEE on nanometer scale has also been characterized in comparison with the conventional FEE. The respective field enhancement factors are estimated to be 99–355 for a gap varying from 36 to 6 nm. The enhanced FEE of TiC₆₀ thin films can be ascribed to structural variation of C₆₀ in the films and the electrical conducting paths formed by titanium nanocrystallites embedded in C₆₀ matrix.     

棉织物手感值的模糊综合评判研究

利用模糊综合评判数学模型对棉织物的手感值进行了计算与分析，这种方法简单、可靠，与主观评估结果有很好的一致性，为纺织生产的质量判断提供了便利。     

矩形垂直筛板的流体力学性能研究

在600mm的有机玻璃冷模塔中,用水-空气体系测定矩形垂直筛板的塔板压降、漏液和雾沫夹带等流体力学性能,确定了合理的塔板结构,使其具有较高的气液通量和较宽的操作范围,空塔动能因子最大可达3.0kg1/2(m1/2.s)-1,液流强度可达21.6m3/(m.h)。并对不同气液流量下塔板的流体力学实验数据进行关联和分析,得出了矩形垂直筛板的干板压降计算关联式以及漏液率随液流强度和空塔动能因子的变化关系,为矩形垂直筛板的设计提供了依据。与新垂直筛板相比,矩形垂直筛板具有更低的塔板压降。     

3-D MCM封装技术及其应用

介绍了超大规模集成电路（VLSI）用的3-D MCM封装技术的最新发展，重点介绍了3-D MCM封装垂直互连工艺，分析了3-D MCM封装技术的硅效率、复杂程度、热处理、互连密度、系统功率与速度等问题，并对3-D MCM封装的应用作了简要说明。