Wearable Force Touch Sensor Array Using a Flexible and Transparent Electrode

Transparent electrodes have been widely used for various electronics and optoelectronics, including flexible ones. Many nanomaterial‐based electrodes, in particular 1D and 2D nanomaterials, have been proposed as next‐generation transparent and flexible electrodes. However, their transparency, conductivity, large‐area uniformity, and sometimes cost are not yet sufficient to replace indium tin oxide (ITO). Furthermore, the conventional ITO is quite rigid and susceptible to mechanical fractures under deformations (e.g., bending, folding). In this study, the authors report new advances in the design, fabrication, and integration of wearable and transparent force touch (touch and pressure) sensors by exploiting the previous efforts in stretchable electronics as well as novel ideas in the transparent and flexible electrode. The optical and mechanical experiment, along with simulation results, exhibit the excellent transparency, conductivity, uniformity, and flexibility of the proposed epoxy‐copper‐ITO (ECI) multilayer electrode. By using this multi‐layered ECI electrode, the authors present a wearable and transparent force touch sensor array, which is multiplexed by Si nanomembrane p‐i‐n junction‐type (PIN) diodes and integrated on the skin‐mounted quantum dot light‐emitting diodes. This novel integrated system is successfully applied as a wearable human–machine interface (HMI) to control a drone wirelessly. These advances in novel material structures and system‐level integration strategies create new opportunities in wearable smart displays.     

Biodegradable Polyanhydrides as Encapsulation Layers for Transient Electronics

Bioresorbable electronic systems represent an emerging class of technology of interest due to their ability to dissolve, chemically degrade, disintegrate, and/or otherwise physically disappear harmlessly in biological environments, as the basis for temporary implants that avoid the need for secondary surgical extraction procedures. Polyanhydride‐based polymers can serve as hydrophobic encapsulation layers for such systems, as a subset of the broader field of transient electronics, where biodegradation eventually occurs by chain scission. Systematic experimental studies that involve immersion in phosphate‐buffered saline solution at various pH values and/or temperatures demonstrate that dissolution occurs through a surface erosion mechanism, with little swelling. The mechanical properties of this polymer are well suited for use in soft, flexible devices, where integration can occur through a mold‐based photopolymerization technique. Studies of the dependence of the polymer properties on monomer compositions and the rates of permeation on coating thicknesses reveal some of the underlying effects. Simple demonstrations illustrate the ability to sustain operation of underlying biodegradable electronic systems for durations between a few hours to a week during complete immersion in aqueous solutions that approximate physiological conditions. Systematic chemical, physical, and in vivo biological studies in animal models reveal no signs of toxicity or other adverse biological responses.     

Secure Multi-hop Data Transmission in Cognitive Radio Networks Under Attack in the Physical Layer

Wireless Personal Communications - Cognitive radio networks (CRNs) have a shortcoming in that attackers can increase their ability to disturb secondary users (SUs). This paper focuses on jamming...     

Mechanical reliability of Sn-rich Au–Sn/Ni flip chip solder joints fabricated by sequential electroplating method

In this study, we evaluated the mechanical reliability of Sn-rich, Au–Sn/Ni flip chip solder bumps by using a sequential electroplating method with Sn and Au. After reflowing, the average diameter of the solder bump was approximately 80 μm and only a (Ni,Au)₃Sn₄ intermetallic compound (IMC) layer was formed at the interface. Due to the preferential consumption of Sn atoms within the solder matrix during aging, the solder matrix was transformed sequentially in the following order: β-Sn and η-phase, η-phase, and η-phase and ε-phase. In the bump shear test, the shear force was not significantly changed despite aging at 150 °C for 1000 h and most of the fractures occurred at the interfaces. The interfacial fracture was significantly related to the formation of brittle IMCs at the interface. The Sn-rich, Au–Sn/Ni flip chip joint was mechanically much weaker than the Au-rich, Au–Sn/Ni flip chip joint. The study results demonstrated that the combination of Sn-rich, Au–Sn solder and Ni under bump metallization (UBM) is not a viable option for the replacement of the conventional, Au-rich, Au–20Sn solder.     

A 0.25-/spl mu/m CMOS quad-band GSM RF transceiver using an efficient LO frequency plan

This paper describes a single-chip CMOS quad-band (850/900/1800/1900 MHz) RF transceiver for GSM/GPRS applications. It is the most important design issue to maximize resource sharing and reuse in designing the multiband transceivers. In particular, reducing the number of voltage-controlled oscillators (VCOs) required for local oscillator (LO) frequency generation is very important because the VCO and phase-locked loop (PLL) circuits occupy a relatively large area. We propose a quad-band GSM transceiver architecture that employs a direct conversion receiver and an offset PLL transmitter, which requires only one VCO/PLL to generate LO signals by using an efficient LO frequency plan. In the receive path, four separate LNAs are used for each band, and two down-conversion mixers are used, one for the low bands (850/900 MHz) and the other for the high bands (1800/1900 MHz). A receiver baseband circuit is shared for all four bands because all of their channel spaces are the same. In the transmit path, most of the building blocks of the offset PLL, including a TX VCO and IF filters, are integrated. The quad-band GSM transceiver that was implemented in 0.25-/spl mu/m CMOS technology has a size of 3.3/spl times/3.2 mm/sup 2/, including its pad area. From the experimental results, we found that the receiver provides a maximum noise figure of 2.9 dB and a minimum IIP3 of -13.2dBm for the EGSM 900 band. The transmitter shows an rms phase error of 1.4/spl deg/ and meets the GSM spectral mask specification. The prototype chip consumes 56 and 58 mA at 2.8 V in the RX and TX modes, respectively.     

Reverse short channel effects in high-k gated nMOSFETs

Anomalous threshold voltage roll-up behavior, commonly referred as reverse short channel effect (RSCE), has been observed in high-k (HfO₂ on SiON buffer, Al₂O₃ on SiON buffer) gated submicron nMOSFETs, while the SiO₂ or SiON control samples show normal short channel effect (SCE) behavior. The possible causes such as inhomogeneous channel doping profile and gate oxide thickness variation near S/D ends have been ruled out. The results indicate that interface trap density that dependents on channel length is the main cause of the RSCE observed here. In addition, oxide charge also plays a role.     

Few‐Layered WS2 Nanoplates Confined in Co,N‐Doped Hollow Carbon Nanocages: Abundant WS2 Edges for Highly Sensitive Gas Sensors

Edges of 2D transition metal dichalcogenides (TMDs) are well known as highly reactive sites, thus researchers have attempted to maximize the edge site density of 2D TMDs. In this work, metal‐organic framework (MOF) templates are introduced to synthesize few‐layered WS₂ nanoplates (a lateral dimension of ≈10 nm) confined in Co, N‐doped hollow carbon nanocages (WS₂_Co‐N‐HCNCs), for highly sensitive NO₂ gas sensors. WS₂ precursors are assembled in the surface cavity of Co‐based zeolite imidazole framework (ZIF‐67) and subsequent pyrolysis produced WS₂_Co‐N‐HCNCs. During the pyrolysis, the carbonized ZIF‐67 are doped by Co and N elements, and the growth of WS₂ is effectively suppressed, creating few‐layered WS₂ nanoplates functionalized Co‐N‐HCNCs. The WS₂_Co‐N‐HCNCs exhibit outstanding NO₂ sensing characteristics at room temperature, in terms of response (48.2% to 5 ppm), selectivity, response and recovery speed, and detection limit (100 ppb). These results are attributed to the enhanced adsorption and desorption kinetics of NO₂ on abundant WS₂ edges, confined in the gas permeable HCNCs. This work opens up an efficient way for the facile synthesis of edge abundant few‐layered TMDs combined with porous carbon matrix via MOF templating route, for applications relying on highly active sites.     

Low-Loss Polymer-Based Long-Range Surface Plasmon-Polariton Waveguide

To improve the propagation loss of polymer-based long-range surface-plasmon-polariton (LR-SPP) waveguide devices at the telecom wavelength range, low-loss LR-SPP waveguides were fabricated in an ultraviolet-curable acrylate polymer with a low refractive index and absorption loss. A propagation loss of 1.72 dB/cm at a wavelength of 1.55 mum was achieved with a 14-nm-thick and 3-mum-wide metal stripe.     

Effect of displacement rate on ball shear properties for Sn–37Pb and Sn–3.5Ag BGA solder joints during isothermal aging

The interfacial reactions and ball shear properties of ball grid array (BGA) solder joints aged at 170 °C for up to 21 days were investigated with different displacement rates. Two different kinds of solders, Sn–37Pb and Sn–3.5Ag (all wt.%), and an electroplated Ni/Au BGA substrate were employed in this work. A continuous Ni₃Sn₄ intermetallic compound (IMC) layer was formed at the interfaces between both the Sn–37Pb and Sn–3.5Ag solders and the substrate during reflow. After aging, two different reaction layers, consisting of (Au_xNi_1−x)Sn₄ IMC and Pb-rich phase, were additionally observed between the Sn–37Pb solder and the Ni₃Sn₄ IMC layer. The thicknesses of these interfacial reaction layers increased with increasing aging time. After reflow, all the fractures occurred inside the bulk solder. The fracture location of the Sn–37Pb solder joints was shifted toward the solder/Ni interface with increasing aging time and displacement rate, whereas the fracture of the Sn–3.5Ag solder joints mainly occurred inside the bulk solder, irrespective of the aging time and displacement rate. Consequently, the shear properties of the Sn–37Pb solder joints significantly decreased with increasing aging time, whereas those of the Sn–3.5Ag solder joints slightly decreased. The tendency toward brittle fracture of the Sn–37Pb solder joints was intensified with increasing displacement rate. The shear properties of the ductile solder joints increased with increasing displacement rate, while the displacement until fracture, deformation energy and displacement rate sensitivity of the brittle solder joints significantly decreased with increasing displacement rate.     

Enhanced thermal stability of a sputtered titanium-nitride film as a diffusion barrier for capacitor-bottom electrodes

The effect of a thin RuO_x layer formed on the Ru/TiN/doped poly-Si/Si stack structure was compared with that on the RuO_x/TiN/doped poly-Si/Si stack structure over the post-deposition annealing temperature ranges of 450–600°C. The Ru/TiN/poly-Si/Si contact system exhibited linear behavior at forward bias with a small increase in the total resistance up to 600°C. The RuO_x/TiN/poly-Si/Si contact system exhibited nonlinear characteristics under forward bias at 450°C, which is attributed to no formation of a thin RuO_x layer at the RuO_x surface and porous-amorphous microstructure. In the former case, the addition of oxygen at the surface layer of the Ru film by pre-annealing leads to the formation of a thin RuO_x layer and chemically strong Ru-O bonds. This results from the retardation of oxygen diffusion caused by the discontinuity of diffusion paths. In particular, the RuO_x layer in a nonstoichiometric state is changed to the RuO₂-crystalline phase in a stoichiometric state after post-deposition annealing; this phase can act as an oxygen-capture layer. Therefore, it appears that the electrical properties of the Ru/TiN/poly-Si/Si contact system are better than those of the RuO_x/TiN/poly-Si/Si contact system.