Optical assessment of silicon nanowire arrays fabricated by metal-assisted chemical etching

Silicon nanowire (SiNW) arrays were prepared on silicon substrates by metal-assisted chemical etching and peeled from the substrates, and their optical properties were measured. The absorption coefficient of the SiNW arrays was higher than that for the bulk silicon over the entire region. The absorption coefficient of a SiNW array composed of 10-μm-long nanowires was much higher than the theoretical absorptance of a 10-μm-thick flat Si wafer, suggesting that SiNW arrays exhibit strong optical confinement. To reveal the reason for this strong optical confinement demonstrated by SiNW arrays, angular distribution functions of their transmittance were experimentally determined. The results suggest that Mie-related scattering plays a significant role in the strong optical confinement of SiNW arrays.     

Effects of Solvents in the Polyethylene Glycol Series on the Bonding of Copper Joints Using Ag2O Paste

The effects of reducing solvents on the bonding process using silver oxide paste in a copper joint were investigated. Three solvent types were tested: diethylene glycol (DEG), triethylene glycol (TEG), and polyethylene glycol (PEG). The strength of the joints was assessed by fracturing, which occurred at the interface of the copper oxide layer and the copper substrate in DEG and TEG samples and at the bonded interface in the PEG sample. Analysis of the samples revealed that, in the DEG and TEG samples, the copper substrate was oxidized during the bonding process, which compromised the shear strength of the joints. In contrast, the PEG sample exhibited nonuniform sintering of the silver layer while retaining good shear strength. It was found that the combination of DEG and PEG produced optimum shear strength in the copper joint, as PEG suppressed the growth of copper oxide and DEG promoted the formation of a dense sintered silver layer. The bonding strength achieved was higher than that of the gold-to-gold joint made using standard Pb-5Sn solder.     

Delamination growth mechanisms in woven glass fiber reinforced polymer composites under Mode II fatigue loading at cryogenic temperatures

The purpose of this research is to characterize the cryogenic delamination growth behavior in woven glass fiber reinforced polymer (GFRP) composite laminates subjected to Mode II fatigue loading. Mode II fatigue delamination tests were performed at room temperature, liquid nitrogen temperature (77 K) and liquid helium temperature (4 K) using the four-point bend end-notched flexure (4ENF) test method, and the delamination growth rate data for the woven GFRP laminates were obtained. The energy release rate range was determined by the finite element method. Microscopic examinations of the specimen sections and fracture surfaces were also carried out. The present results are discussed to obtain an understanding of the fatigue delamination growth mechanisms in the woven GFRP laminates under Mode II loading at cryogenic temperatures.     

Moving pick‐up‐type contactless power transfer systems and their efficiency using series and parallel resonant capacitors

The equivalent circuit, the efficiency, and the important characteristics of moving pick‐up type contactless power transfer systems are described. If the primary series capacitor and the secondary parallel capacitors are chosen correctly and the winding resistances are ignored, the equivalent circuit of the transformer with these capacitors becomes the same as an ideal transformer at the resonant frequency. This simple approximation helps to understand the phenomena occurring with load changes. Because the circuit analysis becomes simple, the approximate value of the power transfer efficiency can be derived. This paper describes the determination of the capacitor values, the derivation of the equivalent circuit and the efficiency, and test results. © 2010 Wiley Periodicals, Inc. Electr Eng Jpn, 172(2): 47–54, 2010; Published online in Wiley InterScience ( www.interscience.wiley.com ). DOI 10.1002/eej.20970     

Suppression of creep cavitation in precipitation-hardened austenitic stainless steel to enhance creep rupture strength

Extensive creep cavitation in Ti, Nb and Cu containing precipitation hardened austenitic steels was found to limit the usefulness of deformation resistance to increase long-term creep rupture strength. The steels were microalloyed with boron and cerium that resulted in increase in creep rupture strength and ductility of the steels significantly. Grain boundary sliding and creep cavity nucleation and growth in the steels were suppressed greatly on microalloying. Auger spectroscopic analysis revealed the segregation of boron instead of sulfur on cavity surface and the absence of sulfur contamination of grain boundary upon the microalloying. Suppression of creep cavitation through the control of trace elements segregation along with the precipitation hardening increased the creep rupture strength of austenitic stainless steels.     

Colorless polyimides derived from 1S,2S,4R,5R-cyclohexanetetracarboxylic dianhydride,self-orientation behavior during solution casting,and their optoelectronic applications

A novel cycloaliphatic monomer for polyimides (PI), 1S,2S,4R,5R-cyclohexanetetracarboxylic dianhydride (H′-PMDA) is proposed in this work. H′-PMDA shows high polymerizability with various diamines in contrast to its isomer, i.e., conventional hydrogenated pyromellitic dianhydride (H-PMDA) and leads to highly flexible and colorless PI films with very high T_g's. In particular, the combinations with rigid structures of diamines give rise to PIs with significantly decreased coefficients of thermal expansion (CTE) owing to high extents of in-plane chain orientation induced by thermal imidization, whereas the H-PMDA-based counterparts do not. The decreased CTE reflects structural rigidity/linearity of the H′-PMDA-based diimide units as supported by liquid crystallinity observed in the corresponding model compound. Solution casting of a chemically imidized PI derived from H′-PMDA and 2,2′-bis(trifluoromethyl)benzidine (TFMB) results in a lower CTE than that of the thermally imidized counterpart, suggesting the presence of a self-orientation phenomenon during solvent evaporation. The mechanism is proposed in this work. H′-PMDA/TFMB and its copolymer systems can be useful as plastic substrates in image display devices and/or novel coating-type optical compensation films.     

Molecular structures of gellan gum imaged with atomic force microscopy (AFM) in relation to the rheological behavior in aqueous systems in the presence of sodium chloride

Aqueous solutions of gellan gum with comparable molecular mass but with different acyl contents were investigated by atomic force microscopy and rheological measurements in the presence of sodium chloride (NaCl). Results obtained were discussed in relation to our previous report using potassium chloride (KCl) as an added salt. For a low-acyl sample, continuous fibrous network structures were identified microscopically as in the case of KCl. The network structures were more heterogeneous than those formed with KCl in terms of the height distribution of molecular assemblies. Rheological thermal hysteresis between sol–gel transitions was detected as in the case of KCl. The storage modulus (G′) of the gelled system was ca. 15% of the corresponding data with KCl at 20 °C. For a high-acyl sample, no continuous network structures were identified but branches with observable ends were identified as in the case of KCl. The hysteresis was less evident than the corresponding data with KCl and for the low-acyl sample with NaCl. Also, G′ values at 20 °C were ca. 30% and 20% of the corresponding data with KCl and for the low-acyl sample with NaCl, respectively. Continuousness and homogeneity of network structures related to the hysteresis and elasticity of the system, respectively.     

Characteristics of fluoride adsorption onto aluminium(III) and iron(III) hydroxide flocs

The fluoride adsorption onto the hydroxide flocs of Al(III), Fe(III), or a mixture of the two was studied. The optimum pH was influenced by the flocs’ solubility and surface charge. Although the Al(III) hydroxide flocs had a maximum adsorption capacity at the equilibrium concentration of 8 mg-F/L, the two-stage adsorption process revealed that the mixture of the Al(III) and Fe(III) hydroxide flocs required the smallest adsorbent dose as the concentration changed from 40 to 8 mg-F/L. Thus, the simultaneous dosing of Al(III) and Fe(III) combined with a two-stage adsorption process appears to be an effective option for fluoride removal.